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9-Mbit (256K x 36/512K x 18) Pipelined SRAM CY7C1360C CY7C1362C Cypress Semiconductor Corpora tion • 198 Champion Cou rt • San Jose , CA 95134-1 709 • 408-943-2 600 Document #: 38-05540 Rev .
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 2 of 31 . Selection Guide 250 MHz 200 MHz 166 MHz Unit Maximum Access T ime 2.8 3.0 3.5 ns Maximum Operating Curren t 250 220 180 mA Maximum CMOS.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 3 of 31 Pin Configurations A A A A A 1 A 0 NC/72M NC/36M V SS V DD NC/18M A A A A A A A A DQP B DQ B DQ B V DDQ V SSQ DQ B DQ B DQ B DQ B V SSQ V.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 4 of 31 Pin Configurations (continued) A A A A A 1 A 0 NC/72M NC/36M V SS V DD NC/18M NC A A A A A A A DQP B DQ B DQ B V DDQ V SSQ DQ B DQ B DQ B.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 5 of 31 Pin Configurations (continued) 234 5 67 1 A B C D E F G H J K L M N P R T U V DDQ NC/288M NC/144M DQP C DQ C DQ D DQ C DQ D AA A A ADSP V.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 6 of 31 Pin Configurations (continued) 165-Ball FBGA Pinout (3 Chip Enable with JT AG) CY7C1360C (256 K x 36) 234 56 7 1 A B C D E F G H J K L M .
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 7 of 31 Pin Definitions Name I/O Description A 0 , A 1 , A Input- Synchronous Address In puts used to select one of the add ress locations . Sample d at the rising edge of the CLK if ADSP or ADSC is active LOW , and CE 1 , CE 2 , and CE 3 [2] are sampled active.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 8 of 31 Functional Overview All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 9 of 31 conducted, the data presented to the DQs is written into the corresponding address location i n the memory core. If a Byte Write is conducted, only the se lected byte s are written. Bytes not selected during a Byte Write operation will remain unaltered.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 10 of 31 READ Cycle, Begin Burst External L H L L H L X H L L-H Q READ Cycle, Begin Burst External L H L L H L X H H L-H T ri-St a te READ Cycle,.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 1 1 of 31 IEEE 1 149.1 Serial Boundary Sc an (JT AG) The CY7C1360C/CY7C1362C incorpora tes a serial boundary scan test access port (T AP) in the BGA package only . The TQFP package does not offer this functionality .
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 12 of 31 T AP Controller Block Diagram Performing a T AP Reset A RESET is performed by forcing TMS HIGH (V DD ) for five rising edges of TCK. This RESE T does not affect the operation of the SRAM and may be performed while the SRAM is operating.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 13 of 31 IDCODE The IDCODE instruction causes a ven dor-specific, 32-bit code to be loaded into the instruction re gister .
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 14 of 31 3.3V T AP AC T est Conditions Input pulse levels ............... .............. .............. ..... V SS to 3.3V Input rise and fall times ......... .............. ......................
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 15 of 31 V OL2 Output LOW V oltage I OL = 100 µA V DDQ = 3.3V 0.2 V V DDQ = 2.5V 0.2 V V IH Input HIGH V oltage V DDQ = 3.3V 2.0 V DD + 0.3 V V DDQ = 2.5V 1.7 V DD + 0.3 V V IL Input LOW V oltage V DD Q = 3.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 16 of 31 165-ball FBGA Boundary Scan Order CY7C1360C (256K x 36) CY7C1362C (512K x 18) Bit# ball ID Signal Name Bit# ball ID Signal Name Bit# bal.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 17 of 31 1 19-ball BGA Boundary Scan Ord er CY7C1360C (256K x 36) CY7C1362C (512K x 18) Bit# ball ID Signal Name Bit# ball ID Signal Name Bit# ba.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 18 of 31 Maximum Ratings (Above which the useful life may be impaired. For user guide- lines, not tested.) S torage T emp erature ............. .............. ...... –65°C to +150°C Ambient T emperature with Power Applied .
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 19 of 31 Cap acit ance [16] Parameter Description T est Conditions 100 TQFP Max. 1 19 BGA Max. 165 FBGA Max.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 20 of 31 Switching Characteristics Over the Operating Range [17, 18] Parameter Description –250 –200 –166 Unit Min. Max. Min. Max. Min. Max. t POWER V DD (T ypical) to the First Access [19] 11 1 m s Clock t CYC Clock Cycle Time 4.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 21 of 31 Switching W aveforms Read Cycle Timing [23] Note: 23. On this diagram, when CE is LOW: CE 1 is LOW, C E 2 is HIGH and CE 3 is LOW. When CE is HIGH: CE 1 is HIGH or CE 2 is LOW or CE 3 is HIGH.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 22 of 31 Write Cycle T iming [23, 24] Note: 24. Full width Write can be initiate d by either GW LOW; or by GW HIGH, BWE LOW and BW X LOW.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 23 of 31 Read/Write Cycle Timing [23, 25, 26 ] Notes: 25. The data bus (Q) remains in high-Z following a W rite cycle, unless a new Read access is initiated by ADSP or ADSC .
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 24 of 31 ZZ Mode T iming [27, 28] Notes: 27. Device must be desele ct ed when entering ZZ mode. See Cycle Descr iptions t able for all possible signal conditions to deselect the device. 28. DQs are in High-Z when exiting ZZ sleep mode.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 25 of 31 Ordering Information Not all of the spe ed, package and temperature ran ges are available. Please contact your local sales r epresentative or visit www . cypress.com for actual pro duct s offered.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 26 of 31 200 CY7C1360C-200AXC 51-8 5050 100-pin Thin Quad F lat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) Comm ercial CY7C1362C-200AXC CY7C1360C-200AJXC 51-8 5050 100-pin Thin Quad Flat Pack (14 x 20 x 1.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 27 of 31 250 CY7C1360C-250AXC 51-8 5050 100-pin Thin Quad F lat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) Comm ercial CY7C1362C-250AXC CY7C1360C-250AJXC 51-8 5050 100-pin Thin Quad Flat Pack (14 x 20 x 1.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 28 of 31 Package Diagrams NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE 3.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 29 of 31 Package Diagrams (continued) 1.27 20.32 2 16 5 4 37 L E A B D C H G F K J U P N M T R 12.00 19.50 30° TYP. 2.40 MAX. A1 CORNER 0.70 REF. U T R P N M L K J H G F E D C A B 21 43 65 7 Ø1.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 30 of 31 © Cypress Semi con duct or Cor po rati on , 20 06 . The information contained he re i n is su bj ect to ch ange without notice. Cypress S em ic on duct or Corpo ration assu mes no resp onsib ility for th e u se of any circuitry o ther than circui try embodied i n a Cypress prod uct.
CY7C1360C CY7C1362C Document #: 38-05540 Rev . *H Page 31 of 31 Document History Page Document Title: CY7C1360C/CY7C1362C 9-Mbit (256K x 36/512K x 18 ) Pipelined SRAM Document Number: 38-05540 REV .
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