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Intel ® 955X Express Chipset Thermal/Mechanical Design Guide – For the Intel ® 82955X Memory Controller Hub (M CH) April 2005 Document Number: 307012-001 R.
R 2 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide INFORMATION IN THIS DOCU MENT IS PROVIDED IN CONNECT ION WITH INTEL ® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECT UAL PROPERTY RIGHTS IS GRANTED BY TH IS DOCUMENT.
R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 3 Contents 1 Introduc tion ................................................................................................................... ...... 7 1.1 Definition of Terms ...........
R 4 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figures Figure 2-1. MCH Package Di mensions (T op View) ............................................................ 9 Figure 2-2. MCH Package Dim ensions (Si de View) .................
R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 5 Revision History Revision Number Description Revision Date -001 • Initial Release. April 2005 §.
R 6 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide.
Introduction R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 7 1 Introduction As the complexit y of computer system s increases, so do the power dissipati on requirements. Care must be taken to ensure t hat the additional power is properly dissipated.
Introduction R 8 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 1.1 Definition of Terms Term Description BGA Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is mounted, bonded and encapsulated in molding compound.
Packaging Technology R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 9 2 Packaging Technology The 955X Express chipset consists of two indi vidual components: the MCH and the ICH7. The MCH component uses a 34 m m squared, 6-la yer flip chip ball grid array (FC -BGA) package (see Figure 2-1 through Figure 2-3).
Packaging Technology R 10 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 2-3. MCH Package Dimensions (Bottom View ) NOTES: 1. All dimensions are in millimeters.
Thermal Specifications R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 11 3 Thermal Specifications 3.1 Thermal Design Power (TDP) Analysis indicates that real applications are unlikely to cause the chipset MCH to consume maxim um power dissipati on for sustained time peri ods.
Thermal Specifications R 12 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide.
Thermal Simulation R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 13 4 Thermal Simulation Intel provides therm al simulat ion models of the 955X Express chi pset MCH and associated us.
Thermal Simulation R 14 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide.
Thermal Metrology R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 15 5 Thermal Metrology The system designer must m ake temperature meas urements to accurately determ ine the thermal performance of the system . Intel has establi shed guidelines for proper techniques to m easure the MCH die temperatures.
Thermal Metrology R 16 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 5-1. Thermal Solution Decision Flow chart Therm _Solution_Flow Atta ch th e rm o co u pl e s usin g re co mme nde d me tro logy . Se tup the sy ste m in th e de sire d configuratio n.
Reference Thermal Solution R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 17 6 Reference Thermal Solution Intel has developed a reference therm al solution designed to m eet the cooling needs of the MCH under operating environm ents and specifications defi ned in this document.
Reference Thermal Solution R 18 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 6-1. Reference Heatsink Measured Thermal Performance versus Approach Velocity 6.
Reference Thermal Solution R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 19 Figure 6-2. Heatsink Volumetric Envelope for the MCH TN B M other boar d Heats i nk Base Di e F CBG A + So lde r Ba lls H eat s ink Fi n Heat s i nk Fi n Ram p Retainer TI M 33.
Reference Thermal Solution R 20 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 6.4 Board-Level Components Keep-out Dimensions The location of hole patterns and keep-out zones for the reference thermal solut ion are shown in Figure 6-3 and Figure 6-4.
Reference Thermal Solution R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 21 Figure 6-4. Retention Mechanism Component Keep-out Zones 4 x 8. 76m m 4 x 5. 08m m 4 x 1. 84m m 8 x Ø 0. 97 mm P lated T hru H ole 8 x Ø1.42 mm T rac e K e epout No C om ponent s th i s A r e a 4 x 8.
Reference Thermal Solution R 22 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 6-5. Plastic Wave Soldering Heatsink Assembly 6.5.1 Heatsink Orientation To enhance the efficiency o f the reference thermal solution, it is important for the d esigner to orient the fins properly wi th respect to the mean ai rflow direction.
Reference Thermal Solution R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 23 Figure 6-6. Plastic Wave Solder ing Heatsink Extrusion Profile NOTE: All dimensions are in millimeters, with di mensions in braces expressed in inches.
Reference Thermal Solution R 24 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 6.5.4.1 Effect of Pressure on TIM Performance As mechanical pressure increases on the TIM, th e therm al resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT).
Reference Thermal Solution R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 25 6.6 Reliability Guidelines Each motherboard, heatsink and attach combina tion may vary the mechanical loading of the component.
Reference Thermal Solution R 26 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide.
Appendix A: Thermal Solution Component Suppliers R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 27 7 Appendix A: Thermal Solution Component Suppliers This list is provi ded by Intel solely as a convenience to customers.
Appendix A: Thermal Solution Component Suppliers R 28 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Part Intel Part Number Supplier (Part Number) Contact Information Solder-Down Anchor C85376-001 Wieson Rick Lin Deputy Manager/Project Sales Department Add.
Appendix B: Mechanical Drawings R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 29 8 Appendix B: Mechanical Drawings Table 8-1 lists the m echanical drawings included in thi s appendix.
Appendix B: Mechanical Drawings R 30 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-1. Plastic Wave Soldering Heatsink Assembly Drawing.
Appendix B: Mechanical Drawings R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 31 Figure 8-2. Plastic Wave Soldering Heatsink Drawing (1 of 2).
Appendix B: Mechanical Drawings R 32 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-3. Plastic Wave Soldering Heatsink Drawing (2 of 2).
Appendix B: Mechanical Drawings R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 33 Figure 8-4. Plastic Wave Soldering Heatsink Ramp Clip Draw ing (1 of 2).
Appendix B: Mechanical Drawings R 34 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-5. Plastic Wave Soldering Heatsink Ramp Clip Draw ing (2 of 2).
Appendix B: Mechanical Drawings R Intel ® 955X Express Chipset Thermal/Mechanical Design Guide 35 Figure 8-6. Plastic Wave Soldering Heatsink Wire Clip Drawing.
Appendix B: Mechanical Drawings R 36 Intel ® 955X Express Chipset Thermal/Mechanical Design Guide Figure 8-7. Plastic Wave Soldering Heatsink Solder-Down Anchor Draw ing §.
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