Gebruiksaanwijzing /service van het product 5349 van de fabrikant Acer
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Aspire 5349, 5749 & 5749Z SERVICE GUIDE.
ii Revision History Refer to the table below for the upda tes made to this service guide. Service guide files a nd updates are available on the AC ER/CSD W ebsite. For more information, go to http://csd.acer .com.tw .The information in this guide is subject to change without not ice.
iii Conventions The following conventions are used in this manual: W ARNING : ! Indicates a potential for personal injury . CAUTION : ! Indicates a potential loss of data or damage to equipment . IMPORT ANT : + Indicates information that is im portant to know for the proper completion of a procedure, choice of an option, or completing a task .
iv General Information 0 This service guide provides all technical in formation relating to the basic configu ration for Acer’ s global product of fering.
v CHAPTER 1 Hardware Specifications Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Platform . . . . . . . . . . . . .
vi Display Supported Resolution (LCD Supported Resolution) 1-32 Display Supported Resolution (G PU Supported Resolution) 1-32 Mini Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-34 3G Card (not available in this model) .
vii Using DMITools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23 Using STUUID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26 Using the LAN MAC EEPROM Utility . . . . . . . . . . . . . . . .
viii PCH Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34 DIMM (Dual In-line Memo ry Module) Removal . . . . . . . . . . 3-35 DIMM Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-36 Power Board Removal .
ix Undetermined Problems . . . . . . . . . . . . . . . . . . . . . . . . . . 4-16 Post Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17 CHAPTER 5 Jumper and Connector Locations Mainboard Jumper and Connector Locations .
x.
CHAPTER 1 Hardware Specifications.
1-2 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-3 Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-36 VRAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-37 USB Port. .
1-4.
Hardware S pecifications and Config uration s 1-5 Hardware Specifications and Configurations Features 0 Below is a summary of the computer’ s features: Operating System 0 Genuine Windows® 7 .
1-6 Hardware S pecifications and Con figurations T wo bu ilt-in st ereo speakers MS-Sound compatible Built-in microphone Graphics 0 Intel® HD Graphics with 128 MB of dedi cated system memory , supporting Microsoft® DirectX® 10.
Hardware S pecifications and Config uration s 1-7 Wireless and networking 0 WLAN: Acer InviLink™ Nplify™ 802.11b/g/n Wi-Fi CER TIFIED™ Supporting Acer SignalUp™ wireless technology WP AN: Blueto ot h ® 3. 0+HS Bluet o ot h ® 2.
1-8 Hardware S pecifications and Con figurations Input and Controls 0 Keyboard 103-/104-/107- key Acer FineT ip keyboard with independen t standard numeric keypad, international language suppor.
Hardware S pecifications and Config uration s 1-9 Environment 0 T emperature: Operating: 41 F to 95 F (5 C to 35 C) Non-operating: -4 F to 149 F (-20 C to 65 C) Humidity (n.
1-1 0 Hardware S pecifications and Con fig urations Software 0 Productivity Acer Backup Man a ger Acer ePower Management Acer eRecovery Ma na g emen t Adobe® Flash® Playe r 10.
Hardware S pecifications and Config uration s 1-1 1 Notebook T our 0 Figure 1-1. T op ViewT op View T a ble 1-1. T op View # Icon Item Description 1 Integrated webcam W eb camera for video communication (configuration may vary by mode l).
1-1 2 Hardware S pecifications and Con fig urations Note: Color option may depend on the model. 8 Power indicator Indicates the compute r's power status. Battery indicator Indicates the computer's battery status. 1. Charging: The light shows amber when the battery is charging.
Hardware S pecifications and Config uration s 1-13 Figure 1-2. Closed Front V iew T a ble 1-2. Closed Front V iew # Icon Item Description 1 Microphone jack Accepts inputs from external microphon es. Headphone/ speaker/l ine-out jack Connects to audio line-out devices (e .
1-1 4 Hardware S pecifications and Con fig urations Figure 1-3. Rear View Note: Y our computer may be equipped with a dif ferent battery to the one in the picture. T able 1-3. Rear View # Icon Item Description 1 Battery bay Houses the computer's battery pack.
Hardware S pecifications and Config uration s 1-15 Figure 1-4. Left Vi ew T a ble 1-4. Left View # Icon Item Description 1 DC-in jack Connects to an AC adapter . 2 V entilation slots Enable the computer to stay cool, even after prolonged use. 3 External display (VGA) port Connects to a display de vice (e.
1-1 6 Hardware S pecifications and Con fig urations Figure 1-5. Right View T a ble 1-5. Right View # Icon Item Description 1 USB 2.0 ports Connect to USB 2.0 devices (e.g., USB mouse, USB camera). 2 Optical drive Internal optical driv e; accepts CDs or DVDs.
Hardware S pecifications and Config uration s 1-17 Figure 1-6. Base View T a ble 1-6. Base View # Icon Item Description 1 Battery bay Houses the computer's batter y pack. 2 Battery lock Locks the battery in position. 3 V entilation slots Enable the com puter to stay cool, even after prolonged use.
1-1 8 Hardware S pecifications and Con fig urations T ouchpad Basics 0 Figure 1-7. T ouchpad Move your finger across the T ouchpad (1) to move the cursor . Press the left (2) and right (3) buttons located beneath the T ouchpad to perform selection and execution functions.
Hardware S pecifications and Config uration s 1-19 Using the Keyboard 0 The computer has a close- to-full-sized keyboard an d an embe dded numeric keypad, separate cursor , lock, function and special keys. Figur e 1-8. Keyboard Lock Ke ys Lock Keys 0 The keyboard has thre e lock keys which can be toggle d on and of f.
1-2 0 Hardware S pecifications and Con fig urations Windows Keys 0 The keyboard has two ke ys that pe rform Windows-specific fun ctions. Windows Logo key Application ke y Key Description Windows Logo key Pressed alone, this key has the same ef fect as clicking on the Windows Start button; it launches the Start menu.
Hardware S pecifications and Config uration s 1-21 Hotkeys 0 The computer employs hotkeys or ke y combinat ions to access most of the computer's controls like screen brightness and vo lume output. Figure 1-9. Keyboar d Hotkeys T o activate hotkeys, press an d hold the <Fn> key before pressing the other key in the hockey combination.
1-2 2 Hardware S pecifications and Con fig urations Using the communication key* 0 Here you can enable and disable the variou s wireless connectivity devices on your computer . Press < Fn > + < F3 > to bring up the Launch Manager window panel.
Hardware S pecifications and Config uration s 1-23 System Block Diagram Figure 1-10. System Block Diagram P16 USB8 CCD (Camera) SPK P21 Audio CODEC P21 HP Jack MIC Jack DMIC P21 SPI ROM P26 Touch Pad .
1-2 4 Hardware S pecifications and Con fig urations Specification T ables 0 Computer specifications Item Metric Imperial Dimensions Length 381 mm 15 in Width 253 mm 9.96 in Height (front to rear) 29.6/34.7 mm 1.17/1.37 in W eight (equipped with optical drive, flash drive, and battery) 2.
Hardware S pecifications and Config uration s 1-25 System Board Major Chips Processor Item Specification Core logic Intel® Ibex-Peak VGA Integr ated LAN Atheros AR8158L - Mega LAN solution. S5 Wake on LAN. USB 2.0 USB2.0 embedded in PCH Super I/O controller embedded Bluetooth Bluetooth 2.
1-2 6 Hardware S pecifications and Con fig urations Processor Specifications CPU Fan T rue V alue T able (TJ100-CPU) Item CPU Speed (GHz) Core s/ Threads Bus Speed (FSB/ DMI/QBI ) Mfg Te c h (nm) Cache Size Package Vo l t a g e Core i3-2310M 2.10 4 5 GT/s 32 3MB L3 BGA1023 1.
Hardware S pecifications and Config uration s 1-27 CPU Fan T rue V alue T able (TJ85-CPU) System Memory Fan On (°C) Fan Off (°C) Fan Speed (RPM) 45 40 3150 58 52 3500 70 64 3850 78 74 4200 82 80 N/A.
1-2 8 Hardware S pecifications and Con fig urations Memory Combinations Video Interface BIOS Slot 1 (MB) Slot 2 (MB) T otal Memory (MB) 0 1024 1024 1024 0 1024 1024 1024 20 48 0 2048 2048 2048 0 2048 .
Hardware S pecifications and Config uration s 1-29 LAN Interface Keyboard Item Specifi cation LAN Chipset Atheros AR8158-BL1A-RL LAN connector type RJ45 LAN connector location RJ45 at the left side Fe.
1-3 0 Hardware S pecifications and Con fig urations Hard Di sk Drive (A VL components) Item Specification V endor & Model Name To s h i b a MK2559GSXP WD WD2500BPVT -22JJ5T0 HGST HTS543225 A7 A384.
Hardware S pecifications and Config uration s 1-31 LED 15.6” LCD Inverter (not available with this model) Item Specifi cation V endor & Model name AUO B156XW02 SAMSUNG L TN156A T02-A11 SAMSUNG L TN156A T24-A01 LPL P156WH2-TLEA LPL LP156WH4-TLA1 CMO N156B6-L0B Screen Diagonal (mm) 396 Active Area (mm) 222.
1-3 2 Hardware S pecifications and Con fig urations Display Supported Resolution (LCD Supported Resolution ) Graphics Controller Display Supported Resolution (GPU Supported Resolution) Resolution 16 b.
Hardware S pecifications and Config uration s 1-33 Bluetooth Interface Bluetooth Module Item Specifications Chipset Atheros BU22 Broadcom BCM 20702 Broadcom BCM 2070 Atheros BU12 Data through put TX 1.2Mbits/ se c, RX 1. 2Mbits/se c Protocol 3.0 + EDR 3.
1-3 4 Hardware S pecifications and Con fig urations Camera Mini Card 3G Card (not a vailable in this model) Features Bluetooth 3.0 complia nt Point-to-multipoint operation External USB interface for data Onboard antenna and SMA RF connector Coexistence support Controller Atheros BU12 Features Single-chip Bluetooth v2.
Hardware S pecifications and Config uration s 1-35 Audio Codec and Amplifier Item Specification Audio Controller Realtek ALC 271X Features Meets WLP (Windo ws Lo go Program) requirements for Windo.
1-3 6 Hardware S pecifications and Con fig urations Audio Interface Wireless Module 802.11b/g/n Battery Intel low power ECR compliant: s upports power status con trol, jack detection, and wake-up event in D3 mode Built in a 5V -to-4.
Hardware S pecifications and Config uration s 1-37 VRAM USB Port AC Adapter Item Specifi cation Chipset N/A (Shared memory only) Memory size N/A Interface N/A Item Specification USB compliance level Universal Serial Bus 2.0 EHCI 2 Number of USB port(s) 3 Location 1 left side, 2 right side Output Current 1.
1-3 8 Hardware S pecifications and Con fig urations System Power Manage ment Card Reader Item Specifi cation Mech. Off (G3) Al devices in the system are turned off completely . Soft Off (G2/S5) OS initiated shutdown. All devices in the system are turned off completely .
Hardware S pecifications and Config uration s 1-39 System LED Indicator System DMA Specification Item Specifi cation Lock Caps Lock on = Blue System state Blue color on: System on Blue col.
1-4 0 Hardware S pecifications and Con fig urations System Interrupt Specification Ha rdw a re I R Q System Function IRQ00 System timer IRQ01 Standard PS/2 Keyb oard IRQ07 Intel(R) 6 Se ries/C200 Seri.
Hardware S pecifications and Config uration s 1-41 IRQ96 Microsoft ACPI-Compliant System IRQ97 Microsoft ACPI-Compliant System IRQ98 Microsoft ACPI-Compliant System IRQ99 Microsoft ACPI-Compliant Syst.
1-4 2 Hardware S pecifications and Con fig urations IRQ129 Microsoft ACPI-Compliant System IRQ130 Microsoft ACPI-Compliant System IRQ131 Microsoft ACPI-Compliant System IRQ132 Microsoft ACPI-Compliant.
Hardware S pecifications and Config uration s 1-43 IRQ162 Microsoft ACPI-Compliant System IRQ163 Microsoft ACPI-Compliant System IRQ164 Microsoft ACPI-Compliant System IRQ165 Microsoft ACPI-Compliant .
1-4 4 Hardware S pecifications and Con fig urations System I /O A ddress Map I/O address (hex) System Function (shipping configuration) 0000 - 001F Direct memo ry access controller 0000 - 0CF7 PCI bus.
Hardware S pecifications and Config uration s 1-45 System I/O Ad dre s s Map (Continued) I/O address (hex) System Function (shipping configuration) 00B0 - 00B1 Programmable interrupt controller 00B2 -.
1-4 6 Hardware S pecifications and Con fig urations.
CHAPTER 2 System Utilities.
2-2 BIOS Setup Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Navigating the BIOS Ut ility . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 BIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Utilities 2-3 System Utilities BIOS Setup Utility 0 This utility is a hardware config uration pr ogram built into a computer’ s BIOS (Basic Input/Output System). The utility is pre-configured a nd optimized so most users do not need to run it.
2-4 System Utilities BIOS 0 The following is a description of the tabs foun d on the InsydeH20 BIOS Setup Utility screen: NOTE: NOTE : The screens provided are for reference onl y . Actual values may differ by model. Information 0 The Information tab shows a summary of computer hardware info rmation.
System Utilities 2-5 Serial Number Serial number of unit Asset T ag Number Asset tag number of system Product Name Product name of the system Manufacturer Name Manufacturer of system UUID Universally Unique Identifier T able 2-1.
2-6 System Utilities Main 0 The Main tab allows the user to set sys tem time and date, en able or disable boot option and enable or disable recovery . Figure 2-2.
System Utilities 2-7 SA T A Mode Option to set SA T A controller mode Option: AHCI or IDE T able 2-2. BIOS Main (Continued) Parameter Description Format/Option.
2-8 System Utilities Advanced 0 The Advanced tab shows the configuration of system settings, including: Boot configuration Peripheral configuration IDE configuration Therma.
System Utilities 2-9 Security 0 The Security tab shows parameters that safeguard and protect the compu ter fro m unauthorized use. Figure 2-4. BIOS Security T abl e 2-3 describes the para meters shown in Figure 2-4.
2-10 System Utilities NOTE: NOTE : When prompted to enter password, three attempts are allowed befor e system halts. Resetti ng BIOS password may require comput er be returned to dealer . Setting a Password 0 Perform the following to set user or supervisor passwords: 1.
System Utilities 2-1 1 2. T ype current password in Enter Current Password field and press Enter . 3. Press Enter twice without typing anything in Enter New Password and Confirm New Password fields. Computer will set Supervisor Password parameter to Clear .
2-12 System Utilities Figure 2-9. Setup W ar ning: Invalid Passwor d If new password and confirm new password strings do not match, the Setup Warning dialog appears ( Figure 2-10).
System Utilities 2-13 Power 0 The power tab allows you to change the various p ower settings. Figure 2-11. BIOS Power T able 2-4 describes t he para meters shown in Figure 2-11.
2-14 System Utilities Boot 0 The Boot tab allows changes to the order of boo t devices used to load the operating system. Bootable devices inclu de the: USB diskette drives Onboard hard disk drive DVD drive in the module bay Use and keys to select a device and press F5 or F6 to change t he value .
System Utilities 2-15 Exit 0 The Exit tab allows users to save or discard changes and quit th e BIOS Setup Utility . Figure 2-13. BIOS Exit Ta b l e 2 - 5 describes the parame ters in Figure 2-13 . T able 2-5. Exit Parameters Parameter Description Exit Saving Changes Exit BIOS utility and save setup item changes to system.
2-16 System Utilities BIOS Flash Utilities 0 BIOS Flash memory updates are required for the following con ditions: New versions of system programs New features or options Restore a BIOS when it becomes corrupted. Use the Flash utility to update the system BIOS Flas h ROM.
System Utilities 2-17 DOS Flash Utility 0 Perform the following to use the DOS Flash Utility : 1. Press F2 during boot to enter Setup Menu. 2. Select Boot Menu to modify boot priority order . Example: If using USB HDD to Update BIOS, move USB HDD to position 1.
2-18 System Utilities WinFlash Utility 0 Perform the following to use the WinFlash Utility: 1. Double-click Wi nFlash executable (ZQR_1 01W .exe). 2. Click OK to begin update.
System Utilities 2-19 Clearing BIOS Passwords 0 CAUTION : ! If Power- on Pa ssword authentication is enabled , the BIOS password can only be cleared by initiating the Crisis Disk Recovery procedure or flashing the BIOS. See Crisis Disk Recovery . This section provides details about remo ving HDD/BIOS passwords.
2-20 System Utilities Removing BIOS Passwords 0 (Hardware method) T o clear User or Supervis or passwords, remove lower cover and use a metal instrument to short the CMOS jumper . Figure 2-19. CMOS Jumper (Software method) If wrong supervisor pass word is entered three times, th e message System will halt! is displayed on screen.
System Utilities 2-21 If user is unable to obtain correct password then it must be remo ved. There are two methods to d o this. Method 1: 0 If BIOS menu item Power on Password is set to Enabled , then Crisis Recovery disc must be used. Method 2: 0 If BIOS menu item Power on Password is set to Disabled .
2-22 System Utilities Removing Insyde HDD Password 0 Clear the BIOS Password as follows: T o reset the BIOS password, perform the following: 1. When the user keys in the wrong password th ree times, the system reports the error code: Figure 2-22. Unlock Password Pr om pt 2.
System Utilities 2-23 Miscellaneous T ools 0 Using DMIT ools 0 The DMI (Desktop Management Interface ) T ool copies BIOS information to EEP ROM (Electrically Eras able Programmabl e Read-Only Memory).
2-24 System Utilities 3. Press 1 to modify the asset tag key . Figure 2-26. Asset T ag Menu Item 4. Press 2 to modify the product number key . Figur e 2-27.
System Utilities 2-25 5. Press 3 to modify s erial number key . Figure 2-28. Serial Number Menu Item 6. Press 4 to modify the 1394 GUID number key . Figure 2-29.
2-26 System Utilities 8. At the command prompt, type VEEPROM to write any changes in the data to the EEPROM. Figure 2-30. VEEPROM Command Pr ompt NOTE: NOTE : When using an y of th e wr it e op t io n s , restart the system to make the new DMI data eff ective.
System Utilities 2-27 Using the LAN MAC EEPROM Utility 0 Perform the following steps to write MAC (Media Access Control) in formation to EEPROM: Use LAN.
2-28 System Utilities Crisis Disk Recovery 0 1. Plug in the USB flash disk. 2. Select the Fast Format option and click Start . Then click Next . 3. Click Format and then Exit to complete the op eration. 4. Copy the ZQR.f d file to the USB flash disk root directory and rename to BIOS.
CHAPTER 3 Machine Maintenance Procedures.
3-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Recommended Equipment . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Maintenance Flowchart .
3-3 LCD Module Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-43 LCD Bezel Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-44 LCD Bezel Installation . . . . . . . . . . . . . . . . . . . . . . . .
3-4.
Machine Maintenance Procedure s 3-5 Machine Maintenance Procedures Introduction 0 This chapter contains general information a bout the compu ter , a list of tools needed to do the required maintenan ce a nd step by s tep proce dure s o n how to re move and ins tall components from the computer .
3-6 Machine Maintenance Proced ures Maintenance Flowchart 0 The flowchart in Fi gur e 3-1 shows a graphi c representation of the module removal and installation sequences. It shows information on what components may need to be removed and installed during servicing.
Machine Maintenance Procedure s 3-7 Getting Started 0 Flowchart Figure 3-1 identifies sections for the remova l and install sequence. Follow the order of the sequence to avoid damage to any of the hardware components. Do the following prior to starting any maintenance procedures: 1.
3-8 Machine Maintenance Proced ures Battery Pack Removal 0 1. Place computer on flat surface, battery side up. 2. Push battery lock/unlock latch (A) to unloc k position (Figur e 3-3). 3. Push and hold battery releas e latch (B) to release po sition (Figure 3-3).
Machine Maintenance Procedure s 3-9 Dummy Card Removal 0 1. Push the dummy card (A) in to releas e it from the spring latch (Figure 3-4). 2. Remove the dummy card (A) (Figure 3-4). Figure 3-4. Dummy Card Dummy Card Installation 0 1. Insert the dummy card (A) (Figure 3-4).
3-1 0 Machine Maintenance Proced ures Keyboard Removal 0 Prer equisite: Battery Pack Removal 1. Release six (6) latches from the keyboard (Figure 3-5). Figure 3-5. Keyboar d Latches 2. T urn the keyboard over so that the keys are face down on the uppe r case (C) (Figure 3 -6).
Machine Maintenance Procedure s 3-1 1 CAUTION : ! Keyboard FP C (Flexib le Printed Circuit) ca n be damag ed if remo ved while the mainboard connector is locked. Keyboard Installation 0 1. Put the keyboard face down on the upper case (C). Refer to Figure 3-6 .
3-1 2 Machine Maintenance Proced ures UpperCase Screws and FFC Removal 0 Prer equisite: Keyboard Removal 1. Disconnect the touchpad cable (A), speak er cable (B) and power cab le (C) (Figure 3-7). Figure 3-7. Base Cover Screw Remova l 2. Remove the four (4) screws fro m the upper case (Figure 3-7).
Machine Maintenance Procedure s 3-13 ODD (Optical Disk Drive) Module Removal 0 Prer equisite: Battery Pack Removal 1. Remove one (1) screw (A) from lower cover (Figure 3-8 ) . Figure 3-8. ODD Module in Lower Cover 2. Remove ODD module from ODD bay (B) (Fi g ure 3-8 ) .
3-1 4 Machine Maintenance Proced ures 4. Remove two (2) screws (E) from ODD module (Figure 3-10). 5. Remove ODD bracket (D) from ODD module (Figure 3-10). Figure 3-10. ODD bracket Removal ODD Module Installation 0 1. Install the ODD bracket (D) to the ODD module.
Machine Maintenance Procedure s 3-15 Base Cover Removal 0 Prer equisite: ODD (Optical Disk Drive) Module Removal 1. Remove twentythree (23) screws from t he lower case (Figure 3-11). 2. Remove the base cover . Figure 3-11. Outside Screws Base Cover Installation 0 1.
3-1 6 Machine Maintenance Proced ures USB Module Removal 0 Prer equisite: Base Cover Removal 1. Disconnect USB module FFC (A) from USB module connector (B) (Figure 3-12 ) . 2. Disconnect and remove USB module FFC (A) from mainboa rd connector (C)(Figure 3-12 ) .
Machine Maintenance Procedure s 3-17 3. Remove screw (D) from lower cover ( Figure 3-13 ) Figure 3-13. USB screw 4. Remove USB module from lower cas e. USB Module Installation 0 1. Install USB module on lowe r cover . 2. Install and secure screw (D) to lower cover (Figure 3-13).
3-1 8 Machine Maintenance Proced ures HDD (Hard Disk Drive) Removal 0 Prer equisite: USB Module Removal 1. Using the pull-tab, slide the HDD module in the direction of the arrow to disconnect the interface. (Figure 3-14 ) . Figure 3-14. HDD Location 2.
Machine Maintenance Procedure s 3-19 3. Remove four (4) screws (A) from HDD brack e t (B) Figu r e 3-15. Figure 3-16. HDD Module 4. Remove HDD bracket (D) from HDD module. Hard Disk Drive Installation 0 1. Put HDD brackets ont HDD module ( Figure 3-16 ).
3-2 0 Machine Maintenance Proced ures R TC (Real T ime Clock) Battery Removal 0 Prer equisite: Base Cover Removal 1. Lift the RTC batt ery away from the mainboard (Figure 3-18 ). Figure 3-17. RTC battery IMPORT ANT : + Follow local regulations for batter y (C) disposal (Figure 3-17).
Machine Maintenance Procedure s 3-21 WLAN (Wireless Local Area Network) Module Removal 0 Prer equisite: Base Cover Removal 1. Find the WLAN module (B ) (Figure 3-18 ). 2. Disconnect antenna cables (A) from module ( Figure 3- 18 ) . Figure 3-18. WLAN Module 3.
3-2 2 Machine Maintenance Proced ures Figure 3-19. WLAN Module 4. Disconnect antenna cables (D) from module ( Figure 3- 20 ) . Figure 3-20. WLAN Module 5.
Machine Maintenance Procedure s 3-23 Figure 3-21. WLAN Module WLAN Module Installation 0 1. Place the WLAN module into the mainboard conne ctor (E ). Refer to Figure 3-21 . 2. Secure the antennas to the cable guid es on the thermal module. Refer to Figure 3-20.
3-2 4 Machine Maintenance Proced ures Bluetooth Module Removal 0 Prer equisite: Base Cover Removal 1. Find the Bluetooth Module on the lower case (A) (Figure 3-22). 2. Disconnect the Bluetooth cable (B) fro m the mainboard connector (C). Figure 3-22. Bluetooth Module 3.
Machine Maintenance Procedure s 3-25 4. Remove the Bluetooth Module from the lower case. 5. Disconnect the bluetooth cable (B) fro m the bluetooth module (E) (Figure 3-24). Figure 3-24. Bluetooth Module Bluetooth Module Installation 0 1. Connect the Bluetooth cable (B) to the bluetooth module (Figure 3-23).
3-2 6 Machine Maintenance Proced ures Thermal Module Removal 0 Prer equisite: Base Cover Removal 1. Disconnect the thermal fan cable ( A) from the mainboard connecto r (B) ( Figure 3-25 ). 2. Remove four (4) screws from the the rmal module ( Figure 3-25).
Machine Maintenance Procedure s 3-27 3. Remove the thermal module from the mainboard as shown in Figure 3-26. Figure 3-26. Thermal Module Removal Thermal Module Installation 0 IMPORT ANT : + Apply approved thermal grease and ensure all heat pad s are in position before replacing module.
3-2 8 Machine Maintenance Proced ures ID Size Quantity Screw T ype Red Call out M2.5*3. 5 4.
Machine Maintenance Procedure s 3-29 Mainboard Removal 0 Prer equisite: Bluetooth Module Removal 1. Find the mainb oard on the l ower case (Figur e 3-27) . Figure 3-27. Mainboar d Location 2. Disconnect the speaker cable from the mainb oard connector (A) (Figure 3-27).
3-3 0 Machine Maintenance Proced ures Figure 3-28. Mainboar d IMPORT ANT : + The mainboard is shown in the above image. Please follow local regulations for dispos al. Mainboard Installation 0 1. Place the mainboard onto the lower case (Figure 3-2 7) .
Machine Maintenance Procedure s 3-31 CPU (Central Processing Unit) Removal 0 Prer equisite: Mainboard Removal 1. Using a slotted screw driver , rotate the CPU camlock (A) 180° counter -clockwise ( Figure 3-29 ) . Figure 3-29. CPU Removal 2. Carefully lift the CPU clear of the socket ( Figure 3-30 ) .
3-3 2 Machine Maintenance Proced ures IMPORT ANT : Place the CPU on a clean, dry surface when i t is not installed. CPU Installation 0 1. Place the CPU into the CPU socket ( Figure 3-29 ). 2. Using a slotted screw driver , rotate the CPU locking screw 180° clockwise to secure it in the package .
Machine Maintenance Procedure s 3-33 PCH (Platform Controller Hub) Removal 0 Prer equisite: Mainboard Removal 1. Find the PCH (A). Refer to Figure 3-31. 2. Remove the two (2) screws from the mainboard (Figure 3-31). Figure 3-31. PCH screws Removal 3. Remove the PCH by lifting it from the mainboard (Figure 3-32).
3-3 4 Machine Maintenance Proced ures PCH Installation 0 1. Place the PCH onto the mainbo ard ( Figure 3-32 ). 2. Install and secure two (2) screws to th e mainboard (Figure 3-31). 3. Install the mainboard. ID Size Quantity Screw T ype Red Call out M2.
Machine Maintenance Procedure s 3-35 DIMM (Dual In-line Mem ory Module) Removal 0 Prer equisite: Mainboard Removal 1. Push out the release latches on both sides of the DIMM socket to release the DIMM module ( Figure 3-33 ) . Figure 3-33. DIMM Removal 2.
3-3 6 Machine Maintenance Proced ures DIMM Installation 0 1. Connect the DIMM to the mainboard connecto r (B). Refer to Figure 3-34 . 2. Push down on the DIMM until the module clips (A) lock into position. R efer to Figure 3-34 . 3. Install the mainboard.
Machine Maintenance Procedure s 3-37 Power Board Removal 0 Prer equisite: Mainboard Removal 1. Remove the two (2) screws from the power board ( Figure 3-35) . Figure 3-35. Power boar d screws r e moval 2. Remove the power board by lifting it from the lower case ( Figure 3-36) .
3-3 8 Machine Maintenance Proced ures Power Board Installation 0 1. Place the power board onto the lower case and press down to secure it. Refer to Figure 3-36. 2. Install and secure two (2) screws to the power board. Refer to Figure 3-35 3. Install the mainboard.
Machine Maintenance Procedure s 3-39 DC-in Jack Removal 0 Prer equisite: Mainboard Removal 1. Remove the DC-in jack by lifting upwards from the lower case ( Figure 3-37) . Figure 3-37. DC-in jack r emoval 2. Remove the bracket from the DC-in jack ( Figure 3-38) .
3-4 0 Machine Maintenance Proced ures DC-in Jack Installation 0 1. Place the br acket on the DC-i n jack. Refer to Figure 3-38 2. Place the DC-i n jack onto th e lower case and press down to secure it.
Machine Maintenance Procedure s 3-41 Speakers Removal 0 Prer equisite: Mainboard Removal 1. Remove the speakers by lifting upwards from the lower case ( Figure 3-39) . Figure 3-39. Speakers Speakers Installation 0 1. Place the speakers onto the lower case and press down to secure it.
3-4 2 Machine Maintenance Proced ures LCD (Liquid Crystal Display) Module Removal 0 Prer equisite: Base Cover Removal 1. Remove the two (2) screws (A) from the LCD hinge s (Figure 3-40). Figure 3-40. LCD Hinge Scr ews 2. Lift the lower case upward from the LCD module (Figure 3-41).
Machine Maintenance Procedure s 3-43 CAUTION : ! Make sure all ca bles are moved away from the device to avoid damage during removal. LCD Module Installation 0 1. Align the LCD hinges with the hinge guides on the lower case. 2. Install and secure two(2) screws (A).
3-4 4 Machine Maintenance Proced ures LCD Bezel Removal 0 Prer equisite: LCD Module Removal 1. Remove two (2) screws from the LCD module (Figure 3-42). Figure 3-42. LCD Bezel Scr ews 2. Pry the bezel upwards at the bas e of the LCD module releasing it from the latches (Figure 3-43 ).
Machine Maintenance Procedure s 3-45 3. Continue along the sides of the bezel un ti l all the latches have been released (Figure 3-44). Figure 3-44. LCD Bezel Removal 4. Lift the bezel from LCD module. LCD Bezel Installation 0 1. Put LCD beze l on the LCD module.
3-4 6 Machine Maintenance Proced ures Camera Module Removal 0 Prer equisite: LCD Bezel Removal 1. Lift the cameral module from the LCD cover (Figure 3-45). Figure 3-45. Camera Module Removal 2. Disconnect the cable as shown (Figure 3-46). Figure 3-46.
Machine Maintenance Procedure s 3-47 3. Remove the camera module from the LCD cover . Camera Module Installation 0 1. Connect the camera cable. Refer to Figure 3-46. 2. Place the camera module on the LCD module. Refer to Figu re 3-45 . 3. Install the LCD bezel.
3-4 8 Machine Maintenance Proced ures LCD Panel Removal 0 Prer equisite: LCD Bezel Removal 1. Remove the LCD cable (A) (Figure 3-47). Figure 3-47. Camera Disconnect 2. Remove the four (4) screws (Figure 3-48). Figure 3-48. LCD Panel Scr ews 3. Remove the LCD panel from the LCD cover .
Machine Maintenance Procedure s 3-49 LCD Panel Installation 0 1. Place the LCD panel on the LCD cover . Refer to Figure 3-48 . 2. Install and secure four (4) screws to the LCD panel. R efer to Figure 3- 48 . 3. Connect the camera cable (A) to th e camera connector (B).
3-5 0 Machine Maintenance Proced ures LCD Hinge Removal 0 Prer equisite: LCD Panel Removal 1. Remove the three ( 3) screws on each side of the hinge ( Figure 3-49). Figure 3-49. LCD Hinges 2. Remove LCD hinges from the LCD module. LCD Hinge Installation 0 1.
Machine Maintenance Procedure s 3-51 L VDS Cable Removal 0 Prer equisite: LCD Panel Removal 1. Remove the top mylar (A) and the adhe sives on the rear of the LCD panel (Figure 3-50 ).
3-5 2 Machine Maintenance Proced ures 2. Remove the bottom mylar and disconnect the L VDS cable from the LCD panel connector (B) ( Figure 3-51 ). Figure 3-51. L VDS Cable Connector L VDS Cable Installation 0 1. Place the L VDS cable into the LCD panel connector (B) and secure the bottom mylar tape (C) ( Figure 3-51 ).
CHAPTER 4 T roubleshooting.
4-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Power On Issues . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
T r oubleshooting 4-3 T roubleshooting Introduction 0 This chapter contains informat ion about troubles hooting common problems associated with the notebook . General Information 0 The following pro cedures are a guide f or troubleshooting comput er problems.
4-4 T r oubleshooting Power On Issues 0 If the system does not power on, perform the following: Figure 4-1. Power On Issue Computer Shuts Down Intermittently 0 If the system powers off at intervals, perform t he following. 1. Makes sure the power cable is properly connected to the comp uter and the electrical outlet.
T r oubleshooting 4-5 No Display Issues 0 If the Display does not work, perform the following: Figure 4-2. No Display Issue No POST or V ideo 0 If the POST or video does not appear , perform the following: 1. Make sure that internal display is select ed.
4-6 T r oubleshooting 4. Connect the power and reboo t the computer . 5. Connect an external monitor to the com puter and switch between the internal display and the external display is by pressing Fn+F5 . 6. If the POST or video appears on th e external display only , refer to LCD Failure .
T r oubleshooting 4-7 9. If the issue is still not resolved, refer to Online Support Information ..
4-8 T r oubleshooting LCD Failure 0 If the LCD fails, perform the following: Figure 4-3. LCD Failure.
T r oubleshooting 4-9 Keyboard Failure 0 If the Keyboard fails, perform the following: Figure 4-4. Keyboar d Failur e No No START Keyboard FPC well connected? Connect it well Keyboard OK? Replace keyb.
4-10 T r oubleshooting T ouchpad Failure 0 If the T ouchpad fails, perform the following: Figure 4-5. T ouchpad Failure Sta rt OK NG OK NG Check M/ B T/P FFC Re- ass emble t he T/P FFC to M/B Check To.
T r oubleshooting 4-1 1 Internal Speaker Failure 0 If internal Speakers fail, p erform the following: Figure 4-6. Internal Speaker Failure Sound Problems 0 Perform the following, one at a time. 1. Boot the c omputer . 2. Navigate to Start Control Pane l Sy stem and Maintenance Sy stem Device Manager .
4-12 T r oubleshooting that Speakers are sele cted as the default audio device (green check mark). NOTE: NOTE : If Speakers d oes not show , right- click on the Playback tab and se lect Show Disabled Devices (clear by default). 7. Select Speakers and click Configure to start Speaker Setup .
T r oubleshooting 4-13 Microphone Failure 0 If internal or external Microphones fail, perform the following: Figure 4-7. Microphone Failure 1. Check that the microphone is enabled. Naviga te to Start Control Panel Ha rd wa re and Sound Sound and select the Recording tab.
4-14 T r oubleshooting USB Failure 0 If the USB fails, perform the following: Figure 4-8. USB Failure Sta r t Ch ec k USB/B to M/ B cab le Re- ass emble t he US B/ B cab le to M /B OK NG Check US B/ B.
T r oubleshooting 4-15 Other Functions Failure 0 1. Check if drives are functioning correctly . 2. Check if external mo dules are functio ning correctly .
4-16 T r oubleshooting Intermittent Problems 0 Intermittent system hang problems ca n be caused by a variety of reasons that have nothing to do with a hardware defect, such as: cosmic radiati on, el ectrost atic discharge, or software errors. FRU replaceme nt should be considered only when a recurr in g problem exists.
T r oubleshooting 4-17 Post Codes 0 The following are the InsydeH2O™ Functionality POST code tables. The components of the POST code table includes: SEC phase, PEI phase, DXE phase, BDS phase, CSM functions, S3 functions and ACPI functions. T able 4-2.
4-18 T r oubleshooting SEC_GO_TO_SECST ARTUP SEC 09 Setup BIOS ROM cache SEC_GO_TO_PEICORE SEC 0A Enter Boot Firmware V olume * 3rd party relate functions – Platform depende nce. T able 4-4. PEI Phase POST Code T able Functionality Name (Include PostCode.
T r oubleshooting 4-19 PEI_RECOVER Y_LOAD_FILE_DONE PEI 87 Load Recovery Image completed PEI_RECOVERY_ST ART_FLASH PEI 88 Start Flash BI OS with Recovery image PEI_ENTER_DXEIPL PEI 89 Loading BIOS ima.
4-20 T r oubleshooting DXE_PCRTC_INIT DXE 52 RTC Initialization DXE_SA T A_INIT* DXE 53 S A T A Controller early Initializ ation DXE_SMM_CONTROLER_INIT* DXE 54 Setup SMM Control service DXE_LEGACY_INT.
T r oubleshooting 4-21 BDS_CONNECT_STD_ERR BDS 18 Error report device initializ ation BDS_CONNECT_USB_HC BDS 19 USB host controller initializ ation BDS_CONNECT_USB_BUS BDS 1A US B BUS driver initializ.
4-22 T r oubleshooting BDS_LEGACY_BOOT_ EVENT BDS 33 Last Chipset initial before boot to Legacy OS. BDS_ENTER_LEGACY_16_BOOT BDS 34 Ready to Boot Legacy OS. BDS_RECOVERY_ST ART_FLASH BDS 35 Fast Recovery Start Flash. * 3rd party relate functions – Platform depende nce.
T r oubleshooting 4-23 S3_AFTER_R ESTORE_ACPI_ CALLBACK PEI CA Rest ore system configuration in SMM comp lete S3_GO_TO _FACS_WAKING_VECTOR PEI CB Bac k to OS T able 4-9.
4-24 T r oubleshooting Used by Insyde debugger 0xD0 Waiting for device con nect Used by Insyde debugger 0xD1 InsydeH2ODDT Ready Used by Insyde debu gger 0xD2 EHCI not fo und Used by Insyde debugger 0x.
CHAPTER 5 Jumper and Connector Locations.
5-2 Mainboard Jumper and Connector Locations . . . . . . . . . 5-3 Clearing Password Check and BIOS Recovery . . . . . . . . . 5-5 Clearing Password Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5 Clear CMOS Jumper . . . . . . . . .
Jumper and Connector Locati ons 5-3 Jumper and Connector Locations Mainboard Jumper and Connector Locations 0 Figure 5-1. Mainboar d T op T able 5-1. Mainboar d T op Item Description Item Description .
5-4 Jumper and Connector Locations Figure 5-2. Mainboar d Bottom T able 5-2. Mainboar d Bottom Item Description Item Description 8 Bat tery Conn ector 16 USB Connector 9 DC C onnector 17 Microphone Co.
Jumper and Connector Locati ons 5-5 Clearing Password Check and BIOS Recovery 0 This section provides users with the standar d operatin g procedures of clearing password and BIOS recove ry for the Aspire 534 9/5749/5749 Z.
5-6 Jumper and Connector Locations Clear CMOS Jumper 0 Figure 5-3. CMOS Jumper BIOS Recovery by Crisis Disk 0 BIOS Recovery Boot Block 0 BIOS Recovery Boot Block is a specia l block of BIOS. It is used to boot up the system with minimum BIOS initializa tion.
Jumper and Connector Locati ons 5-7 Steps for BIOS Recove ry from USB Storage 0 NOTE: NOTE : Prior to performing the recovery , prepare a Crisis USB key . The Crisis USB key is created by executing the Crisis Disk program on another system with Windows 7 OS.
5-8 Jumper and Connector Locations.
CHAPTER 6 FRU (Field Replaceable Unit) List.
6-2 Exploded Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4 FRU List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7 Screw List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FRU (Field Repla ceable Unit) List 6-3 FRU (Field Replaceable Unit) List This chapter provides users with a FRU (F ield Replaceable Unit) listing in global configurations for the Aspire 5349/5749/57 49Z. Refer to this chapter whenever ordering for parts to repair or for RMA (Return Merchandise Autho rization).
6-4 F RU (Field Repla ceable Unit) List Exploded Diagrams 0 Figure 6-1. Upper & Lower Cover Exploded Diagram T able 6-1. Upper & Low er Co ver Exploded Diag ram No.
FRU (Field Repla ceable Unit) List 6-5 6 H DD Module 23ZRLHDTN20 7 Ba se Cover 2IZRLBA TN00 8 RAM (1GB) A TR31ABMF 33 9 RAM (4GB) A TR34AAM F04 10 WLAN 3WZRL WL TN00 11 Bluetooth 3XZRLBTTN00 12 Mainboard 20ZRLBU0000 T able 6-1. Upper & Low er Co ver Exploded Diag ram No.
6-6 F RU (Field Repla ceable Unit) List Figure 6-2. LCD Assembly Exploded Diagram T able 6-2. LCD Assembly Exploded Diagram No. Description Acer Part No.
FRU (Field Repla ceable Unit) List 6-7 FRU List 0 T a ble 6-3. FRU List Category Description Acer Part No. ADAPTER Adapter DEL T A 65W 19 V 1.7x5.5x11 Y ellow ADP-65VH BA, L V5, Low profile LED LF AP .06501.033 Adapter LITE-ON 65W 19V 1.7x5.5x11 Y ellow P A-1650-69AW , L V5, Low profile LED LF AP .
6-8 F RU (Field Repla ceable Unit) List Lan Intel WL AN 100BN.HM WG Crane Peak 1x1 BGN KI.CNH01.002 Liteon Wireless LAN Atheros HB 125 1x1 BGN NI.23600.086 liteon WLAN 802.11 B/G/N WN6606LH-AA NI.23600.088 Foxconn Wirelss LAN Broadcom 43 13 1x1 BGN (HM) T77H194.
FRU (Field Repla ceable Unit) List 6-9 CABLE - FFC USB 50.NCE07.00 3 CABLE - FFC TP 50.NCE07.001 CASE/COVER/BRACKET ASSEMBL Y LOWER CASE 60.RR907.003 DUMMY CARD 42.TVM07.002 ODD BEZEL - SUPER MUL TI 42.NC E07.001 ODD BRACKET 33.PUM07.001 HDD BRACKET 33.
6-1 0 FRU (Field Rep la ceable Unit) List CCD Liteon CAMERA 10P2SF005 (0.3 M)LOE AM.21400.078 CPU/PROCESSOR CPU Intel C ore i3 i3-231 0M PGA 2.1G 35W 2/4-QS KC.23101.DMP CPU Intel C ore i3 i3-233 0M PGA 2.2G 35W 2/4-QS KC.23301.DMP CPU Intel Core i3 i3- 2350M PGA 2.
FRU (Field Repla ceable Unit) List 6-1 1 ODD P ANA SONIC Super-Multi DRIVE 12.7mm T ray DL 8X UJ8B0 LF W/O bezel SA T A (HF + ZP) Foxconn Y entai Facotry KU.00807.078 ODD P ANA SONIC Super-Multi DRIVE 12.7mm T ray D L 8X UJ8B0AW LF+HF W/O bezel SA T A (Win7) KU.
6-1 2 FRU (Field Rep la ceable Unit) List HDD TOSHIBA 2.5" 5400rpm 750 GB MK7559GSX, 375G/P , Capricorn BS, 4K drive SA T A 8MB LF+HF F/W:GNDD3J KH.75004.001 HDD WD 2.5" 5400rpm 250GB WD2500BPVT -22JJ5T0, ML320S-AF2 , 320G/P , 4K drive SA T A 8MB LF+HF F/W:01.
FRU (Field Repla ceable Unit) List 6-1 3 PCH HEA T SINK 60.PUM07. 006 KEYBOARD Keyboard ACER AC7T_A10 B AC7T Internal 17 Standard 103KS Black US Internatio nal T exture KB.I170A.14 3 K/B(UI)ZR7(AEZR 7R00,3B)JMO KB.I 170A.143 Keyboard ACER AC7T_A10 B AC7T Internal 17 Standard 104KS Black UK T exture KB.
6-1 4 FRU (Field Rep la ceable Unit) List MEMOR Y Memory NANY A SO-DIM M DDRIII 1333 1GB NT1GC64BH4B0PS-CG LF 128*16 0.055 um KN.1GB 03.034 Memory KINGSTON SO-DIMM DDRIII 1333 1GB ACR1 28X64D3S 1333C9 L F 128*8 0.065um KN.1GB07.004 Memory UNIFOSA SO-DI MM DDRIII 1333 1GB GU672203EP0200 LF 12 8*8 0.
FRU (Field Repla ceable Unit) List 6-1 5 BASE FOOT RUBBER REAR 47.NCE07.004 MYLAR COVER LOGO MYLAR 40.RR907.002 ZRD BASE S UB ASSY JE S.P 60.NCE07.002 TP PROTECT MYLAR 47.R6Z07.00 4 LCD SCREW MYLAR 47.R6Z07.00 3 SPEAKER SPEAKER 23.RR907.00 1 T a ble 6-3.
6-1 6 FRU (Field Rep la ceable Unit) List Screw List 0 T a ble 6-4. Screw List CA TEGOR Y Description Acer Part No. SCREW M3*0.5+3 .5I 86.TDY07.00 3 SCREW M2.5*6-I(BNI)(NYLOK) 86.A08V7.004 SCREW M2.5 X4-I-NYLOK K 86.T23V7. 009 SCREW M2.5*6-I(BNI)(NYLOK) 86.
CHAPTER 7 Model Definition and Configuration.
7-2 Aspire 5349 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3 Aspire 5749Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-5 Aspire 5749 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Model Definition a nd Configuration 7-3 Model Definition and Configuration Aspire 5349 0 T able 7-1. RO, Description Model RO Country Acer Part No Desc ription AS5349-B802 G50Mikk TWN GCTWN LX.RR902.008 AS5349-B802G5 0Mikk W7HP64ASTW1 MC UMACkk_3 1*2G/500/BT/ 6L2.
7-4 Model Definition and Con figu ration AS5349-B802 G32Mikk EMEA Middle East LX.RR908.001 AS5349-B802G32Mikk EM W7ST32EMASME1 MC UMACkk_3 1*2G/320/6L2 .2/2R/CB_GN_0.3 C_AN_ARA1SP1 AS5349-B804 G50Mikk EMEA Germany LX.RR902.003 AS5349-B804G50Mikk W7HP64ASDE1 MC UMACkk_3 1*4G/500_L/6L2.
Model Definition a nd Configuration 7-5 Aspire 5749Z 0 T able 1-2. RO, Description Model RO Country Acer Part No Description AS5749Z-B95 3G32Mikk EMEA Russia LX.RR 801.002 AS5749Z-B9 53G32Mikk W7HB64RUA SRU1 MC UMACkk_3 2G+1G/320/6L2.2/2R /CB_GN_0. 3C_AN_RU11SP1 AS5749Z-B95 4G32Mikk EMEA Serbia/Bosni a- Herzegovina LX.
7-6 Model Definition and Con figu ration AS5749Z-B94 2G25Mikk AAP J apan LX.RR8 02.004 AS5749Z-B942 G25Mikk W7HP64AJP 1 MC UMACkk _3 1*2G/250/BT/ 6L2.2/2R/CB_GN_ 0.3C_outer_AN_JA11SP1 _CA92 5 AS5749Z-B94 2G32Mikk AAP J apan LX.RR8 02.003 AS5749Z-B942 G32Mikk W7HP64AJP 1 MC UMACkk _3 1*2G/320/BT/ 6L2.
Model Definition a nd Configuration 7-7 Aspire 5749 0 T able 1-3. RO, Description Model RO Country Acer Part No Description AS5749-2333 G32Mikk EMEA Russia LX.RR701.002 AS5749-2333G32Mikk W7HB64RUA SRU1 MC UMACkk_3 2G+1G/320/6L2.2/2R /CB_GN_0. 3C_AN_RU11SP1 AS5749-2334 G50Mikk EMEA Spain LX.
7-8 Model Definition and Con figu ration.
CHAPTER 8 T est Compatible Components.
8-2 Microsoft® Windows® 7 Environmen t Test . . . . . . . . . . . 8-4.
T est Compatible Comp onents 8-3 T est Compatible Components This computer’ s compatibility is te sted and verified by Acer’ s internal testing department. All of its sys tem functions are tested under Windows ® 7 environment. Refer to the following lists for components, adapter cards, and periph erals which have passed these tests.
8-4 T est Compatible Comp one nts Microsoft ® Windows ® 7 Environment T est 0 T able 1-1. T est Compatible Com ponents Ve n d o r Ty p e Description Acer Part No. Adapter 10001023 LITE-ON 65W Adapter LITE-O N 65W 19V 1.7x5.5x11 Y ellow P A-1 650-69A W , L V 5, Low profile LED LF AP .
T est Compatible Comp onents 8-5 Blueto oth 10001018 HON HAI BT 4.0 BT 4.0 Foxconn Atheros BU22 BH.21100.017 10001018 HON HAI BT 4.0 BT 4.0 Foxconn BCM 20702 BH.21100.018 10001018 HON HAI BT 3.0 Foxconn Bluetooth A TH BU12 BH.21100.011 10001018 HON HAI BT 3.
8-6 T est Compatible Comp one nts CPU 10001067 INTEL Ci32310M CPU Intel Core i 3 i3-2310M PGA 2.1G 35W 2/4 KC.23101.DMP 10001067 INTEL Ci32330M CPU Intel Core i 3 i3-2330M PGA 2.2G 35W 2/4 KC.23301.DMP 10001067 INTEL PMDB940 CPU Intel Pentium Dual -Core B940 PGA 2.
T est Compatible Comp onents 8-7 60002005 HGST SG N320GB5.4KS HDD HGST 2.5" 5400 rpm 320GB HTS543232 A7 A384, Eagle B7, 320G/P SA T A LF+HF F/W :A60W KH.32007.013 60001994 WD N320 GB5.4KS_ 4K HDD WD 2.5" 5400rpm 3 20GB WD3200BPVT -22JJ5T0, ML320S-AF2, 320G/ P , 4K drive SA T A 8MB LF+HF F/W :01.
8-8 T est Compatible Comp one nts 60001922 TOSHIBA DI GI N750GB5.4KS_ 4K HDD TOSHIBA 2.5" 5400rpm 750GB MK7559GSXP , 750G, Capricorn 3BS SA T A 8MB LF+HF F/W :GN001A for exteral HDD market only KH.75004.003 60002005 HGST SG N750GB5.4KS_ 4K HDD HGST 2.
T est Compatible Comp onents 8-9 60004864 DARFON AC7T_A10B Keyboard ACER AC7T _A10B AC7T Internal 17 Standard Blac k NONE Y2010 Acer T exture KB.I170A.143 LAN 10017383 Atheros AR8158L Atheros AR8158L NI.22400.0 58 LCD 60003316 AUO NLED15.6WXG AG LED LCD AUO 15.
8-1 0 T est Compatible Comp one nts 60024207 KINGSTON-F AR EAST SO4GBIII13 Memory KINGSTON SO-D IMM DDRIII 133 3 4GB ACR512X64D 3S13C9G LF+H F KN.4GB07.001 60004668 ELP IDA SO4GBIII13 Memory ELPIDA SO -DIMM DDRII I 1333 4GB EBJ41UF8BCS0-DJ- F LF 256*8 46nm KN.
T est Compatible Comp onents 8-1 1 60001535 P ANA SONIC NSM8XS ODD P ANASONIC Super-Mu lti DRIVE 12.7mm T ray DL 8X UJ8A0 LF W/O bezel SA T A (HF + Windows 7) Foxconn Y entai Facotry KU.00807.075 60001535 P ANA SONIC NSM8XS ODD P ANASONIC Super-Mu lti DRIVE 12.
8-1 2 T est Compatible Comp one nts 10000105 WNC PIF A PIF A LZ.23500.006 Wireless LAN 10001067 INTEL 3rd WiFi 1x1 BGN Lan Intel WLAN 100BN.HMWG Crane Peak 1x1 BGN KI.CNH01.002 10001023 LITE- ON 3rd WiFi 1 x1 BGN Liteon Wireless LAN Atheros HB125 1x 1 BG N NI.
CHAPTER 9 Online Support Information.
9-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3.
Online Support In formation 9-3 Online Support Information Introduction 0 This section describes on line technical support se rvices availa ble to help users repair their Acer Systems. For distributors, dealers, ASP or TPM, please refer the technical queries to a local Acer branch of fice.
9-4 Online Support Inform ation.
Een belangrijk punt na aankoop van elk apparaat Acer 5349 (of zelfs voordat je het koopt) is om de handleiding te lezen. Dit moeten wij doen vanwege een paar simpele redenen:
Als u nog geen Acer 5349 heb gekocht dan nu is een goed moment om kennis te maken met de basisgegevens van het product. Eerst kijk dan naar de eerste pagina\'s van de handleiding, die je hierboven vindt. Je moet daar de belangrijkste technische gegevens Acer 5349 vinden. Op dit manier kan je controleren of het apparaat aan jouw behoeften voldoet. Op de volgende pagina's van de handleiding Acer 5349 leer je over alle kenmerken van het product en krijg je informatie over de werking. De informatie die je over Acer 5349 krijgt, zal je zeker helpen om een besluit over de aankoop te nemen.
In een situatie waarin je al een beziter van Acer 5349 bent, maar toch heb je de instructies niet gelezen, moet je het doen voor de hierboven beschreven redenen. Je zult dan weten of je goed de alle beschikbare functies heb gebruikt, en of je fouten heb gemaakt die het leven van de Acer 5349 kunnen verkorten.
Maar de belangrijkste taak van de handleiding is om de gebruiker bij het oplossen van problemen te helpen met Acer 5349 . Bijna altijd, zal je daar het vinden Troubleshooting met de meest voorkomende storingen en defecten #MANUAl# samen met de instructies over hun opplosinge. Zelfs als je zelf niet kan om het probleem op te lossen, zal de instructie je de weg wijzen naar verdere andere procedure, bijv. door contact met de klantenservice of het dichtstbijzijnde servicecentrum.
