Gebruiksaanwijzing /service van het product W520 van de fabrikant IBM
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ThinkP ad T520, T520i, and W520 Har dwar e Maint enance Manual.
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ThinkP ad T520, T520i, and W520 Har dwar e Maint enance Manual.
Note Before using this information and the pr oduct it supports, be sur e to read the gener al information under Notices. Third Edition (April 2011) © Copyright Lenovo 2011.
Contents About this manual . . . . . . . . . . . . v Chapter 1. Safety information . . . . . 1 General safety . . . . . . . . . . . . . . . . 1 Electrical safety . . . . . . . . . . . . . . . 2 Safety inspection guide . . . . . . . . . . . . 3 Handling devices that ar e sensitive t o electr ostatic discharge .
1090 PCI Express Mini Car d for wireless W AN or mSA T A solid state drive . . . . . . . . . . . 73 1100 Keyboar d bez el assembly . . . . . . . . 76 1110 Bluetooth daughter car d (BDC-3.0) . . . . 78 1120 Backup battery . . . . . . . . . . . . 79 1130 Smart Card or Smart C ard dummy spacer .
About this manual This manual contains service and r eference information for the following ThinkP ad® pr oducts. ThinkP ad T520 and T520i MT 4239, 4240, 4241, 4242, 4243, 4244, and 4246 ThinkP ad W520 MT 4249, 4260, 4270, 4276, 4281, 4282, and 4284 Use this manual along with the advanced diagnostic tests to tr oubleshoot pr oblems.
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Chapter 1. Safety information This chapter presents following safety information that you need t o be familiar with before you service a ThinkPad Notebook.
Electrical safety Observe the following rules when working on electrical equipment. Important: Use only approved t ools and test equipment. Some hand tools have handles cover ed with a soft material that does not insulate you when working with live electrical currents.
– Send another person to get medical aid. Safety inspection guide The purpose of this inspection guide is t o assist you in identifying potentially unsafe conditions. As each machine was designed and built, requir ed safety items were installed t o protect users and service t echnicians from injury .
When handling ESD-sensitive parts: • Keep the parts in prot ective packages until they ar e inserted into the product. • A void contact with other people. • Wear a grounded wrist strap against your skin t o eliminate static on your body . • Pr event the part fr om touching your clothing.
DANGER Some standby batteries contain a small amount of nick el and cadmium. Do not disassemble a standby batter y, recharge it, throw it into re or water , or short-circuit it. Dispose of the battery as required by local ordinances or regulations.
DANGER Unless hot swap is allowed for the FRU being replaced, do as follows befor e r emoving it: power off the computer , unplug all power cords fr om electrical outlets, r emove the battery pack, and disconnect any interconnecting cables.
PERIGO Antes de ligar o computador após a substituição da FRU , certique-se de que todos os parafusos, molas e outras peças pequenas estejam no lugar e não estejam solt os dentro do computador . V erique isso sacudindo o computador e procurando ouvir sons de peças soltas.
A bateria de lítio pode causar incêndio, explosão ou graves queimadur as. Não a recarregue, remova seu conector polarizado, desmonte-a, aqueça-a acima de 100°C (212°F), incinere-a, ou e xponha o conteúdo de sua célula à água. Descarte a bateria conforme requerido pelas leis ou regulamentos locais.
Certaines batt eries de secours contiennent du nickel et du cadmium. Ne les démont ez pas, ne les r echargez pas, ne les expose z ni au feu ni à l'eau. Ne les mette z pas en court-circuit. Pour les mettre au rebut, conformez-vous à la r églementation en vigueur .
DANGER Si le r emplacement à chaud n'est pas autorisé pour l'unité remplaçable sur site que vous remplacez, procédez comme suit avant de retirer l'unité : mettez l'ordinateur.
VORSICHT Die Leuchtstoffröhr e im L CD-Bildschirm enthält Quecksilber . Bei der Entsorgung die örtlichen Bestimmungen für Sondermüll beacht en. Der L CD-Bildschirm besteht aus Glas und kann z erbrechen, wenn er unsachgemäß behandelt wird oder der Computer auf den Boden fällt.
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Chapter 1 . Safety information 13.
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Antes de encender el sistema despues de sustituir una FRU , compruebe que todos los tornillos, muelles y demás pie zas pequeñas se encuentran en su sitio y no se encuentran sueltas dentro del sistema. Compruébelo agitando el sistema y escuchando los posibles ruidos que provocarían.
Salvo que se permita el intercambio en caliente par a la unidad sustituible localmente, r ealice lo siguiente antes de e xtraerla: apague el sistema, desconecte todos los cables de alimentación de las tomas de alimentación eléctrica, extr aiga la bat ería y desconecte los cables de intercone xión.
Laser compliance statement (multilingual tr anslations) The laser compliance stat ements in this section are pr ovided in the following languages: • English • Arabic • Brazilian P ortuguese • F rench • German • Hebrew • Japanese • Kor ean • Spanish • T raditional Chinese Chapter 1 .
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Chapter 1 . Safety information 19.
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Chapter 1 . Safety information 21.
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Chapter 2. Important service information This chapter pr esents following important service information that applies t o all machine types supported by this manual: • Strat egy for replacing FRUs .
• If an adapter or a device consists of more than one FRU , any of the FRUs may be the cause of the err or . Before replacing the adapter or device, r emove the FRUs, one by one, to see if the symptoms change. Replace only the FRU that changed the sympt oms.
• eSupport will show both the C T O and CMV machine type models (Example: 1829-CT O and 1829-W15 will be found on the eSupport site.) • The HMM will have the 4-digit MT and 3-digit C T O model only (Example: 1829-CT O). Again, CMVs are custom models and are not found in the HMM.
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Chapter 3. General checkout This chapter pr esents following information: • What to do rst • Checkout guide – Diagnostics using PC-Doctor for DOS – Lenovo ThinkV antage T oolbo x – FRU te.
Before checking pr oblems with the computer , determine whether the damage is covered under the warr anty by referring to the following list: The following are not covered under warr anty: • L CD pa.
On the ThinkP ad Setup scr een, pr ess F9, Ent er , F10, and then Ent er . Note: When you initializ e the comput er congur ation, some devices are disabled, such as the serial port. If you test one of these devices, you will need t o enable it by using Congur ation utility for DOS.
Diagnostics Interactive T ests • Run Normal T est • Run Quick T est • CPU/Coprocessor • System Memory • System board • Video Adapter • Fixed Disks • Diskette Drives • Other Devices .
Note: The latest L enovo ThinkV antage T oolbox is available at the following W eb site: http://web.lenovothinkvantagetoolbo x.com/ T o install the latest L enovo ThinkV antage T oolbox on the computer , follow the instructions on the W eb site.
T able 1. FRU tests (continued) FRU Applicable t est Enter the ThinkPad Setup and change Serial A T A (SA T A) setting to Compatibility , and run Diagnostics ➙ Fixed Disks Hard disk drive or solid state drive Y ou can also diagnose the drive without starting up the operating system.
Checking the ac adapter Y ou ar e her e because the comput er fails only when the ac adapt er is used. • If the power pr oblem occurs only when the docking station or the port replicat or is used, replace the docking station or the port replicator .
Note: If the battery pack becomes hot, it may not be able to char ge. Remove it fr om the comput er and leave it at r oom temper ature for a while. After it cools down, reinstall and r echarge it. T o check the battery pack, do the following: 1. P ower off the computer .
Chapter 4. Related service information This chapter pr esents following information: • Restoring the factory cont ents by using Recovery Disc Set • P asswords • P ower management • Symptom-to-.
3. P ress F10 to save the Setup Utility congur ation changes. F ollow the instructions on the screen to begin the recovery process. 4. Select your language and click Next . 5. Read the license. If you agree with the terms and conditions, select I accept these terms and conditions and then click Ne xt .
service technicians provide any services to r eset either the user or the master HDP , or t o r ecover data fr om the har d disk drive. The hard disk drive can be r eplaced for a scheduled fee. F or how to r emove the POP , see How t o remove the hard-disk password.
4. Select P assword . 5. Select Hard-disk x password , wher e x is the letter of the hard disk drive. A pop-up window opens. 6. Select Master HDP . 7. T ype the current master HDP in the Enter Curr ent P assword eld. then leave the Enter New P assword eld blank, and press Enter twice.
Also, in either of the following events, the computer automatically r eturns fr om sleep (standby) mode and resumes oper ation: • The ring indicator (RI) is signaled by a serial device or a PC C ard device. ( does not support the ring indicator (RI) resume by PC Car d device.
Note: Do the FRU r eplacement or other actions in the sequence shown in the column headed “FRU or action, in sequence. ” If r eplacing a FRU does not solve the pr oblem, put the original part back in the computer . Do not r eplace a nondefective FRU .
T able 2. Numeric error codes (continued) Symptom or error FRU or action, in sequence 1802 Unauthorized network card is plugged in—T urn off and remove the miniPCI network card. 1. Remove Mini PCI network card. 2. Syst em boar d 1820 More than one e xternal ngerprint reader is attached.
T able 3. Error messages (continued) Symptom or error FRU or action, in sequence This syst em does not support batteries that are not genuine Lenovo-made or authoriz ed.
No-beep sympt oms T able 5. No-beep symptoms Symptom or error FRU or action, in sequence No beep, power-on indicat or on, L CD blank, and no POST . 1. Mak e sur e that every connector is connected tightly and correctly . 2. DIMM 3. Syst em boar d No beep, power -on indicat or on, and L CD blank during POST .
2. If no error is detected, do not replace any FRUs. 3. If any error is detect ed, replace the FRU shown by the FRU code. Rerun the test to verify that no more errors e xist.
Chapter 5. Installing and conguring RAID This chapt er presents following information about attaching SA T A devices and conguring RAID for the RAID-supported models in this pr oduct. Note: When the UEFI BIOS was formatt ed or the syst em board was r eplaced in the RAID-supported models, RAID is enabled by default.
T o create RAID volumes, do as follows: 1. T urn on the computer . 2. During the startup, when a prompt to pr ess Ctrl+I to ent er the Congur ation Utility is displayed on the screen, pr ess and hold the Ctrl k ey, and press the I key . 3. The scr een for Intel Rapid Stor age T echnology option ROM is displayed.
Chapter 6. Status indicators This chapter presents the system status indicators that show the status of the comput er . 7 8 3 4 5 6 2 1 9 12 11 10 © Copyright L enovo 2011 47.
T able 7. Status indicators Indicator Meaning 1 Speaker mut e Orange: The speaker is on mute. T o set the speakers on mute or unmute, press the speaker mute button. 2 Microphone mute Orange: The microphone is on mute. None of the recor ding devices is available while the microphone mute is on by default.
T able 7. Status indicat ors (continued) Indicator Meaning 9 Caps lock Green: Caps L ock mode is enabled. T o enable or disable Caps L ock mode, press the Caps Lock k ey . 10 Sleep (standby for Windows XP) status Green: The comput er is in sleep (standby) mode.
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Chapter 7. Fn key combinations The following table shows the function of each combination of Fn with a function key . T able 8. Fn key combinations Key combination Description Fn+F1 Reserved.
T able 8. Fn key combinations (continued) Key combination Description Fn+F7 F or Windows 7: Switch between the computer display and an e xternal monitor .
T able 8. Fn key combinations (continued) Key combination Description Fn+Home The computer display becomes bright er . The purpose of this method is to change the brightness level t emporarily . On Windows Vista, the default brightness level is loaded aft er sleep (standby), hibernation, reboot, or detaching or attaching an ac adapt er .
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Chapter 8. FRU replacement notices This chapt er pr esents notices relat ed t o r emoving and replacing parts. Read this chapt er car efully befor e replacing any FRU.
Retaining serial numbers This section includes the following descriptions: • Restoring the serial number of the system unit • Retaining the UUID • Reading or writing the ECA information Restorin.
When you replace the syst em boar d, you must set the UUID on the new syst em board as follows: 1. Install the LENO VO ThinkP ad Har dware Maint enance Diskette V ersion 1.76 or later , and restart the computer . 2. F rom the main menu, select 4. Assign UUID .
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Chapter 9. Removing and replacing a FRU This chapter pr esents dir ections and drawings for use in r emoving and replacing a FRU . Be sure t o observe the following general rules: 1. Do not try to service any comput er unless you have been tr ained and certied.
Before servicing ThinkP ad T520, T520i, and W520 T able 9. Removal steps of SIM card Some models of the ThinkPad T520, T520i, and W520 you ar e servicing might have the SIM card that the customer has installed. If the computer you are servicing has the SIM car d, remove it before you start the servicing.
T able 10. Removal steps of batt ery pack (continued) 3 2 1 When installing: Install the batt ery pack in the slot, and then make sure that the batt ery latch is in the locked position. 1020 Serial Ultr abay Enhanced device or tr avel bezel F or access, remove this FRU: • 1010 Battery pack T able 11.
T able 11. Removal steps of Serial Ultrabay Enhanced device or tr avel bezel (continued) 3 2 1 1030 DIMM slot cover F or access, remove this FRU: • 1010 Battery pack T able 12. Removal steps of DIMM slot cover Note: Loosen the screws 1 , but do not remove them.
T able 12. Removal st eps of DIMM slot cover (continued) 1 2 1040 DIMM (bottom slot) F or access, remove these FRUs in or der: • 1010 Battery pack • 1030 DIMM slot cover Chapter 9 .
T able 13. Removal steps of DIMM (bottom slot) F or ThinkP ad T520 and T520i : 1 1 2 64 ThinkP ad T520, T520i, and W520 Har dware Maintenance Manual.
T able 13. Removal steps of DIMM (bott om slot) (continued) F or ThinkP ad W520 : 1 1 2 a b Note: If only one DIMM is used on the comput er you ar e servicing, the card must be installed in SL O T -0 a , but not in SL OT -2 b . When installing: Insert the notched end of the DIMM into the socket.
T able 14. Removal steps of hard disk drive slot cover , HDD and HDD rubber rails or SSD and storage converter Note: Loosen the scr ew 1 , but do not remove it.
T able 16. Removal steps of SSD and SSD spacers 4 4 When installing: Make sure that the SSD connect or or HDD connector is attached rmly . 1060 K eyboard F or access, remove these FRUs in or der: • 1010 Battery pack • 1030 DIMM slot cover T able 17.
T able 17. Removal steps of keyboard (continued) 1. Push down the keyboard a little toward the arrow 2 until the front edge of the keyboard is detached from the keyboar d bez el. 2 2. Lift the keyboar d a little in the dir ection shown by arrow 3 , and then detach the connector 4 .
T able 18. Installation steps of keyboard 1. Attach the keyboar d connect or 1 . 1 2. Attach the k eyboard so that the keyboard edges a are under the frame as shown in this gure.
T able 18. Installation steps of keyboard (continued) 3. Gently press the keys with your thumbs and try t o slide the keyboar d towar d you. 4. Mak e sure that the fr ont side of the keyboard ( b ) is housed rmly . b b b 5. Secur e the keyboard by tight ening the screws from the bott om side of the computer .
T able 19. Removal steps of DIMM (upper slot) 1 1 2 Note: F or ThinkPad W520, if only one DIMM is used on the comput er you are servicing, the card must be installed in SL OT -0 a , but not in SL OT -2 b . a b When installing: Insert the notched end of the DIMM into the socket.
T able 20. Removal steps of PCI Express Mini Card for wireless LAN In step 1 , unplug the jacks by using the antenna RF connector r emoval t ool (P/N: 08K7159) or pick the connectors with your ngers and gently unplug them in dir ection of the arr ow.
T able 20. Removal steps of PCI Express Mini Card for wireless LAN (continued) 4 When installing: • In models with wireless LAN card that has two antenna connectors, plug the gray cable into the jack labeled MAIN or M , and the black cable into the jack labeled AUX or A on the car d.
T able 21. Removal steps of PCI Express Mini Card for wireless WAN In step 1 , unplug the jacks by using the antenna RF connector r emoval t ool (P/N: 08K7159) or pick the connectors with your ngers and gently unplug them in dir ection of the arr ow.
T able 21. Removal steps of PCI Express Mini Car d for wireless WAN (continued) 4 Note: Plug the or ange cable into the jack labeled MAIN , and the blue cable into the jack labeled AUX on the card. If your computer is equipped with an mSA T A solid state drive, follow the below removal st eps.
T able 22. Removal steps of mSA T A (continued) 3 1100 Keyboard bez el assembly F or access, remove these FRUs in or der: • 1010 Battery pack • 1030 DIMM slot cover • 1060 Keyboard Attention: Befor e removing the keyboard bez el assembly, make sur e that you have r emoved Expr essCard blank bezel or any car d in the slot.
T able 23. Removal steps of ExpressCard blank bezel or ExpressCard (continued) When installing: Make sur e that the bezel or the card is correctly oriented as shown in this gure. T able 24. Removal steps of k eyboard bezel assembly Note: The speaker assembly is attached t o the keyboar d bezel.
T able 24. Removal steps of keyboard bezel assembly (continued) 4 3 7 6 5 5 6 1110 Bluetooth daughter card (BDC-3.0) F or access, remove these FRUs in or der: • 1010 Battery pack • 1180 Base cover.
T able 25. Removal steps of BDC-3.0 2 1 Step Screw (quantity) Color T or que 1 M2 × 3 mm, wafer -head, nylon-coated (1) Silver 0.181 Nm (1.85 kgfcm) When installing: Make sure that the connector is attached rmly .
T able 26. Removal steps of backup batt ery 1 2 When installing: Make sur e that the battery connect or is attached rmly . 1130 Smart Car d or Smart Card dummy spacer F or access, remove these FRUs.
T able 27. Removal steps of Smart Card 1 4 3 3 1 2 Step Screw (quantity) Color T or que 3 M2 × 3 mm, wafer -head, nylon-coated (3) Silver 0.181 Nm (1.
T able 28. Removal steps of dummy car d and spacer 2 3 1 1 Step Screw (quantity) Color T or que 1 M2 × 3 mm, wafer -head, nylon-coated (3) Silver 0.181 Nm (1.
T able 29. Removal steps of speaker assembly 1 1 1 1 3 2 2 Step Screw (quantity) Color T or que 1 M2 × 3 mm, wafer -head, nylon-coated (4) Silver 0.181 Nm (1.85 kgfcm) 4 4 4 4 4 5 5 5 5 5 When installing: Make sur e that the speaker connector is attached rmly .
1150 Thermal module F or access, remove these FRUs in or der: • 1010 Battery pack • 1030 DIMM slot cover • 1060 Keyboard • 1100 Keyboard be zel assembly • 1140 Speaker assembly T able 30. Removal steps of thermal module 1 When installing: Make sure that the connect ors are attached rmly .
T able 30. Removal steps of thermal module (continued) 6 When installing: Befor e you attach the fan assembly t o the computer , apply thermal grease, at an amount of 0.
T able 30. Removal steps of thermal module (continued) F or Int egrated Graphics models: a F or W orkstation models: a a 1160 CPU F or access, remove these FRUs in or der: • 1010 Battery pack • 10.
T able 31. Removal steps of CPU Rotate the head of the screw in the direction shown by arrow 1 t o r elease the lock; then r emove the CPU 2 . 2 1 a When installing: Place the CPU on the CPU socket, and then rotate the head of the screw in the dir ection shown by arrow a to secure the CPU.
T able 32. Removal steps of L CD unit 2 2 1 1 Step Screw cap Screw (quantity) Color T or que 1 M2.5 × 6 mm, wafer -head, nylon-coat ed (2) Black 0.392 Nm (4.0 kgfcm) 2 — M2.5 × 6 mm, wafer -head, nylon-coat ed (2) Black 0.392 Nm (4.0 kgfcm) 3 3 Step Screw (quantity) Color T or que 3 M2.
T able 32. Removal steps of L CD unit (continued) 4 4 4 5 5 6 8 7 7 9 Step Screw (quantity) Color T or que 7 M2 × 4 mm, wafer -head, nylon-coated (2) Black 0.181 Nm (1.85 kgfcm) When installing: • Make sure that you attach the L CD connector rmly .
T able 32. Removal steps of L CD unit (continued) 10 10 1180 Base cover assembly F or access, remove these FRUs in or der: • 1010 Battery pack • 1020 Serial Ultr abay Enhanced device or tr avel be.
T able 33. Removal steps of base cover assembly 2 2 3 1 Step Screw (quantity) Color T or que 1 M2 × 3 mm, wafer -head, nylon-coated (1) Silver 0.181 Nm (1.85 kgfcm) 2 M2 × 14 mm, wafer-head, nylon-coated (2) Black 0.181 Nm (1.85 kgfcm) 3 M2 × 4 mm, wafer -head, nylon-coated (1) Black 0.
4 Mac address label 5 V odafone label 6 Isr ael label 7 Modem label (only for PRC models) 8 China wireless W AN label 9 Modem AMOM label (only for Br azil) 10 Bluetooth label (only for Br azil) 11 Wireless car d label (only for Brazil) 12 SIRIM label 16 Asset tag label F or some models, you also need to apply one or two FCC labels.
• 1100 Keyboard be zel assembly • 1110 Bluetooth daughter car d (BDC-3.0) • 1120 Backup battery • 1130 Smart Car d or Smart Car d dummy spacer • 1140 Speaker assembly • 1150 Thermal module • 1170 LCD unit • 1180 Base cover assembly T able 34.
• 1100 Keyboard be zel assembly • 1110 Bluetooth daughter car d (BDC-3.0) • 1120 Backup battery • 1130 Smart Car d or Smart Car d dummy spacer • 1140 Speaker assembly • 1150 Thermal module.
T able 35. Location of major sensitive components on the system board (continued) F or Int egrated Graphics models: a b c F or Switchable Gr aphics models: d a b c F or W orkstation models: d a b c Chapter 9 .
T able 36. Removal steps of system board and magnesium structure frame 4 1 1 2 2 3 Step Screw (quantity) Color T or que 1 Hex stud, nylon-coat ed (2) Silver 0.392 Nm (4.0 kgfcm) 2 M2 × 7 mm, wafer -head, nylon-coated (2) Silver 0.181 Nm (1.85 kgfcm) 3 M2 × 3 mm, wafer -head, nylon-coated (1) Silver 0.
T able 37. Removal steps of MDC Note: Only some select ed models are installed with a MDC. Step Screw (quantity) Color T or que 1 M2 × 3 mm, wafer -head, nylon-coated (2) Silver 0.181 Nm (1.85 kgfcm) 2010 L CD be zel assembly F or access, remove this FRU: • 1010 Battery pack T able 38.
T able 38. Removal steps of L CD bez el assembly (continued) 3 2 2 2 2 2 2 2 2 When installing: Make sure that all the latches are attached rmly . 2020 LED sub card F or access, remove these FRUs in or der: • 1010 Battery pack • 2010 L CD bezel assembly T able 39.
2030 Int egrated camera F or access, remove these FRUs in or der: • 1010 Battery pack • 2010 L CD bezel assembly T able 40. Removal steps of integrated camera 2 1 3 Step Screw (quantity) Color T or que 1 M2 × 3 mm, wafer -head, nylon-coated (1) Silver 0.
• 1170 LCD unit • 2010 L CD bezel assembly T able 41. Removal steps of L CD cable, camer a cable, L CD panel, and hinges In step 1 , r elease the antenna cables fr om the left and right hinges. 1 1 2 2 2 2 Step Screw (quantity) Color T or que 2 M2.
T able 41. Removal steps of L CD cable, camera cable, L CD panel, and hinges (continued) 4 5 5 5 3 6 7 8 When installing: Make sur e that the L CD cable connector is attached rmly .
T able 41. Removal steps of L CD cable, camera cable, L CD panel, and hinges (continued) 9 9 9 9 10 10 Step Screw (quantity) Color T or que 9 M2 × 3 mm, wafer -head, nylon-coated (4) Silver 0.
T able 42. Removal steps of antenna kit and L CD rear cover assembly (continued) Cable routing: When you install the antenna kit, r oute the cables as shown in the gures below. As you route the cables, make sure that they are not subjected t o any tension.
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Chapter 10. L ocations This chapter presents the location of ThinkP ad T520, T520i, and W520 featur es and hardwar e. F ront view 1 Status indicators Note: F or the description of each indicator , see Status indicators.
3 4 5 7 6 8 8 9 10 13 14 11 12 15 16 18 20 19 17 1 2 2 21 Rear view 1 Status indicat ors Note: F or the description of each indicat or , see Status indicators.
1 9 2 3 4 5 7 6 8 10 11 Bottom view 1 Battery pack 2 Battery pack latch 3 Docking connector 4 Solid state drive (SSD) or hard disk drive (HDD) slot 5 DIMM slot (bottom) 6 L CD cover latch 7 Serial Ultrabay Enhanced lock latch 8 Serial Ultrabay Enhanced eject latch 1 2 3 4 6 5 7 8 Chapter 10 .
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Chapter 11. P arts list This chapter contains following lists of the service parts. • Overall • L CD FRUs • Keyboar d • Miscellaneous parts • AC adapters • P ower cords • Recovery discs • Common service t ools Notes: • Each FRU is available for all types or models, unless specic types or models are specied.
Overall 1 2 3 5 4 a c b d 6 7 8 9 10 11 8 12 14 15 13 16 17 18 19 20 22 21 23 24 110 ThinkP ad T520, T520i, and W520 Har dware Maintenance Manual.
T able 43. P arts list—Overall No. FRU (Overall) FRU no. CRU ID a - d See Miscellaneous parts. 1 L CD unit (see L CD FRUs.) 2 P almrest assembly, no-Fingerprint Reader (FPR), no-Color Sensor (CS), w.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 2 P almrest assembly, FPR, no-CS, no-SmartCar d Reader • 4239-CT O , 23x, 24x, 26x, 27x, 28x, 34x, 35x, 36x, 37x, 38x, 39.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 5 Gobi 3000 wir eless WAN adapt er for Malaysia SK U • 4239-CT O • 4240-CT O • 4241-CT O • 4242-CT O • 4243-CT O .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 5 mSA T A solid state drive, 80GB • 4239-CT O • 4240-CT O , 4Kx, 4Lx • 4241-CT O • 4242-CT O • 4243-CT O • 4244.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 6 Intel Centrino Advanced-N 6205 • 4239-CT O , 22x, 23x, 24x, 25x, 34x, 42x, 43x, 45x, 46x, 4Ax, 4Cx • 4240-CT O , 29x,.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 6 Intel Centrino Advanced-N + WiMAX 6250, Russia SK U • 4239-CT O • 4240-CT O • 4241-CT O • 4242-CT O • 4243-CT O.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 7 DVD-RAM/RW drive • 4239-CT O , 22x, 23x, 24x, 25x, 26x, 27x, 28x, 2Zx, 32x, 33x, 34x, 35x, 36x, 37x, 38x, 39x, 3Ax, 3Nx.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 7 DVD-RAM/RW drive • 4239-CT O , 22x, 23x, 24x, 25x, 26x, 27x, 28x, 2Zx, 32x, 33x, 34x, 35x, 36x, 37x, 38x, 39x, 3Ax, 3Nx.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 7 DVD-RAM/RW drive • 4239-CT O , 22x, 23x, 24x, 25x, 26x, 27x, 28x, 2Zx, 32x, 33x, 34x, 35x, 36x, 37x, 38x, 39x, 3Ax, 3Nx.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 8 1-GB DDR3-1333 SDRAM SO-DIMM car d • 4239-CT O , 2Zx • 4240-CT O , 2Xx, 3Gx, 3Zx • 4241-CT O , 46x • 4242-CT O , .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 8 4-GB DDR3-1333 SDRAM SO-DIMM car d • 4239-CT O , 24x, 26x, 34x, 37x, 38x, 39x, 3Ax, 3Nx, 42x, 43x, 44x, 45x, 46x, 47x, .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 10 Battery pack, Li-ion (6 cell) • 4239-CT O , 22x, 25x, 27x, 28x, 2Zx, 32x, 33x, 35x, 36x, 37x, 38x, 39x, 3Ax, 3Nx, 42x,.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 10 Battery pack, Li-ion (6 cell) • 4239-CT O , 22x, 25x, 27x, 28x, 2Zx, 32x, 33x, 35x, 36x, 37x, 38x, 39x, 3Ax, 3Nx, 42x,.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 10 Battery pack, Li-ion (6 cell) • 4239-CT O • 4240-CT O , 46x, 47x • 4241-CT O • 4242-CT O • 4243-CT O • 4244-.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 10 Battery pack, Li-ion (9 cell) • 4239-CT O , 23x, 24x, 26x, 34x • 4240-CT O , 2Hx, 2Ux, 2Vx, 48x, 49x, 4Hx, 4Jx • 4.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 11 Base cover assembly, discr ete • 4239-CT O , 23x, 24x, 26x, 32x, 33x, 34x, 36x, 37x, 38x, 39x, 3Ax, 42x, 43x, 44x, 45x.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 11 Base cover assembly for T aiwan 170W • 4249-CT O • 4260-CT O • 4270-CT O • 4276-CT O , 2Ex, 2Dx, 2Cx, 2Bx • 42.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 250 GB, 5,400 rpm • 4239-CT O , 34x • 4240-CT O , 3Zx • 4241-CT O , 47x • 4242-CT O • .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 250 GB, 5,400 rpm • 4239-CT O , 34x • 4240-CT O , 3Zx • 4241-CT O , 47x • 4242-CT O • .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 320 GB, 5,400 rpm • 4239-CT O , 27x • 4240-CT O , 2Ex, 2Jx, 2Kx, 2Lx, 2Mx, 3Hx • 4241-CT O.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 160 GB, 7,200 rpm • 4239-CT O • 4240-CT O • 4241-CT O • 4242-CT O • 4243-CT O • 4244.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 160 GB, 7,200 rpm • 4239-CT O • 4240-CT O • 4241-CT O • 4242-CT O • 4243-CT O • 4244.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 320 GB, 7,200 rpm • 4239-CT O , 22x, 23x, 25x, 46x, 47x, 4Bx, 4Cx • 4240-CT O , 29x, 2Ax, 2B.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 320 GB, 7,200 rpm • 4239-CT O , 22x, 23x, 25x, 46x, 47x, 4Bx, 4Cx • 4240-CT O , 29x, 2Ax, 2B.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 320 GB, 7,200 rpm • 4239-CT O , 22x, 23x, 25x, 46x, 47x, 4Bx, 4Cx • 4240-CT O , 29x, 2Ax, 2B.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A hard disk drive, 500 GB, 7,200 rpm • 4239-CT O , 24x, 28x, 2Zx, 32x, 33x, 35x, 36x, 37x, 38x, 39x, 3Ax, 3Nx, 42.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A 2.5" solid stat e drive, 128 GB, 7 mm height • 4239-CT O , 26x • 4240-CT O , 2Vx • 4241-CT O • 4242-.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 15 SA T A 2.5" solid stat e drive, 160 GB, 7 mm height • 4239-CT O • 4240-CT O • 4241-CT O • 4242-CT O , 2Ax .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 16 System board assembly for T520 and T520i, integr ated, non-AMT , TPM • 4239-CT O , 27x, 28x, 35x, 3Nx, 47x, 48x, 49x, .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 16 System board assembly for W520 Q3, AMT , TPM, no RAID adapter • 4249-CT O • 4260-CT O • 4270-CT O • 4276-CT O , .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 16 System board assembly for W520 Q1, non-AMT , TPM, no RAID adapter • 4249-CT O • 4260-CT O • 4270-CT O • 4276-CT .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 16 System board assembly for W520 Q3, non-AMT , TPM, with RAID adapter • 4249-CT O • 4260-CT O • 4270-CT O • 4276-C.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 17 CPU assembly, Int el Core i5-2540M P rocessor (2.60 GHz) • 4239-CT O , 23x, 24x, 25x, 2Zx, 32x, 44x • 4240-CT O , 2D.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 17 CPU assembly, Int el Core i7-2720QM P rocessor (2.20 GHz) • 4239-CT O • 4240-CT O , 3Qx • 4241-CT O • 4242-CT O .
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 18 Bluetooth daughter car d (BDC-3.0) • 4239-CT O , 23x, 24x, 25x, 26x, 27x, 28x, 2Zx, 32x, 33x, 34x, 35x, 36x, 37x, 38x,.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 18 Bluetooth daughter car d (BDC-3.0) • 4239-CT O , 23x, 24x, 25x, 26x, 27x, 28x, 2Zx, 32x, 33x, 34x, 35x, 36x, 37x, 38x,.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 19 Modem Daughter Card • 4239-CT O , 22x, 23x, 25x, 26x, 27x, 28x, 34x, 35x, 36x, 37x, 38x, 39x, 3Ax, 3Nx, 42x, 43x, 44x,.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 21 Thermal module for T520 and T520i discr ete gr aphics models • 4239-CT O , 23x, 24x, 26x, 32x, 33x, 34x, 36x, 37x, 38x.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 21 Thermal module for T520 and T520i integr ated gr aphics models • 4239-CT O , 22x, 25x, 27x, 28x, 2Zx, 35x, 3Nx, 46x, 4.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID 21 Thermal module for W520, 45W • 4249-CT O • 4260-CT O • 4270-CT O , 26x • 4276-CT O , 25x, 27x, 28x, 29x, 2Bx, 2C.
T able 43. Parts list—Overall (continued) No. FRU (Overall) FRU no. CRU ID — Thermal grease 91P8835 N — AC adapt er (see AC adapters.) L CD FRUs In ThinkP ad T520, T520i, and W520, ther e ar e following types of L CDs: • 15.6-inch High Denition (HD) LED-backlight L CD • 15.
1 2 3 4 5 6 9 8 10 7 T able 44. Parts list—ThinkP ad T520, T520i and W520 L CD FRUs No. FRU (ThinkPad T520, T520i and W520 L CD) FRU no. CRU ID 1 L CD bezel assembly 60Y5482 N 1 L CD bezel assembly .
T able 44. P arts list—ThinkPad T520, T520i and W520 L CD FRUs (continued) No. FRU (ThinkPad T520, T520i and W520 L CD) FRU no. CRU ID 2 Integr ated camer a (2.
T able 44. P arts list—ThinkPad T520, T520i and W520 L CD FRUs (continued) No. FRU (ThinkPad T520, T520i and W520 L CD) FRU no. CRU ID 5 Antenna kit 45M2899 N 6 L CD rear cover assembly 04W1567 N 6 .
T able 44. P arts list—ThinkPad T520, T520i and W520 L CD FRUs (continued) No. FRU (ThinkPad T520, T520i and W520 L CD) FRU no. CRU ID 9 LED sub card, with microphone • 4239-CT O , 22x, 23x, 24x, .
T able 44. P arts list—ThinkPad T520, T520i and W520 L CD FRUs (continued) No. FRU (ThinkPad T520, T520i and W520 L CD) FRU no. CRU ID 10 L CD module, 15.
T able 44. P arts list—ThinkPad T520, T520i and W520 L CD FRUs (continued) No. FRU (ThinkPad T520, T520i and W520 L CD) FRU no. CRU ID 10 L CD module, 15.
T able 44. P arts list—ThinkPad T520, T520i and W520 L CD FRUs (continued) No. FRU (ThinkPad T520, T520i and W520 L CD) FRU no. CRU ID 10 L CD module, 15.6-inch FHD LED-backlight, with touch panel • 4249-CT O • 4260-CT O • 4270-CT O • 4276-CT O , 22x • 4281-CT O • 4282-CT O • 4284-CT O 04W1511 N K eyboard T able 45.
T able 45. Parts list—K eyboard (continued) Language FRU no. CRU ID Spanish 45N2081 45N2151 45N2221 Swiss 45N2098 45N2168 45N2238 Thai 45N2105 45N2175 45N2245 T r aditional Chinese 45N2104 45N2174 45N2244 T urkish F T ype 60Y9552 60Y9554 60Y9550 T urkish 45N2099 45N2169 45N2239 U.
T able 46. P arts list—Miscellaneous parts (continued) FRU FRU no. CRU ID Base miscellaneous parts: • Rubber foot (rear) • Rubber foot (front) • Gasket, DIMM (L) • Gasket, DIMM (R) • Gaske.
T able 47. Parts list—2-pin ac adapters for ThinkP ad T520 and T520i (continued) FRU FRU no. CRU ID 2-pin (90 W , 20 V) adapter (models C T O, xxE, xxF , xxJ, xxL, xxP , xxS, xxU, xxY) 42T4427 2-pin.
T able 51. Parts list—2-pin power cords Region P/N CRU ID Argentina • models -C TO , xxY 42T5020 42T5105 Brazil • models -C TO , xxP 42T5180 42T5183 Canada, U .S. • models -CT O , xxF , xxL, xxS, xxU 42T5008 42T5093 Japan • models -C T O, xxE, xxJ 42T5014 42T5099 * T able 52.
• 4242-CT O , 45x, 46x, 4Xx, 4Zx, 52x • 4243-CT O • 4244-CT O • 4246-CT O • 4249-CT O • 4260-CT O • 4270-CT O • 4276-CT O • 4281-CT O • 4282-CT O • 4284-CT O T able 53.
T able 54. P arts list—Windows 7 Home Premium (64 bit) recovery DVDs Language P/N CRU ID Arabic 03W7866 Brazilian P ortuguese 03W7867 Czech 03W7870 English 03W7889 English (modem-disabled) 03W7888 E.
• 4281-CT O • 4282-CT O , 29x, 3Px • 4284-CT O , 48x T able 55. Parts list—Windows 7 P rofessional (32 bit) recovery DVDs Language P/N CRU ID English 03W7818 Japanese 03W7817 Simplied Chine.
T able 56. Parts list—Windows 7 P rofessional (64 bit) recovery DVDs (continued) Language P/N CRU ID German 03W7827 Greek 03W7826 Hebrew 03W7828 Hungarian 03W7830 Japanese 03W7831 Kor ean 03W7832 P .
Appendix A. Notices Lenovo may not offer the pr oducts, services, or features discussed in this document in all countries. Consult your local Lenovo repr esentative for information on the pr oducts and services curr ently available in your area.
Electronic emissions notices F or electr onic emission information on Class B digital devices, r efer to the corr esponding information in the User Guide .
.
Part Number: 0A60078_02 Printed in (1P) P/N: 0A60078_02 *0A60078_02*.
Een belangrijk punt na aankoop van elk apparaat IBM W520 (of zelfs voordat je het koopt) is om de handleiding te lezen. Dit moeten wij doen vanwege een paar simpele redenen:
Als u nog geen IBM W520 heb gekocht dan nu is een goed moment om kennis te maken met de basisgegevens van het product. Eerst kijk dan naar de eerste pagina\'s van de handleiding, die je hierboven vindt. Je moet daar de belangrijkste technische gegevens IBM W520 vinden. Op dit manier kan je controleren of het apparaat aan jouw behoeften voldoet. Op de volgende pagina's van de handleiding IBM W520 leer je over alle kenmerken van het product en krijg je informatie over de werking. De informatie die je over IBM W520 krijgt, zal je zeker helpen om een besluit over de aankoop te nemen.
In een situatie waarin je al een beziter van IBM W520 bent, maar toch heb je de instructies niet gelezen, moet je het doen voor de hierboven beschreven redenen. Je zult dan weten of je goed de alle beschikbare functies heb gebruikt, en of je fouten heb gemaakt die het leven van de IBM W520 kunnen verkorten.
Maar de belangrijkste taak van de handleiding is om de gebruiker bij het oplossen van problemen te helpen met IBM W520 . Bijna altijd, zal je daar het vinden Troubleshooting met de meest voorkomende storingen en defecten #MANUAl# samen met de instructies over hun opplosinge. Zelfs als je zelf niet kan om het probleem op te lossen, zal de instructie je de weg wijzen naar verdere andere procedure, bijv. door contact met de klantenservice of het dichtstbijzijnde servicecentrum.
