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Order N um be r: 31 867 6- 0 03US Intel ® 5100 Memory Controller Hub Chipset for Communica tions, Embedded, and Storage Applications The rma l/ Mec ha n ic al D esi gn Gui de July 2008 Revision 003US.
Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 2 Order Number: 318676-003US Legal Lines and Disclaim ers INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 3 Intel ® 5100 MCH Chipse t Contents 1.0 In tr oduct io n ........... ............ ........... ........... ..
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 4 Order Number: 318676-003US Figures 1 Thermal Design Process . .... ........... ............ ........... ...
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 5 Intel ® 5100 MCH Chipse t Revision History Date Revisi o.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 6 Order Number: 318676-003US 1.0 Introduction As the complexity of computer syste ms increases, so do the power dissipation requiremen ts.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 7 Intel ® 5100 MCH Chipse t 1.2 Definition of Terms Figur e 1. Therm a l De si gn Proce ss Tabl e 1 . Defi nit ion of Ter ms Term Definiti o n FC -BGA Flip Chip Ball Grid Array .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 8 Order Number: 318676-003US 1.3 Relat ed Documents Intel ® Elec t ronic Des i gn Kit s (EDKs ) prov ide on line , real - ti me co lla ter al updates.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 9 Intel ® 5100 MCH Chipse t 1.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 10 Order Number: 318676-003US Figu r e 2. M CH Pac k a g e Dime nsions ( Top View ) Figu r e 3. MCH P ackag e Dime nsi ons (S id e Vie w) MCH IHS Handling Excl usio n Are a 42.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 11 Intel ® 5100 MCH Chipse t 2.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 12 Order Number: 318676-003US Note: Thes e s pe ci ficatio ns appl y to uni form co mp ressive loadin g in a dir e c t ion perpe n d ic ular to the IHS top surfa ce.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 13 Intel ® 5100 MCH Chipse t The case-to-local ambient thermal characterization par ameter ( Ψ CA ) is used as a measure of th e thermal perf orm ance o f the ov erall th ermal so lu tion .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 14 Order Number: 318676-003US 2. Define a target local ambient temper ature, T LA . 3. Use Equa tio n 1 and Equat ion 2 to de termin e the req ui r ed therma l p er fo rmance need ed to coo l th e devic e.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 15 Intel ® 5100 MCH Chipse t Ta b l e 4 su m m a r i zes th e therma l bud g et requir e d to ad equ ate ly cool th e Inte l ® 5100 MCH C hipset in one config uration usi ng a TD P of 25 W .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 16 Order Number: 318676-003US 5.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 17 Intel ® 5100 MCH Chipse t Figure 6.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 18 Order Number: 318676-003US 5.1.4 T hermocouple Condit ioning and Preparation 1. Use a calib r ated th ermo couple as sp eci fied in Ta b l e 5 .
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 19 Intel ® 5100 MCH Chipse t 2. P lace the thermoco uple wire i nside t he g roov e le tting the exposed wire an d bead extend about 3.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 20 Order Number: 318676-003US Figure 10.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 21 Intel ® 5100 MCH Chipse t Figure 12.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 22 Order Number: 318676-003US 5.1.6 C uring Process 1. Let the t hermocouple attach sit in the op en air for at least half an hour .
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 23 Intel ® 5100 MCH Chipse t 5.1.7 Thermocouple Wire Management Figure 15. Ther mocou ple Wi re Mana geme nt i n Groo ve Figur e 16.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 24 Order Number: 318676-003US Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below t he IHS top surface by running a flat blade on top of the IHS, for example.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 25 Intel ® 5100 MCH Chipse t The Intel ® 5100 MCH Chipset has a lower TDP than the Intel ® 5000 S eries Chipset and a similar package size.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 26 Order Number: 318676-003US Whe n using heatsi nks tha t.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 27 Intel ® 5100 MCH Chipse t Full mechanical drawings of the thermal solution assemb ly and the heatsink clip are provid ed in Appe ndix A .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 28 Order Number: 318676-003US 6.1.8.1 Effect o f Pressure on TIM Performan ce As mechanical pressure increases on the TIM, the th ermal resistance of the TIM decreases.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 29 Intel ® 5100 MCH Chipse t 6.2 CompactPCI* Referen ce Heatsink Intel has also developed a reference thermal solution compatible with the CompactPCI* form factor .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 30 Order Number: 318676-003US 6.2.2 T hermal Solution Pe rforman ce Characteristics Fig ur e 22 shows the per formance of the CompactPCI* reference heatsink.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 31 Intel ® 5100 MCH Chipse t Appendix A Mechanical Drawings Ta b l e 9 li s ts th e mech a n ic al drawings in clude d in th i s ap pe nd i x.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 32 Order Number: 318676-003US Figure 23.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 33 Intel ® 5100 MCH Chipse t Figur e 24 .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 34 Order Number: 318676-003US Figure 25.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 35 Intel ® 5100 MCH Chipse t Figure 26.
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 36 Order Number: 318676-003US Figure 27.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 37 Intel ® 5100 MCH Chipse t Figur e 28 .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 38 Order Number: 318676-003US Fig ure 29.
Intel ® 5100 Memory Controller Hub Chipset for Communications, Em bedded, and Storage Applications July 2008 TDG Order Number: 318676-003US 39 Intel ® 5100 MCH Chipse t Figur e 30 .
Intel ® 5100 MCH Chipse t Inte l ® 5100 Memory Controller Hub Chipset for Communications, Embedd ed, and Storage Applications TDG July 2008 40 Order Number: 318676-003US Appendix B Thermal Solution Compone nt Suppliers Table 10.
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