Gebruiksaanwijzing /service van het product AS5750G van de fabrikant Acer
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Aspire 5750/5750G SERVICE GUIDE SG_JE50_HR_COVER.fm Page i Wednesday, January 5, 2011 2:57 PM.
ii Revision History Refer to the table below for the up dates made to this service guide. Service guide files and up dates are avail able on the ACER/CSD W ebsite. For more information, go to http://csd.acer .com.tw . The information in this guide is subject to change without notice.
iii Conventions The following conventions are used in this manual: W ARNING : ! Indicates a potential for personal injury . CAUTION : ! Indicates a potential loss of data or damage to equipment. IMPORT ANT : + Indicate s informati on that is import ant to know for the proper completion of a procedure, choice of an option, or completing a t ask.
iv General information 0 This service guid e provides a ll technical information relating to the basic conf iguration for Acer global product of fering.
v CHAPTER 1 Hardware Specifications Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Platform . . . . . . . .
vi LAN Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27 Hard Disk Drive (AVL components) . . . . . . . . . . .
vii Remove HDD/BIOS Password Ut ilities . . . . . . . . . . . . . . . . . . . . . 2-18 Removing BIOS Passwords . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20 Miscellaneous Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
viii Bluetooth Module Installation . . . . . . . . . . . . . . . . . . . . . . . . 3-33 RTC Battery Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-34 RTC Battery Installation . . . . . . . . . . . . . . . . . . . . . . . . .
ix USB Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13 Wireless Function Fail ure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14 Bluetooth Failure . . . . . . . . . . . . . . . . . . . . . .
x CHAPTER 7 Model Definition and Configuration Aspire 5750 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3 Aspire 5750G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-17 CHAPTER 8 Test Compatible Components Microsoft® Windows® 7 Envi ronment Test .
CHAPTER 1 Hardware S pecifications SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
1-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Operating System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5 Platform . . . . . . . . . . . . . . . . . . . . . . . .
1-3 LED 15.6”. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-32 LCD Inverter (not availabl e with this model ) . . . . . . . . . . . . . . . 1-32 Display Supported Resolu tion (LCD Supported Resolution) . . . 1-33 Graphics Controller .
1-4 SG_JE50_HR.book Page 4 Thursday, D ecember 23, 2010 3:47 PM.
Hardware S p ecifications and Configurations 1-5 Hardware Specifications and Configurations Features 0 The following is a summary of the comp uter ’s many feature s: Operating System 0 Genuine W.
1-6 Hardware S pecifications and Configurations Privacy Control 0 BIOS user , supervisor , HDD passwords Kensington lock slot Storage Subsystem 0 Hard disk drive: 250/320/500/640/750 G.
Hardware S p ecifications and Configurations 1-7 Audio Subsystem 0 Optimized Dolby ® Advanced Audio ® v2 audio enhancement, featurin g Audio Optimizer , Audio Regulator , V olume Leveler , V olu.
1-8 Hardware S pecifications and Configurations Dimension and Weight 0 Dimensions: 381.6 (W) x 253 (D) x 25.2/3 3.2 (H) mm (15 x 9.96 x 0.99/1.30 inche s) Weight: 2.6 kg (5.74 lbs .) with 6-cell battery pack Power Adapter and Battery 0 ACPI 3.
Hardware S p ecifications and Configurations 1-9 Special Keys and Controls 0 Keyboard 103-/104- /107-key Acer FineT ip keyboard with independent st andard nume ric keypad, international l anguage .
1-1 0 Hardware S pecifications and Configurations Software 0 Productivity Acer Backup Manager Acer ePower Management Acer eRecovery Management Adobe ® Flash® Player 10.
Hardware S p ecifications and Configurations 1-1 1 Notebook Tour 0 Top View 0 Figure 1-1. T op View T able 1-1. T op View # Icon Item Description 1 Integrated webcam Web camera for video communication (o nly for certain mo dels). 2 Display screen Also called Liquid-Crystal Display (LCD), displays computer output (Configuration may vary by models).
1-1 2 Hardware S pecifications and Configurations 4 Keyboard For entering dat a into your computer . 5 T ouchpad T ouch-sensitive pointing device which functions like a computer mouse. 6 HDD indicator Indicates when the hard disk dr ive is active. Communication indicator Indicates the computer ’s wireless connectivity device status.
Hardware S p ecifications and Configurations 1-13 Closed Front View 0 Figure 1-2. Closed Front Vie w T able 1-2. Closed Front View # Icon Item Description 1 Multi-in-1 card reader Accepts Secure Digital (SD), MultiMediaCard (MMC), Memory S tick PRO (MS PRO), xD-Picture Card (xD).
1-1 4 Hardware S pecifications and Configurations Left View 0 Figure 1-3. Lef t V iew T able 1-3. Left V iew # Icon Item Description 1 DC-in jack Connects to an AC adapter . 2 Ethernet (RJ-45) por t Connects to an Ethernet 10/100/1000- based network. 3 External display (VGA) port Connects to a display device (e .
Hardware S p ecifications and Configurations 1-15 Right View 0 Figure 1-4. Right View T able 1-4. Right View # Icon Item Description 1 USB 2.0 ports Connect to USB 2.0 de vices (e.g., USB mous e, USB camera). 2 USB2.0/3.0* port Connects to USB devices.
1-1 6 Hardware S pecifications and Configurations Base View 0 Figure 1-5. Base View T able 1-5. Base View # Icon Item Description 1 Battery bay Houses the computer's battery pack. 2 Battery r elease lat ch/ lock Releases the battery for removal. Insert a suitable tool into the latch and slide to release.
Hardware S p ecifications and Configurations 1-17 Touchpad Basics 0 Figure 1-6. T ouchpad Move finger across the T ouchpad (1) to move the cursor . Press the left (2) and right (3) buttons locat ed beneath the T ouchpad to perform selecti on and execution functions.
1-1 8 Hardware S pecifications and Configurations Using the Keyboard 0 Figure 1-7. Keyboard Lock Keys The keyboard has three lock keys which can be toggled o n and off. (T able 1-7) The embedded numeric ke ypad functions like a desktop nu meric keypad.
Hardware S p ecifications and Configurations 1-19 Windows Keys 0 The keyboard has two keys that perform Windows- specific functions. Windows Logo key Application key T able 1-9. Windows Keys Key Description Windows Logo key Pressed alone, this ke y has the same e f fect as clicking on the Windows S tart button; it launches the S tart menu.
1-2 0 Hardware S pecifications and Configurations Hotkeys 0 Hotkeys or key comb inations can be used to access mo st of the comput er's controls like screen brightness and volume outp ut. Figure 1-8. Keyboard Hotkeys T o activate hotkeys, press and hold the <Fn> ke y before pressing the other key in the h otkey combination.
Hardware S p ecifications and Configurations 1-21 <Fn> + < Z > Brightness up Increases the screen br ightness. <Fn> + < Y > Brightness do wn Decreas es the screen brightn ess. <Fn> + < U > V olume up Increases audio volume.
1-2 2 Hardware S pecifications and Configurations System Block Diagram 0 Figure 1-9. System Block Diagram.
Hardware S p ecifications and Configurations 1-23 Specification Tables 0 Computer specif ications Item Metric Imperial Dimensions Length 381.6 mm 15.03” Width 253 mm 9.96” Height (front to rear) 33.2 mm 1.3” Weight (equi pped with optical drive, flash drive, and battery) < 2.
1-2 4 Hardware S pecifications and Configurations System Board Major Ch ips Processor Processor S pecifications Item Specification Core logic Intel Huron Pl atform VGA Intel NVIDIA N12P- GS/N12P-GV LAN Broadcom BCM57785 G bE Controller USB 2.0 3 Port USB2.
Hardware S p ecifications and Configurations 1-25 CPU Fan T rue V alue T able (Tj=105) CPU Fan T rue V alue T able (Tj=85) System Memory CPU T emperature Fan S peed (RPM) SPL Spec (dBA) 60 2500 28 70 .
1-2 6 Hardware S pecifications and Configurations Memory Combinations Vid e o I n te r fa c e Slot 1 (MB) Slot 2 (MB) T otal Memory (MB) 0 1024 1 024 0 2048 2 048 0 4096 4 096 1024 0 10 24 1024 1024 2.
Hardware S p ecifications and Configurations 1-27 BIOS LAN Interface Keyboard Item Specif ication BIOS vendor Insyde BIOS V ersion 1.00 BIOS ROM type SPI BIOS ROM size 4MB Features Insyde code bas.
1-2 8 Hardware S pecifications and Configurations Hard Disk Drive (A VL components) Item Specification V endor & Model Name HTS545025B9A 300 MK2565GSX ST9250315AS HTS545032B9A 300 MK3265GSX ST9320.
Hardware S p ecifications and Configurations 1-29 Hard Disk Dr ive (continu ed) Data he ads 4 4 4 412 Drive Format Disks 2 2 2 211 S pindle speed (RPM) 5400RPM Performance S pecifications Buf fer size 8MB 16MB 8MB 8MB Interface SA T A Fast data transfer rate (Mbits / sec, max) 3.
1-3 0 Hardware S pecifications and Configurations Super-Multi Drive Hard Disk Dr ive (continu ed) Media data transfer rate (Mbytes/sec max) 97Mbytes/s 97Mbytes/s DC Power Requirements V oltage toleran.
Hardware S p ecifications and Configurations 1-31 BD Drive Items Specifications V endor & Model name PLDS BD COMBO DRIVE TRA Y DL DS-6E2SH LF / HLDS BD COMBO 12.
1-3 2 Hardware S pecifications and Configurations LED 15.6” LCD Inverter (not av ailable with this model) Item Specification V endor/Model name AUO/B156XW02 V6 (HW: 0A) AUO/B156XW02 V2 (HW:4A) Samsung/L TN156 A T02-A1 1 LG/LP156WH2-TLEA CMO/N156B6-L0B CPT/ CLAA156WB1 1A Screen Diagonal (mm) 394.
Hardware S p ecifications and Configurations 1-33 Display Supported Resolution (LCD Supporte d Resolution) Graphics Controller Display Supported Resolution (GPU Supported Resolution) Bluetooth Interfa.
1-3 4 Hardware S pecifications and Configurations Bluetooth Module Camera Mini Card 3G Card Bluetooth Interface (continued) Connector type JST SM06B-XSRK-ETB Supported protocol A2DP / A VCTP / A V RCP.
Hardware S p ecifications and Configurations 1-35 Audio Codec and Amplifier Audio Interface Item Specification Audio Cont roller Aud io codec: Re altek ALC2 71X-GR Features T wo stereo DAC support.
1-3 6 Hardware S pecifications and Configurations Wireless Module 802.1 1b/g/n Battery VRAM Item Specification Chipset Atheros HB95/HB97 BCM943225 Intel 6250/6150/6205 Dat a throughput 1 1~54 Mbps, up to 270 Mbps for Draf t-N Protocol 802.1 1 b+g, Draft-N 802.
Hardware S p ecifications and Configurations 1-37 USB Port HDMI Port AC Adapter Item Specificati on USB compliance level USB2.0/ USB3.0 Protocol EHCI Number of U SB port(s) 3 (1 USB 3.0 port is op tional) NOTE : Port configuration is 3 USB 2.0 ports or 1 USB 3.
1-3 8 Hardware S pecifications and Configurations System Power Manageme nt Card Reader Item Specification Mech. Off (G3) Al devices in the sys tem are turned off completely . Soft Of f (G2/S5) OS initiated shutdown. All devices in the system are turned o ff completely .
Hardware S p ecifications and Configurations 1-39 System LED Indicator System DMA Specification Item Specification Lock N/A System state Blue color solid on: System on Blue color and amber col.
1-4 0 Hardware S pecifications and Configurations System Interrup t Specification Hardware IRQ System Function IRQ0 System timer IRQ1 S tandard PS/2 Keyboard IRQ8 System CMOS/real- time clock IRQ9 Bro.
Hardware S p ecifications and Configurations 1-41 System IO Address Map I/O addres s (hex) System Function (shipping configuration) 000 - 01F Direct Memory Access controller 020 - 02D Programmable int.
1-4 2 Hardware S pecifications and Configurations System I/O Address S pecifications I/O addres s (hex) System Function (shipping configuration) 220 - 22F 230 - 26D 26E - 26 278 - 27F 280 - 2AB 2A0 - .
CHAPTER 2 System Utilities SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
2-2 BIOS Setup Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Navigating the BIOS Ut ility . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 BIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Utilities 2-3 System Utilities BIOS Setup Utility 0 The BIOS Setup Utility is a hard ware configuration progra m built into a computer’s BIOS (Basic Input/Output System). The utility is pre-configured and optimized so most users do not need to run it.
2-4 System Utilities BIOS 0 The following is a descriptio n of the tabs found on t he InsydeH2 0 BIOS Setup Utility screen: NOTE: NOTE : The screens provided are for refe rence only . Actual values may differ by model. Information 0 The Information t ab shows a summary of computer hardware information.
System Utilities 2-5 T able 2-1. BIOS Information Parameter Description CPU T ype CPU (central processing unit) type and speed of system CPU S peed S peed of the CPU HDD Model Name Model name of HDD (.
2-6 System Utilities Main 0 The Main t ab allows the user to set system time and da te, enable or disable boot optio n and enable or di sable recovery . Figure 2-2. BIOS Main T able 2-2 describes the pa rameters shown in Figure 2 -2. . InsydeH20 Setup Utility Rev .
System Utilities 2-7 Network Boot Option to boot system from LAN (local area network) Option: Enab led or Disabled F12 Boot Menu Option to use boot menu d uring POST Option: Enabled or Disabled D2D Re.
2-8 System Utilities Security 0 The Security t ab shows par ameters that safeguard and protect the computer from unauthorize d use. Figure 2-3. BIOS Security T able 2-3 describes the pa rameters shown in Figure 2 -3. NOTE: NOTE : When prompted to enter p assword, thre e attempts are allowed before system halts.
System Utilities 2-9 Setting a Password 0 Perform the following to set supervisor p assword: 1. Use the and keys to highlight the Se t Supervisor Password p arameter and press Enter . The Set Supervisor Password dialog box appears. Figure 2-4.
2-10 System Utilities Set Supervisor Password dialog box appears: Figure 2-5. Set Supervisor Password 2. T y pe curre nt password in Enter Current Password field and press Enter . 3. Press Enter twice without ty ping anythin g in Enter New Password and Confirm New Password fields.
System Utilities 2-1 1 Figure 2-7. Setup Notice The password setting is comple te after the u ser presses Enter . If the password entered does not match the current passwor d, the screen shows the Setup Warning dialog.
2-12 System Utilities Boot 0 The Boot tab allows changes to the orde r of boot de vices used to load the operating system. Bootable devices includ e the: USB diskette drives Onboard hard disk drive DVD drive in the module bay Use and keys to select a device and press F5 or F6 to change the value.
System Utilities 2-13 Exit 0 The Exit tab allows users to save or discard changes and quit the BIOS Setup Utility . Figure 2-1 1. BIOS Exit T able 2-4 describes the pa rameters in Figure 2- 1 1. InsydeH20 Setup Utility Rev . 3.5 Information Main Security Boot Exit Item Specific Help Exit Saving Changes Exit System Setup and save your change s.
2-14 System Utilities BIOS Flash Utilities 0 BIOS Flash memory u pdates are required for the following conditions: New versions of system programs New features or options Restore a BIOS when it becomes corrupted. Use the Flash utility to update the system BIOS Flash ROM.
System Utilities 2-15 DOS Flash Utility 0 Perform the following to use the DOS Flas h Utility: 1. Press F2 during boot to enter Setup Menu . 2. Select Boot Menu to modify boot priority order . 3. Mo ve USB HDD to position 1. (Refer to Boot men u) Figure 2-12.
2-16 System Utilities Figure 2-14. Erasing FLASH ROM Figure 2-15. Up dati ng Flas h ROM Blocks 7. Fla sh is complete when the message, Flash Programming Complete is shown. System will restart automatically when finished. NOTE: NOTE : If AC power is not connected, the follo wing me ssage is show n (Figur e 2-16).
System Utilities 2-17 WinFlash Utility 0 Perform the following to use the WinFlash Utility: 1. Dou ble-click the WinFlash execut able. 2. Click OK to begin the upda te.
2-18 System Utilities Remove HDD/BIOS Password Utilities 0 This section provides details about re moving HDD/BIOS passwo rds. Remove HDD Password as follows: NOTE: NOTE : If the HDD password is incorrec tly entered three times, the Password Error Status dialog shown.
System Utilities 2-19 < UnlockHD [key code] > with the code n oted in the Figu re 2-20. Example: UnlockHD 54591747 The command genera tes a passwo rd which can be used for unlockin g the HDD. Password: 41499389 Figure 2-21. Unlock Passwo rd 5. On original device, enter password (Figure 2-21) in Enter Unlock Password dialog ( Figure 2-20 ).
2-20 System Utilities Removing BIOS Passwords 0 The User and Supervisor p asswords can be cleared by shorting the R TC_RST point with a metal instrumen t. (Figure 2-22) Figure 2-22. CMOS Jumper Cleaning BIOS Passwords 0 T o clean the User or Supervisor p asswords, perform the following step s: 1.
System Utilities 2-21 Using Boot Manager 0 The Boot Manager allows the boot device to be changed without accessing the BIOS. NOTE: NOTE : The F12 Boot Me nu option m ust be s et to Enabled in the BIOS Setup Utility ’s Main screen. (refer to Main ) T o use the Boot Manager , perform the following steps: 1.
2-22 System Utilities Miscellaneous Tools 0 Using DMIT ools 0 The DMI (Desktop Management Inter face) T ool copies BIOS information to EEPROM. Used in the DMI pool for hardware management.
System Utilities 2-23 Input: 0 dmitools /wu Write Asset T a g to EEPROM Input: 0 dmitools /wa Acer Asstag NOTE: NOTE : For examples two (2) through five (5), restart th e system to write any changes in the data to the EEPROM . Using the LAN MAC EEPROM Utility 0 1.
2-24 System Utilities SG_JE50_HR.book Page 24 Thursday, December 23, 2010 3:47 PM.
CHAPTER 3 Machine Maintenance Procedures SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
3-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Recommended Equipment . . . . . . . . . . . . . . . . . .
3-3 Thermal Module Installation . . . . . . . . . . . . . . . . . . . . . . . . . . 3-40 CPU Removal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-42 CPU Installation . . . . . . . . . . . . . . . . . . . . . . . . . .
3-4 SG_JE50_HR.book Page 4 Thursday, D ecember 23, 2010 3:47 PM.
Machine Maintenance Procedure s 3-5 Machine Maintenance Procedures Introduction 0 This chapter contains gener al informat ion ab out the notebook, a list of tools needed to perform the required maintenance an d step by step procedures on how to remove an d install components from the notebook computer .
3-6 Machine Maintenance Proced ures Maintenance Flowchart 0 The flowchart in Figure 3- 1 provides a graphic represent ation of the module r emoval and installation sequences. It provides information on wh at component s need to be removed and installed during servicing.
Machine Maintenance Procedure s 3-7 Figure 3-2. LCD Module Maintenance Flow LCD Module LCD Bezel DC-IN Cable CCD Module LCD Panel LCD Panel Brackets WLAN & 3G Antennas Microphon e Module SG_JE50_HR.
3-8 Machine Maintenance Proced ures Getting Started 0 The flowchart in Fig ure 3-1 identifies sections illustrating the entire removal and install sequence. Observe the order of the sequence to avoid damag e to any of the hardware components. Perform the f ollowing pr ior to perform ing any maintenanc e proced ures: 1.
Machine Maintenance Procedure s 3-9 Battery Pack Removal 0 1. Place computer on flat su rface, battery side up. 2. Push battery lock/un lock latch (B) to unlock position. 3. Remove battery p ack (A) from lower cover . Figure 3-4. Battery IMPORT ANT : + Follow local regulat ions for battery (A, Figure 3-4) disposal.
3-1 0 Machine Maintenance Proced ures Dummy Card Removal 0 1. Push dummy card ( A) in to rele ase it from spring latc h. 2. Remove dummy ca rd (A). Figure 3-5. Dummy Card Dummy Card Installation 0 1. Inser t dummy card (A) (Figure 3-5). 2. Push card until spring latch locks.
Machine Maintenance Procedure s 3-1 1 3G Card Removal 0 Prerequisite: Battery Pack Removal 1. L ocate 3G card slot (A) in battery bay (Figure 3-6). Figure 3-6. Lower Cover Overview with Base Door 2. Push 3G card (B) in to release it from spring lat ch (Figure 3-7).
3-1 2 Machine Maintenance Proced ures 3G Module Removal 0 Prerequisite: Battery Pack Removal 1. Locate module do or (B) on lower cover . Refer to Figure 3-6 . 2. L oosen captive screw ( A) (Figure 3-8). Figure 3-8. 3G Module Cover Door 3. Rem ove door fr om lower cover .
Machine Maintenance Procedure s 3-13 3G Module Installation 0 1. Inser t module into mainboard co nnector (D). Refer to Figure 3-9 . 2. Inst all and secure screw (A) to mainbo ard. 3. Inst all main (B) and auxiliary (C ) antenna cables on 3G module. 4.
3-1 4 Machine Maintenance Proced ures Base Door Removal 0 Prerequisite: Battery Pack Removal 1. Locate base doo r (C) on lower cover . Refer to Figure 3-6 . 2. Remove two (2) screws (A) as shown in Figure 3- 10. Figure 3-10. Lower Cover Door Screws 3.
Machine Maintenance Procedure s 3-15 Size Quantity Screw T ype M2.5x8.0 2 SG_JE50_HR.book Page 15 Thursday, December 23, 2010 3:47 PM.
3-1 6 Machine Maintenance Proced ures HDD (Hard Disk Drive) Module Removal 0 Prerequisite: Base Door Removal 1. Locate HDD module (A) on lower cover ( Fig ure 3-12 ). Figure 3-12. Lower Cover Overview with Base Door Removed 2. Slide module away fr om main board conn ector (A) (Figure 3-1 3).
Machine Maintenance Procedure s 3-17 HDD Module Installation 0 1. Place module into ba y on lower cover . Refer to Figure 3-12 . 2. Con nect module to mainboar d connector (A).
3-1 8 Machine Maintenance Proced ures HDD Carrier Removal 0 Prerequisite: HDD (Hard Disk Drive) Module Removal 1. Remove four (4) screws (A) f rom the br ackets (Figure 3 -14). Figure 3-14. HDD Module Bracket s 2. Rem ove bracket s (B) and (C) and mylar (D) from HDD.
Machine Maintenance Procedure s 3-19 ODD Module Removal 0 Prerequisite: HDD (Hard Disk Drive) Module Removal 1. Locate ODD module (D) on lower cover . Refer to F igure 3- 12 . 2. Remove screw (A) from lower cover . 3. T o remove mo dule, push from HDD bay (A) (Fig ure 3-15) .
3-2 0 Machine Maintenance Proced ures ODD Module Installation 0 1. Install bezel (C) to module. Refer to Figure 3-16 . 2. Install bracket (B) to module. 3. Install and secure two (2) screws (A). 4. Install module (D) in lower cover . Refer to Figure 3-12 .
Machine Maintenance Procedure s 3-21 WLAN (Wireless Local Area Network) Module Removal 0 Prerequisite: Base Door Removal 1. Locate module (B) on lower cover . Refer to Figure 3-12 . 2. Disconnect main (B) and auxiliary (C ) an tenna cables from module (Figure 3-17).
3-2 2 Machine Maintenance Proced ures DIMM (Dual In-line Memory Module) Module Removal 0 Prerequisite: Base Door Removal 1. Locate module (C) on lower cover . Refer to Figure 3-12 . 2. Push m odule clips (A) outw ards. (Figu re 3-18) Figure 3-18. DIMM Module(s) 3.
Machine Maintenance Procedure s 3-23 Keyboard Removal 0 Prerequisite: Battery Pack Removal 1. Locate and unlock six (6) latche s above keys, F1 , F4 , F8 , F12 , Del , and End (Figure 3-19 ). Figure 3-19. Keyboard 2. Lift keyboar d frame fro m upper c over , starting from to p edge.
3-2 4 Machine Maintenance Proced ures 3. Carefully flip keyboard as shown in Figur e 3-20. Figure 3-20. Keyboard FPC 4. Remove keyboard FPC (B) from ma inboard connecto r (A). Keyboard Installation 0 1. Insert keyboard frame flang es (A, Figure 3-21) into upper cover slot s.
Machine Maintenance Procedure s 3-25 Upper Cover Removal 0 Prerequisite: Keyboard Removal Base Door Removal 1. Remove six (6) screws (A) fr om upper cover (Figure 3-22) . Figure 3-22. Upper Cover 2. Remove power board FFC (Flat Flexib le Cable) (B) from mainboar d connector (C).
3-2 6 Machine Maintenance Proced ures 3. T urn comput er over to show lower cover . 4. Remove five (5) scr ews (A) from battery bay (Figure 3-23). Figure 3-23. Lower Cover Screws 5. Remove seven (7) screws (B), two ( 2) screws (C), and o ne (1) screw (D) from lowe r cover .
Machine Maintenance Procedure s 3-27 8. Remove upper cov er from low er cover as shown in F igure 3-25 . Figure 3-25. Removing Upper Cover Upper Cover Installation 0 1. Install and secure upp er cover latches on lower cover ( Figure 3-25 ). 2. T urn comput er over to show lower cover .
3-2 8 Machine Maintenance Proced ures Touchpad Board FFC Removal 0 Prerequisite: Upper Cover Removal 1. Locate touchp ad board (A) on uppe r cover (Figure 3-26). Figure 3-26. Upper Cover Overview 2. Remove touchp ad FFC (A) from touchp ad board connecto r (B) (Figure 3-27 ).
Machine Maintenance Procedure s 3-29 Touchpad Board FFC Installation 0 1. Install touchpad FFC (A) to openi ng in upper cover mylar . Refer to Figure 3- 27 . 2. Install touchpad F FC (A) to touchpad boar d connec tor (B). 3. Install upper cover . SG_JE50_HR.
3-3 0 Machine Maintenance Proced ures Power Board Removal 0 Prerequisite: Upper Cover Removal 1. Locate power board (B) on upper cover . Refer to Fig ure 3-26 . 2. Remove screw (A) from upper cover (Figur e 3-28). Figure 3-28. Power Board Removal 3. Remove power board FFC (B) from opening in upper cover mylar (C).
Machine Maintenance Procedure s 3-31 USB Module Removal 0 Prerequisite: Upper Cover Removal 1. Locate USB module (C) on lower cover ( Figure 3-29) . Figure 3-29. Mainboard Overview 2. Remove s crew (D) fr om lower cover (Figure 3-30). Figure 3-30. USB 2.
3-3 2 Machine Maintenance Proced ures 3. Disconnect module FFC (FPC, Figure 3-31) (A) from module connector (B). Figure 3-31. USB 3.0 Module NOTE: NOTE : USB 3.0 is an optional feature and may not re present the final product. 4. Disconnect module FFC (FPC, Figure 3- 31) (A) from mainboard conne ctor (C).
Machine Maintenance Procedure s 3-33 Bluetooth Module Removal 0 Prerequisite: Upper Cover Removal 1. Locate Blu etooth mo dule (B) on upper cover . Refer to Figure 3-29 . 2. Remove module (A) from adhesive strip on upper cove r (Figure 3-32). Figure 3-32.
3-3 4 Machine Maintenance Proced ures RTC Battery Removal 0 Prerequisite: Upper Cover Removal 1. Locate RTC battery (B) on mainbo ard. Refer t o Figure 3-29 . 2. Remove battery (B) from mainboar d connector (A) (Figure 3- 33). Figure 3-33. RTC Battery Removal IMPORT ANT : + Follow local regulat ions for battery (Figure 3-33) disposal.
Machine Maintenance Procedure s 3-35 Speaker Module Removal 0 Prerequisite: Upper Cover Removal 1. Locate speaker modules (D) on up per cover . Refer to Figure 3-29 . 2. Remove two (2) scr ews (A) (Figure 3- 34). Figure 3-34. Speakers 3. Remove speaker cable (C ) from mainboard connector (B).
3-3 6 Machine Maintenance Proced ures Mainboard Removal 0 Prerequisite: HDD (Hard Disk Drive) Module Removal WLAN (Wireless Local Area Netw ork) Modu le Removal S peaker Module Removal 1. Locate mainboard ( E) on lowe r cover . Refer to Fig ure 3-29 .
Machine Maintenance Procedure s 3-37 Figure 3-36. Freeing Mainboard Connectors NOTE: NOTE : Connectors on left side of mainboard (i.e. USB 3.0, HDMI, etc.) are se t in lower cover slots. Do not for ce mainboard wh en removing. 6. Remove mainboard from lower cover by pu lling away from left side (A).
3-3 8 Machine Maintenance Proced ures Mainboard Installation 0 1. Connect DC-IN ( B) cable to mainboard conn ector (A). Refer to Figure 3-37 . 2. Flip mainboard over and align ma inboard connec tors to lef t side of lower cover . Refer to Figure 3-36 .
Machine Maintenance Procedure s 3-39 Thermal Module Removal 0 Prerequisite: Mainboard Remova l 1. Locate thermal modul e (A) on mainboard (Figure 3-38). Figure 3-38. Thermal Module Removal 2. Remove module cable (B) from mainbo ard connector . 3. Remove four (4) screws (C/1 - C/4) and two (2) screws (D/5 - D/6) from mainboard.
3-4 0 Machine Maintenance Proced ures Thermal Module Installation 0 IMPORT ANT : + Apply suitable thermal grease and make sure all heat p ads are in place before replacing module . CAUTION : ! Thermal grease can dam age mainboard. Use caut ion when applying.
Machine Maintenance Procedure s 3-41 3. Align module and heat sink to mainboard screw ho les (Figure 3-40). NOTE: NOTE : Keep modul e level to sp read grea se evenly .
3-4 2 Machine Maintenance Proced ures CPU Removal 0 Prerequisite: Thermal Module Removal 1. Locate module (A) on mainbo ard (Figur e 3-41). Figure 3-41. CPU in Socket 2. T urn captive screw (B) left 180º to release module. 3. Remove module fr om socket .
Machine Maintenance Procedure s 3-43 Figure 3-42. Mainboard Recycling IMPORT ANT : + Circuit boards >10 cm² must be re cycled. Follow loca l regulations fo r disposal.
3-4 4 Machine Maintenance Proced ures 3G Board Removal 0 Prerequisite: Mainboard Remova l 1. Locate 3G board (A) on mainboar d (Figure 3-43). Figure 3-43. Lower Cover with 3G Board 2. Remove two (2) screws (A) from lower cover as shown in Figur e 3-44.
Machine Maintenance Procedure s 3-45 3G Board Installation 0 1. Install 3G board on lower cover . Refer to Figur e 3-43 . 2. Secure two (2) screws (A) to lower cover .
3-4 6 Machine Maintenance Proced ures LCD (Liquid Crystal Display) Module Removal 0 Prerequisite: S peaker Module Removal 1. Flip comp uter ove r to show low er cover . Refer to Figure 3-12 . 2. Remove WLAN antenna cables (A) from WLAN module connectors (Figure 3-45).
Machine Maintenance Procedure s 3-47 5. Flip com puter ove r to show m ainboard. R efer to Fi gure 3- 35 . 6. Remove adhesive tap e securing WLAN cable (B) to mainboar d and lower cover . 7. Pull WLAN and 3G antenna cables up through upper cover . 8. Remove four ( 4) screws from L CD module h inges (Figure 3-47).
3-4 8 Machine Maintenance Proced ures 9. Install speaker modules. Size Quantity Screw T ype M2.5x4.0 4 SG_JE50_HR.book Page 48 Thursday, December 23, 2010 3:47 PM.
Machine Maintenance Procedure s 3-49 DC-IN Cable Removal 0 Prerequisite: LCD (Liquid Crystal Display) Module Removal 1. Locate DC-IN cable (A) on mainboard (Figure 3-49). Figure 3-49. DC-IN Cable Removal 2. Remove cable from guides on lower cover . 3.
3-5 0 Machine Maintenance Proced ures LCD Bezel Removal 0 Prerequisite: LCD (Liquid Crystal Display) Module Removal 1. Locate the LCD Bezel (A) on the LCD module (F igure 3-50) Figure 3-50. LCD Module Overview with Bezel 2. Remove the two (2) mylar co vers and two (2) s crews (C) from mod ule.
Machine Maintenance Procedure s 3-51 3. S tarting from the bottom-cen ter of the bezel (Figu re 3-52), pry the bezel upward s and away from the pa nel. Move along th e edge until the bezel is completely removed. Figure 3-52. LCD Bezel Removal LCD Bezel Installation 0 1.
3-5 2 Machine Maintenance Proced ures CCD (Charge-Coupled Device) Module Removal 0 Prerequisite: LCD Bezel Removal 1. Locate CC D module (A) on LC D module cover (Figure 3-53). Figure 3-53. LCD Module Overview without Bezel 2. Remove module cable (G) from module conn ector (F) as shown in Figure 3-54.
Machine Maintenance Procedure s 3-53 LCD Panel Removal 0 Prerequisite: CCD (Charge-Coupled Device) Module Removal 1. Locate L CD panel (B) on m odule cov er . R efer to Fig ure 3-53 . 2. Remove four (4) screws (C) fro m module cov er . 3. Lift adhesive fo il tabs (D) cover ing L VDS cable (E).
3-5 4 Machine Maintenance Proced ures LCD Brackets Removal 0 Prerequisite: LCD Panel Removal 1. Remove six (6) screws (A) from panel. Figure 3-56. LCD Brackets Modu le 2. Remove bracket s (B) from pan el. LCD Brackets Installation 0 1. Install bracket s (B) on pane l (Figure 3-56).
Machine Maintenance Procedure s 3-55 WLAN and 3G Antenna Removal 0 Prerequisite: LCD Panel Removal 1. Lift foil tabs (A) cov ering left WLAN and 3G an tennas (B). (Figure 3- 57) Figure 3-57. LCD Module Cover without Panel NOTE: NOTE : WLAN antenna cables not shown in image.
3-5 6 Machine Maintenance Proced ures 3. Remove EMI (Electromagnetic in terference) foam (E) and aluminium foil (F) cover ing lef t WLAN and 3G antennas from LCD module cover . (Figure 3-58) Figure 3-58. 3G and WLAN EMI Foam and Aluminium Foil 4. Remove left WLAN and 3G antennas (B) from LCD module cover .
Machine Maintenance Procedure s 3-57 Microphone Module Removal 0 Prerequisite: LCD Panel Removal 1. Locate m odule (D) o n LCD mo dule cover . Refer to Figure 3-57 . 2. Lift foil tabs (A) c overing mo dule cable ( B). Figure 3-59. Microphone Module and Cable 3.
3-5 8 Machine Maintenance Proced ures SG_JE50_HR.book Page 58 Thursday, December 23, 2010 3:47 PM.
CHAPTER 4 T roubleshooting SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
4-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Power On Issues . . . . . . . . . . . . . . . . . . . . .
T roubleshooting 4-3 Troubleshooting Introduction 0 This chapter cont ains information about troubleshooting common notebook pr oblems. General Information 0 The following procedu res are a guide for tr oubl eshooting compute r problems. The step by step procedures are designed to be per formed as described.
4-4 T roub leshooting Power On Issues 0 If the system does not power on, perform the following: Figure 4-1. Power On Issue Computer Shuts Down Intermittently 0 If the system powers off at intervals, perform the following. 1. Makes sure the power cable is properly connected to the computer and the electrical outlet.
T roubleshooting 4-5 No Display Issues 0 If the Display does not wo rk, perfor m the following : Figure 4-2. No Display Issue No POST or V ideo 0 If the POST or video doe s not appear , perform the following: 1. Make s ure that int ernal display is selected.
4-6 T roub leshooting 9. Reseat the memory module s. 10. Remove th e drives. (refer to Maintenance F lowchart ) 1 1. If the Issue is still not resolved, refer to Online Support Information . Abnormal Video 0 If the video appears abnormal, perform th e following: 1.
T roubleshooting 4-7 LCD Failure 0 If the LCD fails, perform the follow ing: Figure 4-3. LCD Failure SG_JE50_HR.book Page 7 Thursday, D ecember 23, 2010 3:47 PM.
4-8 T roub leshooting Keyboard Failure 0 If the Keyboard fails, perform the following: Figure 4-4. Keyboard Failure SG_JE50_HR.book Page 8 Thursday, D ecember 23, 2010 3:47 PM.
T roubleshooting 4-9 Touchpad Failure 0 If the T ouchpad fails, perform the following: Figure 4-5. T ouchpad Failure SG_JE50_HR.book Page 9 Thursday, D ecember 23, 2010 3:47 PM.
4-10 T roubleshooting Internal Speaker Failure 0 If internal S peakers fail, perform the following: Figure 4-6. Internal Speaker Failure Sound Problems 0 Perform the following: 1. Boot the co mputer . 2. Navigate to Sta r t Control Panel System and Maintenance System Device Manager .
T roubleshooting 4-1 1 5. Make sur e that all volume cont rols are set mid rang e: Click the volume icon on the taskbar Drag the slider to 50. Confirm that the volume is not muted. Click Mixer to verify th at other audio applic ations ar e set to 50 and not m uted.
4-12 T roubleshooting Microphone Failure 0 If internal or external Microp hones fail, perform the followin g: Figure 4-7. Microphone Failure 1. Check that the microphone is enabled. Navigate to Sta r t Control Panel Hardware and Sound Sound and select the Recording tab.
T roubleshooting 4-13 USB Failure 0 If the USB fails, perform the following: Figure 4-8. USB Failure SG_JE50_HR.book Page 13 Thursday, December 23, 2010 3:47 PM.
4-14 T roubleshooting Wireless Function Failure 0 If the WLAN fails, perform the following: Figure 4-9. Wireless Funct ion Failure SG_JE50_HR.book Page 14 Thursday, December 23, 2010 3:47 PM.
T roubleshooting 4-15 Bluetooth Failure 0 If the Bluetooth fails, perfor m the following: Figure 4-10. Bluetooth Failure SG_JE50_HR.book Page 15 Thursday, December 23, 2010 3:47 PM.
4-16 T roubleshooting Card Reader Failure 0 If the Card Reader fails , perform the following: Figure 4-1 1. Card Reader Failure SG_JE50_HR.book Page 16 Thursday, December 23, 2010 3:47 PM.
T roubleshooting 4-17 Thermal Unit Failure 0 If the Thermal Unit fails , perform the following: Figure 4-12. Thermal Failure SG_JE50_HR.book Page 17 Thursday, December 23, 2010 3:47 PM.
4-18 T roubleshooting Other Functions Failure 0 HDD Not Operating Correctly 0 If the HDD fails to operate cor rect ly , perform the following: 1. Disconnect all external devices. 2. Run a complete virus scan using up-to-date software to confirm th e computer is virus free.
T roubleshooting 4-19 ODD Failure 0 If the ODD fails, perform the following: Figure 4-13. ODD Failure ODD Not Operating Correctly 0 If the ODD exhibits any of the following symptoms it may be faulty: Audio CDs do not play when loaded DVDs do not play when loaded SG_JE50_HR.
4-20 T roubleshooting Blank discs do not burn correctly DVD or CD play breaks up or jumps Optical drive not found or not active: Not shown in My Computer or the BIOS setup .
T roubleshooting 4-21 Double click DVD/CD-ROM drives . Right click DVD drive and click Properties , then click the DVD Region tab. Select the region suitable for the med ia inserted in the drive. Discs Do Not Burn Properly 0 If discs can not be burned, perform the following: 6.
4-22 T roubleshooting Drive Read Failure 0 If discs cann ot be read when inser ted in the d rive, perfor m the follow ing: 1. Remove and clean the failed disc.
T roubleshooting 4-23 10. Run the Event Viewer to check the ev ents log for erro rs. Fo r more info rmation re fer to Windows Help and Support . 1 1. Roll back the mouse driver to the previou s version if updated recently . 12. Remove and rein stall the mou se driver .
4-24 T roubleshooting 5. Determine if the problem has changed. 6. If the proble m does not recur , connect the remove d devices until failing FRU is found. 7. If the prob lem remains, re place the following : System board LCD assembly SG_JE50_HR.
T roubleshooting 4-25 Post Codes 0 The following table s describe the POST codes and descriptions dur ing the POST . T able 4-2. NO_EVICTION_MODE_DEBUG EQU 1 (CommonPlat formsecIa32SecCore.inc) Phase POST Code Range 0xC2 MTRR setup 0xC3 Enable cache 0xC4 Establish cache ta gs nf 0xC5 Enter NEM, Place the BSP in No Fill mode, set CR0.
4-26 T roubleshooting 0x31 Program DRAM throttling and throttling event registers 0x32 Setup DRAM control register for normal operation and enable 0x33 Enable RCOMP 0x34 Clear DRAM initialization bit in the SB 0x35 Initialization Sequence Comp leted, program gra phic clocks 0x43 Program Thermal Throttling T able 4-4.
T roubleshooting 4-27 0xB9 Perip heral removable media d isable Con 0xBB Peripheral removable me dia enable 0xE4 Report S tatus Code here for D XE_ENTRY_POINT once it is available 0xF8 Report that ExitBootServices() has been called re 0xF9 Runtime driver set virtual address map T able 4-5.
4-28 T roubleshooting 0xAF PEI_DXE_IPL T able 4-6. Each Driver entry point used in 80_PORT Phase POST Code Range 0x30 RESERVED 0xB6 DXE_CRC32_SECTION_EXTRACT 0xB8 SCRIPT_SA VE 0xB9 ACPI_S3_SA VE 0xBA .
T roubleshooting 4-29 0xE8 ISA_BUS 0xE9 ISA_SERIAL 0xED BUS_PCI_UNDI 0xEC PCI_BUS 0xF6 BOOT_PRIORITY 0xF7 FVB_SERVICE 0xF8 ACPI_PLA TFORM 0xFB PCI_HOT_PLUG 0xFC DXE_PLA TFORM Soft 0xFD PLA TFORM_IDE 0.
4-30 T roubleshooting 0x6E e USB_BOT 0x6F USB_CBI0 0x74 USB_MOUSE 0xF A SETUP_UTILITY 0x90 FW_BLOCK_SER VICE 0x78 SMM_USB_LEGACY 0x86 GRAPHICS_CONSOLE 0x87 TERMINAL 0x8A DA T A_HUB_STD_ERR 0x7C F A T .
T roubleshooting 4-31 0xB0 JAP ANESE 0xB1 DXE_UNICODE_COLLACTION T able 4-7. Each SmmDriver entry point used in 80_PORT 0xD4 SMM_ACCESS 0xDE SMM_CONTROL 0xCC SMM_BASE 0xD2 SMM_RUNTIME 0xDF SB_SMM_DISP.
4-32 T roubleshooting SG_JE50_HR.book Page 32 Thursday, December 23, 2010 3:47 PM.
CHAPTER 5 Jumper and Connector Locations SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
5-2 Mainboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 USB Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-5 Power Board . . . . . . . . . . . . . . . . . . .
Jumper and Connector Locati ons 5-3 Jumper and Connector Locations Mainboard 0 Figure 5-1. Mainboard T op T able 5-1. Mainboard T op Item Description Item Description JL VDS1 L VDS Connector JBT1 Blue.
5-4 Jumper and Connector Locations Figure 5-2. Mainboard Bottom T able 5-2. Mainboard Bottom Item Descripti on Item Description PJP1 DC-IN Connector JCPU1 CPU Connector PJP2 Battery Connector JDIMM1/J.
Jumper and Connector Locati ons 5-5 USB Board 0 Figure 5-3. USB Board T op Figure 5-4. USB Board Bottom T able 5-3. USB Board Item Description JUSB1 USB2.0 Connector JUSB2 USB3.0 Connector JUSB3 USB3.0 Br oad Connector JUSB4 USB2.0 Br oad Connector JP1 WLAN EN Connector SW1 WLAN EN Switch SG_JE50_HR.
5-6 Jumper and Connector Locations Power Board 0 Figure 5-5. Power Board T op Figure 5-6. Power Board Bottom T able 5-4. Power Board Item Descr iption SW1 Switch Button for E0 project SW2 Switch Button for S0 project SW3 Switch Button for D0 project SW4 S peaker Connector JP1 T o PWR/B FFC JP2 T o M/B FFC JP5 T o LID/B FFC SG_JE50_HR.
Jumper and Connector Locati ons 5-7 Card Reader 0 Figure 5-7. Card Reader T op Figure 5-8. Card Reader Bottom T able 5-5. Power Board Item Description JSIM1 SIM Card Connector JMINI1 MINI Card Connec tor J3G1 3G Board Connector SG_JE50_HR.
5-8 Jumper and Connector Locations Clearing Password Check and BIOS Recovery 0 This section provide s users with the SOP (st andard operating procedur e) for clearing the BIOS password check and recoveri ng the BIOS for the Aspire 5750/5 750G .
Jumper and Connector Locati ons 5-9 6. Plug in AC adapter . 7. Press Power button until BIOS POST is finished 8. Remove conductivity to ol from RCT_RST point. 9. Restart the system and press F2 to enter BIOS Utility Setup menu. 10. If no password pro mpt is sh own, BIOS password is cleared.
5-1 0 Jumper and Conne ctor Locations BIOS Recovery by Crisis Disk 0 BIOS Recovery Boot Bloc k 0 The BIOS Recovery Boot Block is a spec ial block of BIOS. It is used to boot up th e system with minimum BIOS initialization. Users can enable this feat ure to restore the BIOS fir mware if a previous BIOS flashing process has failed.
Jumper and Connector Locati ons 5-1 1 2. Copy ROM (read-only memory) file, P5WEOX64.fd , to root directory of USB HDD. Make sure that there is no other BIOS f ile is saved in th e same director y . 3. Insert USB HDD into USB port. 4. Press < Fn + ESC > button and hold while plugging in AC power ada pter .
5-1 2 Jumper and Conne ctor Locations SG_JE50_HR.book Page 12 Thursday, December 23, 2010 3:47 PM.
CHAPTER 6 FRU (Field Replaceable Unit) List SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
6-2 Exploded Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4 Main Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4 LCD Assembly . . . . . . . . . . . . . . . . . . . . . . . . . .
FRU (Field Repla ceable Unit) List 6-3 FRU (Field Replaceable Unit) List This chapter provides users with a FRU (Fie ld Replaceable Unit) listing in global configurations for the Aspire 5750/5750G . Refer to this chapter whenever ordering for p art s to repair or for RMA ( Return M erchandise Aut horization ).
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FRU (Field Repla ceable Unit) List 6-5 T able 6-1. Main Assembly Exploded Diagram No. Description Acer Part No. 1 UPPER CASE IMR-BLACK 60.R9702.001 2 THERMAL MODULE UMA DUAL W/O F AN 60.R9702.006 3 F AN-UMA DUAL 23.R9702.001 4 THERMAL MODULE OP T GS/GV QUAD W/F AN 60.
6-6 F RU (Field Rep laceable Unit) List LCD Assembly 0 Figure 6-2. LCD Assembly Exploded Diagram 1 2 3 4 6 5 4 SG_JE50_HR.book Page 6 Thursday, D ecember 23, 2010 3:47 PM.
FRU (Field Repla ceable Unit) List 6-7 T able 6-2. LCD Assembly Exploded Diagram No. Description Acer Part No. 1 LCD BEZEL 60.R9702.005 2 LED LCD AUO 15.6"W WXGA Glare B156XW02 V2 LF 200nit 8ms 50 0:1 (power savin g) LK.15605.010 3 LCD CABLE 5 0.
6-8 F RU (Field Rep laceable Unit) List Upper Cover 0 Figure 6-3. Upper Cover Exploded Diagram T able 6-3. Upper Cover Exploded Diagram No. Description Acer Part No. 1 UPPER CASE IMR-BLACK 60.R9702.001 2 POWER BOARD 55.RFD02.001 3 TP FFC 50.RFD02.003 1 2 3 SG_JE50_HR.
FRU (Field Repla ceable Unit) List 6-9 Lower Cover 0 Figure 6-4. Lower Cover Exploded Diagram T a ble 6-4. Lower Cover Ex ploded Diagram No. Description Acer Part No. 1 LOWER CASE FOR W/3G 60.RFD02.001 2 UNI-LOAD DOOR 60.R9702.003 3 3G CARD DOOR FOR W/ 3G 42.
6-1 0 FRU (Field Replaceable Unit) List FRU List 0 T able 6-5. FRU List Category Description P/N ADAPTER Adapter LITE-ON 65W 19V 1.7x5.5x1 1 Y ellow P A-1 650-22AC L V5 L ED LF AP .06503.024 Adapter DEL T A 65W 19V 1.7x5.5x1 1 Y ellow ADP-65VH BA, L V5, Low profile LED LF AP .
FRU (Field Repla ceable Unit) List 6-1 1 POWER BOARD 55.RFD02.001 USB BOARD 3.0 55.RFD02.002 USB BOARD 2.0 MOUNT W/ FFC CABLE 55.RFD02.003 FPC BOARD FOR USB 3.0 55.RFD02.004 3G BOARD 55.RFD02.00 5 Foxconn Wire lss LAN Athe ros HB95BG (H M) T77H121.10 NI.
6-1 2 FRU (Field Replaceable Unit) List 3G CARD Huawei EM770W -Rev2 LC.21300.066 CABLE BLUE TOOTH CABLE-6PIN 50.RFD02.001 3G CABLE 50.RFD02.002 TP FFC 50.RFD02.003 POWER CORD US 3 PIN 27.T A VV5.001 POWER CORD EU 3 PIN 27.T A VV5.002 POWER CORD AUS 3 PIN 27.
FRU (Field Repla ceable Unit) List 6-1 3 CASE/COVER/BRACKET ASSEMBL Y UPPER CASE IMR-BLACK 60.R9702.001 UPPER CASE IMR-BLUE 60.RFE02.001 LOWER CASE FOR W/3G 60.RFD02.001 LOWER CASE FOR W/O 3G 60.R9702.002 UNI-LOAD DOOR 60.R9702.003 3G CARD DOOR FOR W/ 3G 42.
6-1 4 FRU (Field Replaceable Unit) List ODD BRACKET 33.R9702.003 ODD BEZEL-SM 42.R9702.002 DVD RW DRIVE ODD SONY Super-Multi DRIVE 12.7mm Tray DL 8X AD-7585H LF W/O bezel SA T A (H F + Window s 7) KU.0080E.027 ODD P ANASONIC Super-Multi DR IVE 12.7mm T r ay DL 8X UJ890A LF W/O bezel SA T A (HF + Windows 7) KU.
FRU (Field Repla ceable Unit) List 6-1 5 ODD BEZEL-BD 42.R9702.003 ODD PIONEER BD COMBO 12.7mm Tray DL 4X BDC-TD03RS LF W/O bezel 1.01 SA T A (Windows 7) KO.00405.006 ODD P A NASONIC BD COMBO 12.7mm Tray DL 4X UJ141AL LF W/O bezel SA T A Windows 7 KO.
6-1 6 FRU (Field Replaceable Unit) List HDD HGST 2.5" 5400rpm 500GB HTS545050B9A300 Pa nther B SA T A LF F/W:C60F Disk imbalance criteria = 0.014g-cm KH.50007.010 HDD SEAGA TE 2.5" 5400rpm 500GB ST9500325AS,9HH134-1 89, Wyatt with new pcb SA T A 8MB LF F/W:0001SDM1 KH.
FRU (Field Repla ceable Unit) List 6-1 7 Keyboard ACER AC7T_A10B AC7T Internal 17 S tandard 104KS Black I talian T exture KB.I170A.158 Keyboard ACER AC7T_A10B AC7T Internal 17 S tandard 104KS Black F rench T exture KB.I170A.154 Keyboard ACER AC7T_A10B AC7T Internal 17 S tandard 104KS Black H ungarian T exture KB.
6-1 8 FRU (Field Replaceable Unit) List LCD ASSY LED LCD MODULE 15.6"W WXGA GLARE w/ ANTENNA*2, CCD 1.3M, BLAC K 6M.R9702.001 ANTENNA WLAN-MAIN 50.R9702.001 ANTENNA WLAN-AUX 50.R9702.002 LCD CABLE 50.R9702.003 LCD COVER IMR-BLACK 60.R9702.004 LCD BEZEL 60.
FRU (Field Repla ceable Unit) List 6-1 9 CAMERA 1.3M 57.R9702.001 LED LCD AUO 15.6"W WXGA Gla re B156XW02 V2 LF 200nit 8ms 500:1 (power saving) LK.15605.010 LED LCD SAMSU NG 15.6"W WXGA Glare L TN156A T02-A1 1 LF 220nit 8ms 500:1 LK.15606.012 LED LCD CMO 15.
6-2 0 FRU (Field Replaceable Unit) List LCD COVER IMR-BLACK 60.R9702.004 LCD BEZEL 60.R9702.005 LCD BRACKET R&L 33.R9702.004 CAMERA 1.3M 57.R9702.001 LED LCD AUO 15.6"W WXGA Gla re B156XW02 V2 LF 200nit 8ms 500:1 (power saving) LK.15605.010 LED LCD SAMSU NG 15.
FRU (Field Repla ceable Unit) List 6-2 1 ANTENNA WLAN-AUX 50.R9702.002 LCD CABLE 50.R9702.003 LCD COVER IMR-BLUE 60.RFE02.002 LCD BEZEL 60.R9702.005 LCD BRACKET R&L 33.R9702.004 CAMERA 1.3M 57.R9702.001 LED LCD AUO 15.6"W WXGA Gla re B156XW02 V2 LF 200nit 8ms 500:1 (power saving) LK.
6-2 2 FRU (Field Replaceable Unit) List LCD ASSY LED LCD MODULE 15.6"W WXGA GLARE w/ ANTENNA*2, CCD 1.3M, 3G , BLUE 6M.R9702.002 ANTENNA 3G-MAIN 50.RFD02.005 ANTENNA 3G-AUX 50.RFD02.006 LCD CABLE 50.R9702.003 LCD COVER IMR-BLUE 60.RFE02.002 LCD BEZEL 60.
FRU (Field Repla ceable Unit) List 6-2 3 LED LCD AUO 15.6"W WXGA Gla re B156XW02 V2 LF 200nit 8ms 500:1 (power saving) LK.15605.010 LED LCD SAMSU NG 15.6"W WXGA Glare L TN156A T02-A1 1 LF 220nit 8ms 500:1 LK.15606.012 LED LCD CMO 15.6 "W WXGA Glare N156B6-L0B LF 220nit 8ms 650:1 LK.
6-2 4 FRU (Field Replaceable Unit) List Memory KINGSTON SO-D IMM DDRIII 1333 2GB ACR256X64D3S1333C9 LF 128* 8 0.065um KN.2GB07.004 Memory A-DA T A SO-DIMM DDRIII 1333 2GB AD73I1B1674EU LF 128*8 0.065um KN.2GB0C.006 Memory ELPIDA SO-DIMM DDR III 1333 4GB EBJ41UF8BAS0-DJ-F LF 256*8 0.
FRU (Field Repla ceable Unit) List 6-2 5 SPEAKER L 23.R9702.003 SPEAKER R 23.R9702.004 MISCELLANEOUS LCD SCREW MYLAR 47.R9702.001 T able 6-5. FRU List (Continued) Category Description P/N SG_JE50_HR.
6-2 6 FRU (Field Replaceable Unit) List Screw List 0 T able 6-6. Screw List Category Description P/N SCREW SCREW 2.5D 4L K 5.5D NI NL 86.R9702.001 SCREW 2.45D 8. 0L K 5.5D 0.8T ZK NL 86.R9 702.002 SCREW 1.98D 3. 0L K 4.6D 0.8T ZK NL 86.R9 702.003 SCREW 2D 5L K 4.
CHAPTER 7 Model Definition and Configuration SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
7-2 Aspire 5750 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-3 Aspire 5750G . . . . . . . . . . . . . . . . . .
Model Definition a nd Configuration 7-3 Model Definition and Configuration Aspire 5750 0 T able 7-1. RO & Description Model RO Country Acer Part No Descr iption AS5750-23 12G32Mnkk AAP AU/NZ LX.R9702.024 AS575 0-2312G32Mnkk W7HP64ASAU1 MC UMACkk_3U 1*2G/320/6L2.
7-4 Model Definition and Configuration AS5750-23 13G32Mnkk EMEA TR LX.R9701.0 07 AS5750-2313G32Mnkk EM W7HB64EMASTR1 MC UMACkk_3U 2G+1G/320/6L2.2/5R/CB_bgn_1.3C_ GE k_TR31 AS5750-23 13G50Mnkk EMEA PL LX.R97 02.001 AS5750-2313G50Mnkk W7HP64ASPL1 MC UMACkk_3U 2G+1G/500_L/6L2 .
Model Definition a nd Configuration 7-5 AS5750-23 14G50Mnkk EMEA DE LX.R9702.046 AS5750-2314G50Mnkk W7 HP64ASDE1 MC UMACkk_3U 2*2G/500_L/6L2.2 /5R/CB_GN_1.3C_GE k_DE1 1 AS5750-23 14G50Mnkk EMEA IL LX.R9702.023 AS5750-2314G50Mnkk W7HP64ASIL 1 MC UMACkk_3U 2*2G/500_L/6L2.
7-6 Model Definition and Configuration AS5750-24 13G50Mnkk AAP IN LX.R9701.008 AS5750-2413G50Mnkk W7HB64INASIN1 MC UMACkk_3U 2G+1G/500_L/BT/6L2.2 /5R/CB_GN_1.3 C_GEk_ES61 AS5750-24 13G50Mnkk EMEA RS/BA LX.R9701.003 AS5750-2413G50Mnkk W7HB64ERASBA1 MC UMACkk_3U 2G+1G/500_L/BT/6 L2.
Model Definition a nd Configuration 7-7 AS5750-24 14G50Mnkk EMEA IL LX.R9702.022 AS5750-2414G50Mnkk W7HP64ASIL 1 MC UMACkk_3U 2*2G/500_L/6L2.2 /5R/CB_bgn_1.3C_G Ek_HE61 AS5750-24 14G50Mnkk EMEA IT LX.R9702.008 AS5750-2414G50Mnkk W7HP64ASIT1 MC UMACkk_3U 2*2G/500_L/6L2.
7-8 Model Definition and Configuration T able 7-2. BOM Name & CPU Model Country Acer Part No BOM Name CPU AS5750-2312G3 2Mnkk AU/NZ LX.R9702.02 4 AS5750_UMACkk_3U Ci32310M AS5750-2312G3 2Mnkk TR LX.R9701.00 6 AS5750_UMACkk_3U Ci32310M AS5750-2312G5 0Mnkk AU/NZ LX.
Model Definition a nd Configuration 7-9 AS5750-2413G5 0Mnkk RS/BA LX.R97 01.003 AS5750_UMACkk_3U Ci52410M AS5750-2413G5 0Mnkk RS/BA LX.R97 02.041 AS5750_UMACkk_3U Ci52410M AS5750-2414G3 2Mnkk AU/NZ LX.R9702.03 0 AS5750_UMACkk_3U Ci52410M AS5750-2414G3 2Mnkk IT LX.
7-1 0 Model Definition and Configuration AS5750-2313G5 0Mnkk PL LX.R9702.001 UMA N AS5750-2313G5 0Mnkk RO LX.R9702.032 UMA N AS5750-23 13G50Mnk k RS/B A LX.R970 1.002 UMA N AS5750-23 13G50Mnk k RS/B A LX.R970 2.040 UMA N AS5750-23 14G32Mnk k AU/NZ LX.
Model Definition a nd Configuration 7-1 1 AS5750-2414G5 0Mnkk IT LX.R9702.008 UMA N AS5750-24 14G50Mnk k RS/B A LX.R970 1.004 UMA N AS5750-2414G5 0Mnkk CH LX.R9702.0 20 UMA N AS5750-24 14G64Mnk k AU/NZ LX.R9702.02 6 UMA N AS5750-2414G6 4Mnkk JP LX.R9702.
7-1 2 Model Definition and Configuration AS5750-2314G5 0Mnkk DE LX.R9702.046 SO2GBIII10 SO2GBIII10 AS5750-2314G5 0Mnkk IL LX.R9702.023 SO2GBIII10 SO2GBIII10 AS5750-2314G5 0Mnkk IT LX.R9702.006 SO2GBIII10 SO2GBIII10 AS5750-2314G5 0Mnkk ZA LX.R9702.045 SO2GBIII10 SO2GBIII10 AS5750-2314G5 0Mnkk ES LX.
Model Definition a nd Configuration 7-13 T able 7-5. HDD 1 & ODD Model Country Acer Part No HDD 1(GB) ODD AS5750-2312G3 2Mnkk AU/NZ LX.R9702.02 4 N320GB5.4KS_ 4K N SM8XS AS5750-2312G3 2Mnkk TR LX.R9701.006 N320GB5.4KS NSM8XS AS5750-2312G5 0Mnkk AU/NZ LX.
7-1 4 Model Definition and Configuration AS5750-2413G5 0Mnkk RS/BA LX.R9701.00 3 N500GB5.4KS NSM8XS AS5750-2413G5 0Mnkk RS/BA LX.R9702.04 1 N500GB5.4KS NSM8XS AS5750-2414G3 2Mnkk AU/NZ LX.R9702.03 0 N320GB5.4KS_ 4K N SM8XS AS5750-2414G3 2Mnkk IT LX.R9702.
Model Definition a nd Configuration 7-15 AS5750-2313G3 2Mnkk TR LX.R9701.007 3rd WiFi 2x2 BGN N 65W AS5750-2313G5 0Mnkk PL LX.R9702.001 3rd WiFi 2x2 BGN N 65W AS5750-2313G5 0Mnkk RO LX.R9 702.032 3rd WiFi 2x2 BGN N 65W AS5750-2313G5 0Mnkk RS/BA LX.R9701.
7-1 6 Model Definition and Configuration AS5750-2414G5 0Mnkk IL LX.R9702.022 3rd WiFi 2x2 BGN N 65W AS5750-2414G5 0Mnkk IT LX.R9702.008 3rd WiFi 2 x2 BGN N 65W AS5750-2414G5 0Mnkk RS/BA LX.R9701.004 3rd WiFi 2x2 BGN BT 3.0 65W AS5750-2414G5 0Mnkk CH LX.
Model Definition a nd Configuration 7-17 Aspire 5750G 0 T able 7-7. RO & Description Model RO Country Acer Part No Des cription AS5750G-23 12G32Mnkk AAP AU/NZ LX.RAZ02.025 AS5750G-2312G32Mnkk W7HP64ASAU1 MC N12PGS1GBCkk_3V3U 1*2G/320/6L2.2 /5R/CB_bgn_1.
7-1 8 Model Definition and Configuration AS5750G-23 13G50Mnkk EMEA RS/BA LX.RAZ01.005 AS5750G-2313G50Mnkk W7HB64ERASBA1 MC N12PGS1GBCkk_3V3U 2G+1G/500_L/BT/6L2.2/5R/CB_bgn _1.3C_GEk_A151 AS5750G-23 13G50Mnkk EMEA RS/BA LX.RAZ02.056 AS5750G-2313G50Mnkk W7HP64ASBA1 MC N12PGS1GBCkk_3V3U 2G+1G/500_L/BT/6L2.
Model Definition a nd Configuration 7-19 AS5750G-23 14G32Mnkk EMEA PT LX.RAZ02.039 AS5750G-2314G32Mnkk W7HP64ASPT1 MC N12PGS1GBCkk_3V3U 2*2G/320/6L2.2 /5R/CB_bgn_1.3C_G Ek_P T1 1 AS5750G-23 14G32Mnkk EMEA TR LX.RAZ01.003 AS5750G-2314G32Mnkk EM W7HB64EMASTR1 MC N12PGS1GBCkk_3V3U 2*2G/320/6L2.
7-2 0 Model Definition and Configuration AS5750G-23 14G50Mnkk EMEA ZA LX.RAZ02.063 AS5750G-2314G50Mnkk EM W7HP64EMASZA2 MC N12PGS1GBCkk_3V3U 1*4G/500_L/6L2.2/5R/CB_bgn_1 .3C _GEk_ES61 AS5750G-23 14G64Mnkk AAP AU/NZ LX.RAZ02.029 AS5750G-2314G64Mnkk W7HP64ASAU1 MC N12PGS1GBCkk_3V3U 2*2G/640/6L2.
Model Definition a nd Configuration 7-21 AS5750G-24 12G50Mnkk AAP AU/NZ LX.RAZ02.032 AS5750G-2412G50Mnkk W7HP64ASAU1 MC N12PGS1GBCkk_3V3U 1*2G/500_L/6L2.2/5R/CB_bgn_1 .3C _GEk_ES62 AS5750G-24 12G50Mnkk EMEA PL LX.RAZ02.009 AS5750G-2412G50Mnkk W7HP64ASPL1 MC N12PGS1GBCkk_3V3U 1*2G/500_L/6L2.
7-2 2 Model Definition and Configuration AS5750G-24 14G50Bnkk AAP AU/NZ LX.RAZ02.021 AS5750G-2414G50Bnkk W7HP64ASAU1 MC N12PGS1GBCkk_3V3U 2*2G/500_L/6L2.2/5R/CB_bgn_1 .3C _GEk_ES62 AS5750G-24 14G50Bnkk AAP AU/NZ LX.RAZ02.022 AS5750G-2414G50Bnkk W7HP64ASAU1 MC N12PGS1GBCkk_3V3U 2*2G/500_L/BT/6L2.
Model Definition a nd Configuration 7-23 AS5750G-24 14G50Mnkk EMEA PT LX.RAZ02.040 AS5750G-2414G50Mnkk W7HP64ASPT1 MC N12PGS1GBCkk_3V3U 2*2G/500_L/6L2.2/5R/CB_bgn_1 .3C _GEk_PT1 1 AS5750G-24 14G50Mnkk EMEA RS/BA LX.RAZ02.058 AS5750G-2414G50Mnkk W7HP64ASBA1 MC N12PGS1GBCkk_3V3U 2*2G/500_L/BT/6L2.
7-2 4 Model Definition and Configuration AS5750G-24 14G64Mnkk EMEA ES LX.RAZ02.012 AS5750G-2414G64Mnkk W7HP64ASES1 MC N12PGS1GBCkk_3V3 2*2G/640/6L2.2 /5R/CB_bgn_1.3C_G Ek_ES5 1 AS5750G-24 14G64Mnkk EMEA ES LX.RAZ02.038 AS5750G-2414G64Mnkk W7HP64ASES1 MC N12PGS1GBCkk_3V3U 2*2G/640/6L2.
Model Definition a nd Configuration 7-25 AS5750G-24 14G75Bnkk AAP AU/NZ LX.RAZ02.052 AS5750G-2414G75Bnkk W7HP64ASAU1 MC N12PGS1GBCkk_3V3U 1*4G/750/6L2.2 /5R/CB_bgn_1.3C_G Ek_ES6 2 AS5750G-24 14G75Bnkk EMEA DE LX.RAZ02.004 AS5750G-2414G75Bnkk W7HP64ASDE1 MC N12PGS1GBCkk_3V3U 2*2G/750/6L2.
7-2 6 Model Definition and Configuration AS5750G-24 14G75Mnkk EMEA GR LX.RAZ02.016 AS5750G-2414G75Mnkk W7HP64ASGR1 MC N12PGS1GBCkk_3V3U 2*2G/750/6L2.2 /5R/CB_bgn_1.3C_G Ek_EL3 2 AS5750G-24 14G75Mnkk EMEA IT LX.RAZ02.006 AS5750G-2414G75Mnkk W7HP64ASIT1 MC N12PGS1GBCkk_3V3U 2*2G/750/6L2.
Model Definition a nd Configuration 7-27 AS5750G-26 34G50Mnkk EMEA BE LX.RCF02.053 AS575 0G-2634G50Mnkk W7HP64ASBE1 MC N12PGS1GBCkkQ_3V3 U 1*4G/500_L/6L2.2/5R/CB_bgn_1 .3C _GEk_NL1 1 AS5750G-26 34G50Mnkk EMEA CH LX.RCF02.070 AS5 750G-2634G50Mnkk W7HP64ASCH1 M C N12PGS1GBCkkQ_3V3 U 2*2G/500_L/6L2.
7-2 8 Model Definition and Configuration AS5750G-26 34G50Mnkk EMEA LU LX.RCF02.045 AS5750G-2634G50Mnkk W7HP64ASLU3 MC N12PGS1GBCkkQ_3V3 U 2*2G/500_L/6L2.2/5R/CB_bgn_1 .3C _GEk_IT41 AS5750G-26 34G50Mnkk EMEA LU LX.RCF02.055 AS5750G-2634G50Mnkk W7HP64ASLU3 MC N12PGS1GBCkkQ_3V3 U 1*4G/500_L/6L2.
Model Definition a nd Configuration 7-29 AS5750G-26 34G64Bnkk AAP AU/NZ LX.RCG02.020 AS5750G-2634G64Bnkk W7HP64ASAU1 MC N12PGS2GBCkkQ_3V3 U 2*2G/640/BT/6L2.2/5R/CB_bgn_1.3 C_GEk_ES62 AS5750G-26 34G64Bnkk AAP JP LX.RCF02.013 AS 5750G-2634G64Bn kk W7HP64AJP1 MC N12PGS1GBCkkQ_3V3 U 1*4G/640/BT/6L2.
7-3 0 Model Definition and Configuration AS5750G-26 34G64Mnkk P A AR LX.RCF02.012 AS5750G-2634G64Mnkk EM W7HP64EMASAN1 MC N12PGS1GBCkkQ_3V3 U 2*2G/640/6L2.2 /5R/CB_bgn_1.3C_G Ek_P T21 AS5750G-26 34G64Mnkk AAP AU/NZ LX.RCF02.059 AS5750G-2634G64Mnkk W7HP64ASAU1 MC N12PGS1GBCkkQ_3V3 U 1*4G/640/BT/6L2.
Model Definition a nd Configuration 7-31 AS5750G-26 34G64Mnkk EMEA GR LX.RCG02.012 AS5750G- 2634G64Mnkk W7HP64ASGR1 MC N12PGS2GBCkkQ_3V3 U 2*2G/640/6L2.2 /5R/CB_bgn_1.3C_G Ek_EL3 2 AS5750G-26 34G64Mnkk CN HK LX.RCF02.056 AS5750G-2634G64Mnkk W7HP64ASHK2 MC N12PGS1GBCkkQ_3V3 U 2*2G/640/BT/6L2.
7-3 2 Model Definition and Configuration AS5750G-26 34G64Mnkk AAP MY LX.RCF02.065 AS5750G-2634G64Mnkk EM W7HP64EMASMY1 MC N12PGS1GBCkkQ_3V3 U 2*2G/640/6L2.2 /5R/CB_bgn_1.3C_G Ek_ES6 1 AS5750G-26 34G64Mnkk EMEA NL LX.RCF02.041 AS5750G-2634G64Mnkk W7HP64ASNL1 MC N12PGS1GBCkkQ_3V3 U 2*2G/640/6L2.
Model Definition a nd Configuration 7-33 AS5750G-26 34G75Bnkk EMEA BE LX.RCG02.032 AS5750G-2634G75Bnkk W7HP64ASBE1 MC N12PGS2GBCkkQ_3V3 U 1*4G/750/BT/6L2.2/5R/CB_bgn_1.3 C_GEk_N L1 1 AS5750G-26 34G75Bnkk EMEA CH LX.RCF02.017 AS5750G-2634G75Bnkk W7HP64ASCH1 M C N12PGS1GBCkkQ_3V3 U 2*2G/750/6L2.
7-3 4 Model Definition and Configuration AS5750G-26 34G75Mnkk EMEA FR LX.RCG02.001 AS5750G-2634G75Mnkk W7HP64ASFR1 MC N12PGS2GBCkkQ_3V3 U 2*2G/750/6L2.2 /5R/CB_bgn_1.3C_G Ek_FR 21 AS5750G-26 34G75Mnkk TWN GCTWN LX.RCG02.038 AS5750G-2634G75Mnkk W7HP64ASTW1 MC N12PGS2GBCkkQ_3V3 U 2*2G/750/BT/6L2.
Model Definition a nd Configuration 7-35 AS5750G-26 36G64Mnkk EMEA ES LX.RCG02.009 AS5750G-2636G64Mnkk W7HP64ASES1 MC N12PGS2GBCkkQ_3V3 U 4G+2G/640/6L2.2/5 R/CB_bgn_1.3C _GEk_ES51 AS5750G-26 36G64Mnkk EMEA IT LX.RCF02.002 AS5750G-2636G64Mnkk W7HP64ASIT1 MC N12PGS1GBCkkQ_3V3 U 2G+4G/640/6L2.
7-3 6 Model Definition and Configuration AS5750G-26 36G75Mnkk EMEA ME LX.RCG02.006 AS5750G-2636G75Mnkk EM W7HP64EMASME1 MC N12PGS2GBCkkQ_3V3 U 4G+2G/750/BT/6L2.2/5R/CB_bgn_1. 3C_GEk_ARA1 AS5750G-26 36G75Mnkk EMEA ZA LX.RCG02.040 AS5750G-2636G75Mnkk EM W7HP64EMASZA2 MC N12PGS2GBCkkQ_3V3 U 4G+2G/750/BT/6L2.
Model Definition a nd Configuration 7-37 AS5750G-26 38G75Mnkk EMEA RO LX.RCG02.028 AS575 0G-2638G75Mnkk W7HP64ASRO2 MC N12PGS2GBCkkQ_3V3 U 2*4G/750/6L2.2 /5R/CB_bgn_1.3C_G Ek_RO 1 1 AS5750G-28 24G64Mnbb AAP KR LX.RG502.003 AS 5750G-2824G64Mnbb W7HP64KASKR1 MC N12PGS1GBCbbQ_3V3U 1*4G/640/BT/6L2.
7-3 8 Model Definition and Configuration AS5750G-23 13G50Mnkk TR LX.RAZ01.002 AS5750G_N12PGS1GBCkk_3V3U Ci32310M AS5750G-23 13G50Mnkk TR LX.RCS01.00 2 AS5750G_N12PGV512Ckk_3V3U Ci32310M AS5750G-23 14G32Bnkk DE LX.RAZ02.003 AS5750G_N12PGS1GBCkk_3V3U Ci32310M AS5750G-23 14G32Mnkk AU/NZ LX.
Model Definition a nd Configuration 7-39 AS5750G-23 14G75Mnkk AU/NZ LX.RAZ02.030 AS5750G_N12PGS1GBCkk_3V3U Ci32310M AS5750G-23 14G75Mnkk IT LX.RAZ02.017 AS5750G_N12PGS1GBCkk_3V3U Ci32310M AS5750G-24 12G32Mnkk AU/NZ LX.RAZ02.031 AS5750G_N12PGS1GBCkk_3V3U Ci52410M AS5750G-24 12G32Mnkk CA LX.
7-4 0 Model Definition and Configuration AS5750G-24 14G50Mnkk IT LX.RAZ02.005 AS5750G_N12PGS1GBCkk_3V3U Ci52410M AS5750G-24 14G50Mnkk PL LX.RAZ02.008 AS5750G_N12PGS1GBCkk_3V3U Ci52410M AS5750G-24 14G50Mnkk PT LX.RAZ02.040 AS5750G_N12PGS1GBCkk_3V3U Ci52410M AS5750G-24 14G50Mnkk RS/BA LX.
Model Definition a nd Configuration 7-41 AS5750G-24 14G75Bnkk AU/NZ LX.RAZ02.052 AS5750G_N12PGS1GBCkk_3V3U Ci52410M AS5750G-24 14G75Bnkk DE LX.RAZ02.004 AS5750G_N12PGS1GBCkk_3V3U Ci52410M AS5750G-24 14G75Bnkk DE LX.RAZ02.066 AS5750G_N12PGS1GBCkk_3V3U Ci52410M AS5750G-24 14G75Bnkk PT LX.
7-4 2 Model Definition and Configuration AS5750G-26 34G50Mnkk CN LX.RCF02.047 AS575 0G_N12PGS1GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G50Mnkk DE LX.RCF02.062 AS5750G_N12PGS1GBCkkQ_3 V3U Ci72630Q M AS5750G-26 34G50Mnkk ES LX.RCF02.007 AS5750G_N12PGS1GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G50Mnkk ES LX.
Model Definition a nd Configuration 7-43 AS5750G-26 34G64Mnbb KR LX.RG502.001 AS5750G_N12PGS1GBCbbQ_3V3U Ci72630Q M AS5750G-26 34G64Mnbb KR LX.RG50C.00 1 AS5750G_N12PGS1GBCbbQ_3V3U Ci72630Q M AS5750G-26 34G64Mnbb KR LX.RG602.003 AS5750G_N12PGS2GBCbbQ_3V3U Ci72630Q M AS5750G-26 34G64Mnkk ACLA - ES LX.
7-4 4 Model Definition and Configuration AS5750G-26 34G64Mnkk LU LX.RCF02.052 AS5750G_N12PGS1GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G64Mnkk ME LX.RCF02.006 AS5750G_N12PGS1GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G64Mnkk ME LX.RCF02.015 AS5750G_N12PGS1GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G64Mnkk MY LX.
Model Definition a nd Configuration 7-45 AS5750G-26 34G75Mnkk DE LX.RCG02.03 7 AS5750G_N12PGS2GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G75Mnkk FR LX.RCG02.00 1 AS5750G_N12PGS2GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G75Mnkk GCTW N LX.RCG02.03 8 AS5750G_N12PGS2GBCkkQ_3V3U Ci72630Q M AS5750G-26 34G75Mnkk GR LX.
7-4 6 Model Definition and Configuration AS5750G-26 36G75Mnkk ZA LX.RCG02.04 0 AS5750G_N12PGS2GBCkkQ_3V3U Ci72630Q M AS5750G-26 38G50Mnkk ES LX.RCF02.008 AS5750G_N12PGS1GBCkkQ_3V3U Ci72630Q M AS5750G-26 38G64Mnkk AU/NZ LX.RCG02.02 7 AS5750G_N12PGS2GBCkkQ_3V3U Ci72630Q M AS5750G-26 38G75Bnkk BG LX.
Model Definition a nd Configuration 7-47 AS5750G-2313G50M nkk TR LX.RCS01.002 N12PGV 512M-DDR3 (64*16*4) AS5750G-2314G32Bn kk DE LX.RAZ02.003 N12PGS 1G-DDR3 (64*16*8 ) AS5750G-2314G32Mnkk AU/NZ LX.RAZ02.026 N12PGS 1G-DDR3 (64*16*8) AS5750G-2314G32Mnkk IT LX.
7-4 8 Model Definition and Configuration AS5750G-2414G50Bnkk AU/NZ LX.RAZ02.022 N12PGS 1G-DDR3 (64*16*8) AS5750G-2414G50Bn kk DE LX.RAZ02.047 N12PGS 1G-DDR3 (64*16*8 ) AS5750G-2414G50M ikk RU LX.RAZ01.004 N12PGS 1G-DDR3 (64*16*8) AS5750G-2414G50Mnkk AU/NZ LX.
Model Definition a nd Configuration 7-49 AS5750G-2414G75Mnkk DE LX.RAZ02.0 55 N12PGS 1G-DDR3 (64*16*8) AS5750G-2414G75Mnkk DK LX.RAZ02.0 48 N12PGS 1G-DDR3 (64*16*8) AS5750G-2414G75Mnkk GR LX.RAZ02.016 N12PGS 1G-DDR3 (64*16*8) AS5750G-2414G75Mnkk IT LX.
7-5 0 Model Definition and Configuration AS5750G-2634G64M nbb KR LX.RG502.001 N12PGS 1G-DDR3 (64*16*8) AS5750G-2634G64M nbb KR LX.RG50C.001 N12PGS 1G-DDR3 (64*16*8) AS5750G-2634G64M nbb KR LX.RG602.003 N12PGS 2G-DDR3 (128*16*8) AS5750G-2634G64Mnkk ACLA - ES LX.
Model Definition a nd Configuration 7-51 AS5750G-2634G75Bnkk CH LX.RCF02.017 N12PGS 1G-DDR3 (64*16*8) AS5750G-2634G75Bn kk DE LX.RCG02.002 N12PGS 2G-DDR3 (128*16*8) AS5750G-2634G75Bn kk LU LX.RCG02.034 N12PGS 2G-DDR3 (128*16 *8) AS5750G-2634G75Bn kk NL LX.
7-5 2 Model Definition and Configuration AS5750G-2638G75Mnkk AU/NZ LX.RCG02.026 N12PGS 2G-DDR3 (128*16*8) AS5750G-2638G75M nkk ME LX.RCG02.007 N12PGS 2G-DDR3 (128*16*8) AS5750G-2638G75M nkk RO LX.RCG02.028 N12PGS 2G-DDR3 (128*16*8) AS5750G-2824G64M nbb KR LX.
Model Definition a nd Configuration 7-53 AS5750G-2314G50M nkk IT LX.RCS02 .003 SO2GBIII10 SO2GBIII10 AS5750G-2314G50M nkk ZA LX. RAZ02.063 SO4GBIII10 N AS5750G-2314G64M nkk AU/NZ LX.RAZ 02.029 SO2GBIII10 SO2GBIII10 AS5750G-2314G64M nkk GR LX.RAZ0 2.015 SO2GBIII10 SO2GBIII10 AS5750G-2314G64M nkk IT LX.
7-5 4 Model Definition and Configuration AS5750G-2414G64Bn kk AU/NZ LX .RAZ02.050 SO4GBIII10 N AS5750G-2414G64M nkk AU/NZ LX.RAZ 02.019 SO2GBIII10 SO2GBIII10 AS5750G-2414G64M nkk AU/NZ LX .RAZ02.049 SO4GBIII10 N AS5750G-2414G64M nkk CH LX.RCS02 .004 SO2GBIII10 SO2GBIII10 AS5750G-2414G64M nkk ES LX.
Model Definition a nd Configuration 7-55 AS5750G-2634G50M nkk CN LX. RCF02.047 SO4GBIII10 N AS5750G-2634G50M nkk DE LX.RCF02 .062 SO2GBIII10 SO2GBIII10 AS5750G-2634G50M nkk ES LX.RCF02 .007 SO2GBIII10 SO2GBIII10 AS5750G-2634G50M nkk ES LX.RCF02 .009 SO2GBIII10 SO2GBIII10 AS5750G-2634G50M nkk FR LX.
7-5 6 Model Definition and Configuration AS5750G-2634G64M nkk ES LX.RCG02 .029 SO2GBIII10 SO2GBIII10 AS5750G-2634G64M nkk GR LX.RCG02 .012 SO2GBIII10 SO2GBIII10 AS5750G-2634G64M nkk HK LX.RCF02 .056 SO2GBIII10 SO2GBIII10 AS5750G-2634G64M nkk IL LX.RCF02 .
Model Definition a nd Configuration 7-57 AS5750G-2 636G50Bnk k AU/NZ LX.RCG02.022 SO4GBIII10 SO2G BIII10 AS5750G-2636G50M nkk AU/NZ LX.RCG 02.025 SO4GBIII1 0 SO2GBIII10 AS5750G-2 636G64Bnk k AU/NZ LX.RCG02.023 SO4GBIII10 SO2G BIII10 AS5750G-2636G64M nkk AU/NZ LX.
7-5 8 Model Definition and Configuration AS5750G-2312G50M nkk VN LX.RCS 02.007 N500GB5.4KS NSM8XS AS5750G-2312G64M nkk GCTWN LX.R AZ02.0 46 N640GB5.4KS NSM8XS AS5750G-2313G32Mikk RU LX.RCS01.001 N320GB5.4KS_4K NSM8XS AS5750G-2313G50M nkk RS/BA LX.R AZ01.
Model Definition a nd Configuration 7-59 AS5750G-2412G50M nkk VN LX.RCS 02.008 N500GB5.4KS NSM8XS AS5750G-2412G64M nkk GCTWN LX.R AZ02.0 14 N640GB5.4KS NSM8XS AS5750G-2413G32M nkk GR LX.RAZ02.044 N320GB5.4KS NSM8XS AS5750G-2413G50M nkk IN LX.RAZ01.006 N500GB5.
7-6 0 Model Definition and Configuration AS5750G-2414G75Bn kk AU/NZ LX.RAZ 02 .052 N750GB5.4KS NBDCB4XS AS5750G-2414G75Bn kk DE LX.RAZ02.004 N750GB5.4KS NBDCB4XS AS5750G-2414G75Bn kk DE LX.RAZ02.066 N750GB5.4KS NBDCB4XS AS5750G-2414G75Bn kk PT LX.RAZ02.
Model Definition a nd Configuration 7-61 AS5750G-2634G50M nkk TR LX.RCF02.071 N500GB5.4KS NSM8XS AS5750G-2634G50M nkk U SA LX.RCF02.049 N500GB5.4KS NSM8 XS AS5750G-2634G64Bn kk AU/NZ LX.RCF 02 .060 N640GB5.4KS NBDCB4XS AS5750G-2634G64Bn kk AU/NZ LX.RCG 02.
7-6 2 Model Definition and Configuration AS5750G-2634G64M nkk UK LX.RCF02.039 N640GB5.4KS NSM8XS AS5750G-2634G64M nkk ZA LX.RCF02.067 N640GB5.4KS NSM8XS AS5750G-2634G64M nkk ZA LX.RCF02.069 N640GB5.4KS NSM8XS AS5750G-2634G75Bn kk AU/NZ LX.RCF 02 .058 N750GB5.
Model Definition a nd Configuration 7-63 AS5750G-2636G75M nkk ME LX.RCG 02.006 N750GB5.4KS NSM8XS AS5750G-2636G75M nkk ZA LX.RCG 02.040 N750GB5.4KS NSM8XS AS5750G-2638G50M nkk ES LX.RCF02.008 N500GB5.4KS NSM8XS AS5750G-2638G64M nkk AU/NZ LX. RCG02.027 N640GB5.
7-6 4 Model Definition and Configuration AS5750G-23 13G50Mnkk TR LX.RAZ01.002 3rd WiFi 2x2 BGN N 90W AS5750G-23 13G50Mnkk TR LX.RCS01.002 3rd WiFi 2x2 BGN N 90W AS5750G-23 14G32Bnkk DE LX.RAZ02.003 3rd WiFi 2x2 BGN N 90W AS5750G-23 14G32Mnkk AU/NZ LX.
Model Definition a nd Configuration 7-65 AS5750G-23 14G75Mnkk AU/NZ LX.RAZ02. 030 3 rd WiFi 2x2 BGN N 90W AS5750G-23 14G75Mnkk IT LX.RAZ02.017 3rd WiFi 2x2 BGN N 90W AS5750G-24 12G32Mnkk AU/NZ LX.RAZ02. 031 3 rd WiFi 2x2 BGN N 90W AS5750G-24 12G32Mnkk CA LX.
7-6 6 Model Definition and Configuration AS5750G-24 14G50Mnkk IT LX.RAZ02.005 3rd WiFi 2x2 BGN N 90W AS5750G-24 14G50Mnkk PL LX.RAZ02.008 3rd WiFi 2x2 BGN N 90W AS5750G-24 14G50Mnkk PT LX.RAZ02.040 3rd WiFi 2x2 BGN N 90W AS5750G-24 14G50Mnkk RS/BA LX.
Model Definition a nd Configuration 7-67 AS5750G-24 14G75Bnkk AU/NZ LX.RAZ02. 052 3 rd WiFi 2x2 BGN N 90W AS5750G-24 14G75Bnkk DE LX.RAZ02.004 3rd WiFi 2x2 BGN N 90W AS5750G-24 14G75Bnkk DE LX.RAZ02.066 3rd WiFi 2x2 BGN N 90W AS5750G-24 14G75Bnkk PT LX.
7-6 8 Model Definition and Configuration AS5750G-26 34G50Mnkk CN LX.RCF02.047 3rd WiFi 2x2 BGN BT 3.0 90W AS5750G-26 34G50Mnkk DE LX.RCF02.062 3rd WiFi 2 x2 BGN N 90W AS5750G-26 34G50Mnkk ES LX.RCF02.007 3rd WiFi 2x2 BGN N 120W-DE AS5750G-26 34G50Mnkk ES LX.
Model Definition a nd Configuration 7-69 AS5750G-26 34G64Mnbb KR LX.RG502.00 1 3rd WiFi 2x2 BGN BT 3.0 90W AS5750G-26 34G64Mnbb KR LX.RG50C.001 3r d WiFi 2x2 BGN N 90W AS5750G-26 34G64Mnbb KR LX.RG602.00 3 3rd WiFi 2x2 BGN BT 3.0 90W AS5750G-26 34G64Mnkk ACLA - ES LX.
7-7 0 Model Definition and Configuration AS5750G-26 34G64Mnkk LU LX.RCF02.052 3rd WiFi 2x2 BGN N 90W AS5750G-26 34G64Mnkk ME LX.RCF02.006 3rd WiFi 2x2 BGN BT 3.0 120W-DE AS5750G-26 34G64Mnkk ME LX.RCF02.015 3rd WiFi 2x2 BGN BT 3.0 90W AS5750G-26 34G64Mnkk MY LX.
Model Definition a nd Configuration 7-71 AS5750G-26 34G75Mnkk DE LX.RCG02.037 3rd WiFi 2x2 BGN N 90W AS5750G-26 34G75Mnkk FR LX.RCG02.001 3rd WiFi 2 x2 BGN N 120W-DE AS5750G-26 34G75Mnkk GCTWN LX.RCG02.038 3rd WiFi 2x2 BGN BT 3.0 90W AS5750G-26 34G75Mnkk GR LX.
7-7 2 Model Definition and Configuration AS5750G-26 36G75Mnkk ZA LX.RCG02.040 3rd WiF i 2x2 BGN BT 3.0 90W AS5750G-26 38G50Mnkk ES LX.RCF02.008 3rd WiFi 2x2 BGN N 120W-DE AS5750G-26 38G64Mnkk AU/NZ LX.RCG02.027 3r d WiFi 2x2 BGN BT 3.0 90W AS5750G-26 38G75Bnkk BG LX.
CHAPTER 8 T est Comp atible Component s SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
8-2 Microsoft® Windows® 7 Envi ronment Test . . . . . . . . . . . . . . . 8-4 Aspire 5750/5750G . . . . . . . . . . . . . . . . . . . . . . . . . . .
T est Compatible Compone nts 8- 3 Test Compatible Components This computer ’s compatibility is tested and verified by Acer ’s in ternal testing dep artment. All of its system functions are tested under Windows ® 7 environment. Refer to the fo llowing lists for component s, adapter ca rds, and perip herals which have p assed these tests.
8-4 T e st Compatible Compone nts Microsoft ® Windows ® 7 Environment Test 0 Aspire 5750/5750G 0 T able 8-1. Aspire 57050/5750G V endor Ty p e Description P/N 3G 60027216 ERICSS ON F5521gw Ericsson F5521gw LC.21300.05 6 60027216 ERICSS ON F5521gw Ericsson F5521gw LC.
T est Compatible Compone nts 8- 5 10001081 DEL T A 90W Adapter DEL T A 90W 19V 1.7x5.5x 1 1 Blue ADP-90CD D BH, L V5 LED LF AP .09001.031 60016453 CHICONY POWER 65W Adapter Chicony Power 65W 19V 1.7x5.5x1 1 Y ellow CP A09-A06 5N1, L V5 , low profile LF AP .
8-6 T e st Compatible Compone nts 10001018 HON HAI BT 3.0 Foxconn Bluetooth A TH AR301 1 (BT3.0) BH.21 100.009 23707801 FOXCONN TW BT 2.1 Foxconn Bluetooth BRM 2070 (T77H1 14.01) BH.21 100.007 23707801 FOXCONN TW BT 2.1 Foxconn Bluetooth A TH AR301 1 BH.
T est Compatible Compone nts 8- 7 60001922 TOSHIBA DIGI N500GB5.4K S HDD T OSHIBA 2.5" 5400rpm 500GB MK5065GSX,Capricorn BS, 320G/P SA T A 8MB LF F/W:GJ002J KH.50004.002 60001994 WD N160GB5.4KS HDD WD 2.5" 5400rpm 160GB WD1600BEVT -22A23T0 , WD, ML320S SA T A 8MB LF F/W:01.
8-8 T e st Compatible Compone nts 60002036 SEAGA TE N160GB5.4KS HDD SEAGA TE 2.5" 5400rpm 160GB ST9160314AS,9HH13C-1 89, Seagate(ne w pcb) SA T A 8M B LF F/W:0001SDM1 KH.16001.045 60002036 SEAGA TE N250GB5.4KS HDD SEAGA TE 2.5" 5400rpm 250GB ST9250315AS, 9HH132-18 9, Wyatt wi th new pcb SA T A 8MB LF F/W:0001SDM1 KH.
T est Compatible Compone nts 8- 9 60002045 HYNIX SO2GBIII13 Memory HYNIX SO-DIMM DDRIII 1333 2GB HMT325S6BFR8C-H9 LF 256*8 46nm KN.2GB0G .018 60002045 HYNIX SO4GBIII13 Memory HYNIX SO-DIMM DDRIII 1333 4GB HMT351S6AFR8C-H9 LF 256*8 0.05 5um KN.4GB0G .003 60002215 SAMSUNG SO2GBIII10 Memory NONE SO-DIMM DDRIII 1066 2GB dum my 1066 LF KN.
8-1 0 T est Compatible Components 60001939 PIONEER NSM8XS ODD PIONEER Super-Multi DRIVE 12.7mm T ray DL 8X DVR-TD10RS LF W/O bezel 1.00 SA T A KU.00805.049 610105 HLDS NBDCB4XS ODD HLDS BD COMBO 12.7mm T ray DL 4X CT21N LF W/O bezel 1.00 SA T A (HF + Wind ows 7) KO.
T est Compatible Compone nts 8-1 1 Wireless LAN 10001067 INTEL INT6205H Lan Intel WLAN TBD T aylor Peak 2x2 AGN KI.TPH01.001 10001067 INTEL INT6250H WiMax Intel WLAN 622ANXHMWG Kilmer Peak 2x2 AGN KI.KPH01.001 23707801 FOXCONN TW 3rd WiFi 2x2 BGN Foxconn Wireless LAN Athero s HB97 2x2 BGN (HM) NI.
8-1 2 T est Compatible Components SG_JE50_HR.book Page 12 Thursday, December 23, 2010 3:47 PM.
CHAPTER 9 Online Support Information SG_JE50_HR.book Page 1 Thursday, D ecember 23, 2010 3:47 PM.
9-2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-3 SG_JE50_HR.book Page 2 Thursday, D ecember 23, 2010 3:47 PM.
Online Support In formation 9-3 Online Support Information Introduction 0 This section describes online tech nical support services available to help user s repair their Acer Systems. For distributors, dealers, ASP or TPM, please refer the technical querie s to a local Acer branch of fice.
9-4 Online Support Inform ation SG_JE50_HR.book Page 4 Thursday, D ecember 23, 2010 3:47 PM.
Een belangrijk punt na aankoop van elk apparaat Acer AS5750G (of zelfs voordat je het koopt) is om de handleiding te lezen. Dit moeten wij doen vanwege een paar simpele redenen:
Als u nog geen Acer AS5750G heb gekocht dan nu is een goed moment om kennis te maken met de basisgegevens van het product. Eerst kijk dan naar de eerste pagina\'s van de handleiding, die je hierboven vindt. Je moet daar de belangrijkste technische gegevens Acer AS5750G vinden. Op dit manier kan je controleren of het apparaat aan jouw behoeften voldoet. Op de volgende pagina's van de handleiding Acer AS5750G leer je over alle kenmerken van het product en krijg je informatie over de werking. De informatie die je over Acer AS5750G krijgt, zal je zeker helpen om een besluit over de aankoop te nemen.
In een situatie waarin je al een beziter van Acer AS5750G bent, maar toch heb je de instructies niet gelezen, moet je het doen voor de hierboven beschreven redenen. Je zult dan weten of je goed de alle beschikbare functies heb gebruikt, en of je fouten heb gemaakt die het leven van de Acer AS5750G kunnen verkorten.
Maar de belangrijkste taak van de handleiding is om de gebruiker bij het oplossen van problemen te helpen met Acer AS5750G . Bijna altijd, zal je daar het vinden Troubleshooting met de meest voorkomende storingen en defecten #MANUAl# samen met de instructies over hun opplosinge. Zelfs als je zelf niet kan om het probleem op te lossen, zal de instructie je de weg wijzen naar verdere andere procedure, bijv. door contact met de klantenservice of het dichtstbijzijnde servicecentrum.
