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18-Mbit (512K x 36/1M x 18) Pipelined SRAM CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Cypress Semiconductor Co rporation • 198 Champion Court • San J ose , CA 95134-1709 • 408-943-2600 Document #: 38-05546 Rev .
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 2 of 29 Logic Block Diagram – CY7C1380DV25 /CY7C1380FV25 [3 ] (512K x 36) Logic Block Diagram – CY7C1382DV2.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 3 of 29 Pin Configurations A A A A A 1 A 0 NC/72M NC/36M V SS V DD A A A A A A A A DQP B DQ B DQ B V DDQ V SSQ .
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 4 of 29 Pin Configurations (continued) 234 567 1 A B C D E F G H J K L M N P R T U V DDQ NC/288M NC/144M DQP C .
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 5 of 29 Pin Configurations (continued) 165-Ball FBGA Pinout (3 Chip Enable) CY7C1380DV25 (512 K x 36) 234 5 67 .
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 6 of 29 Pin Definitions Name IO Description A 0 , A 1 , A Input- Synchronous Address inputs used to select one of the address loca tions . Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW , and CE 1 , CE 2 , and CE 3 [2] are sampled active.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 7 of 29 Functional Overview All synchronous inpu ts pass through input registers controlle d by the rising edge of th e clock. All data outputs pass through output registers controlled by the risin g edge of the clock.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 8 of 29 ADSP triggered write accesses require two cl ock cycles to complete. If GW is asserted LOW on the seco nd clock rise, the data presented to the DQs inputs is written into the corresponding address location in the me mory array .
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 9 of 29 T ruth T able [4, 5, 6, 7, 8] Operation Add. Used CE 1 CE 2 CE 3 ZZ ADSP ADSC ADV WRITE OE CLK DQ Desel.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 10 of 29 T ruth T able for Read/W rite [6, 9] Function (CY7C1380DV25/CY7C 1380FV25) GW BWE BW D BW C BW B BW A .
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 1 1 of 29 IEEE 1 149.1 Serial Boundary Scan (JT AG) The CY7C1380DV25/C Y7C1382DV25 incorpo rates a serial boundary scan test access port (T AP). This part is fully compliant with 1 149.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 12 of 29 Byp ass Register T o save time wh en serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed betwee n the TDI and TDO balls.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 13 of 29 instruction. When HIGH, it will en able the output bu ffers to drive the output bus. When LOW , this bit will place the output bus into a High-Z condition.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 14 of 29 2.5V T AP AC T est Conditions Input pulse levels .......... .............. ................. ........V SS to 2.5V Input rise and fall time ..............
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 15 of 29 Identification Codes Instruction Code Description EXTEST 0 00 Captures IO ri ng contents. Places th e boundary scan register between T DI and TDO. Forces all SRAM outputs to High-Z state.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 16 of 29 165-Ball BGA Boundary Scan Order [13, 15] Bit # Ball ID Bit # Ball ID Bit # Ball ID 1 N6 31 D10 61 G1 .
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 17 of 29 Maximum Ratings Exceeding the maximum ratings may impair the useful life of the device. For user guideline s, not tested. S torage T emperature .........
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 18 of 29 Cap acit ance [18] Parameter Descrip tion T est Conditions 100 TQFP Package 1 19 BGA Package 165 FBGA Package Unit C IN Input Capacitance T A = 25 ° C, f = 1 MHz, V DD /V DDQ = 2.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 19 of 29 Switching Characteristics Over the Operating Range [19, 20] Parameter Descriptio n 250 MHz 200 MHz 167 MHz Unit Min. Max Min. M ax. Min. Max t POWER V DD (T ypical) to the First Access [21] 1 11 ms Clock t CYC Clock Cycle T ime 4.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 20 of 29 Switching W aveforms Read Cycle Timing [25] t CYC t CL CLK ADSP t ADH t ADS ADDRESS t CH OE ADSC CE t AH t AS A1 t CEH t CES GW, BWE, BWx Data Out (Q) High-Z t CLZ t DOH t CO ADV t OEHZ t CO Single READ BURST READ t OEV t OELZ t CHZ ADV suspends burst.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 21 of 29 Write Cycle T iming [25, 26] Switching W aveforms (continued ) t CYC t CL CLK ADSP t ADH t ADS ADDRESS.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 22 of 29 Read/Write Cycle Timing [25, 27, 28] Switching W aveforms (continued ) t CYC t CL CLK ADSP t ADH t ADS.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 23 of 29 ZZ Mode T iming [29, 30] Switching W aveforms (continued ) t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS (except ZZ) DON’T CARE I DDZZ t ZZI t RZZI Outputs (Q) High-Z DESELECT or READ Only Notes: 29.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 24 of 29 Ordering Information Not all of the speed, package, and temperature ranges are available. Plea se contact your local sales representative or visit www .cypress.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 25 of 29 250 CY7C1380DV25-250AXC 51-85050 100-pin Thin Quad Flat Pack (1 4 x 20 x 1.4 mm) Pb-Free Commercial CY7C1382DV25-250AXC CY7C1380FV25-250BGC 5 1-851 15 1 19-ball Ball Grid Array (14 x 22 x 2.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 26 of 29 Package Diagrams Figure 1. 100-Pin Thin Plastic Quad Flat pack (14 x 20 x 1.4 mm) (51-085050) NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 27 of 29 Figure 2. 1 19-Ball BGA ( 14 x 22 x 2.4 mm) (51-85 1 15) Package Diagrams (continued) 1.27 20.32 2 16 5 4 37 L E A B D C H G F K J U P N M T R 12.00 19.50 30° TYP.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 28 of 29 © Cypress Semicon ductor Corporati on, 2006-2007. Th e information contained her ein is subject to ch ange without no tice.
CY7C1380DV25, CY7C1380FV25 CY7C1382DV25, CY7C1382FV25 Document #: 38-05546 Rev . *E Page 29 of 29 Document History Page Document Title: CY7C1380DV25/CY7C1382 DV25/CY7C 1380FV25/CY7C138 2FV25, 18-Mb it (512K x 36/1M x 18 ) Pipelined SRAM Document Number: 38-05546 REV .
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