Gebruiksaanwijzing /service van het product hcd-sd1 van de fabrikant Sony
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– 1 – MICROFILM HCD-SD1 SPECIFICA TIONS SERVICE MANUAL COMP ACT DISC RECEIVER — Continued on ne xt page — AEP Model UK Model E Model HCD-SD1 is the amplifier , CD and tuner section in CMT -SD1.
– 2 – CA UTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous r a- diation exposure. Notes on chip component replacement • Ne ver reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat.
– 3 – T ABLE OF CONTENTS 1. SER VICING NO TE .......................................................... 4 2. GENERAL .......................................................................... 7 3. DISASSEMBL Y 3-1. Loading Panel ..................
– 4 – SECTION 1 SER VICING NO TE OPENING THE DISC TRA Y WHEN PO WER IS OFF 1 Using a thin screwdriv er , rotate the inter nal cam in the arrow direction completely . 2 Open the glass door , and pull out the loading panel. 1 2 Pull up the glass door , in the arrow direction.
– 5 – POSITIONS FOR SER VICING THE CONNECTOR BO ARD, SUB-TRANS BO ARD , CHEMI-CON BO ARD, AND AMP BO ARD 1 Remov e the f our scre ws securing the upper cover , and remove the upper cov er. 2 Remov e the loading panel. (Ref er to SECTION 3 DISASSEM- BL Y .
– 6 – POSITION FOR SER VICING THE CD MECHANISM DECK 1 Remove the f our scre ws securing the upper cov er , and remove the upper cov er . 2 Remove the loading panel.
– 7 – Location of Parts and Contr ols 1 1/u (Po wer) button 2 CD disc tray 3 § button 4 V OLUME dial 5 ± / ) /TUNING + button SECTION 2 GENERAL Front P anel 15 12 13 11 14 7 8 9 10 2 3 5 6 1 4 6.
– 8 – SECTION 3 DISASSEMBL Y Note: Follo w the disassembly procedure in the numerical order given. 3-1. LO ADING P ANEL 3-2. GLASS ASSY 1 T urn ON the power , and press the EJECT button to open the tray . 2 Remove the loading panel in the arro w direction.
– 9 – 3-3. FRONT P ANEL 3-4. MAIN BO ARD AND TUNER UNIT 1 Three screws (BVTP3x8) 2 Three claws 4 Flat type wire (11core) (CN702) 5 Flat type wire (13core) (CN701) 6 F ront panel 3 1 Four scre ws (.
– 10 – 3-6. B ACK P ANEL 3-5. CD MECHANISM DECK 1 T wo screws (BVTP3x8) 8 T wo screws (BVTP3x8) 5 REG board 2 Connector (CN945) 4 Connector (CN994) 3 Connector (CN942) 9 CD mechanism deck 6 Three .
– 11 – 3-7. DISC T ABLE 3-8. OPTICAL PICK-UP 1 Screw (BV3x8) 2 Screw (BV3x8 ) 3 Holder (MG) assembly 4 Pull out the disc table . C B A 3 Flat type wire (16 core) (CNU101) 1 Mov e the claw in the arrow A direction. 2 Remov e the sled shaft in the arrow direction B .
– 12 – SECTION 4 SER VICE MODE K ey Chec k Mode for Complete Lighting of LED/Fluorescent Display T ube • Perform this mode to analyze and check malfunctions such as display defects and when b uttons do not work. Pr ocedure: 1. Press the 1/u button to turn on the po wer .
– 13 – SECTION 5 TEST MODE AGING MODE This unit is equipped with an aging mode. Use this mode for analyzing defects and for checks after completing repairs. After repairs, perform aging 100 times and check that the unit is normal. The aging mode is ex ecuted in the following sequence.
– 14 – Procedur e: 1. Connect oscilloscope to test point TP (RF). 2. T urned Power switch on. 3. Put disc (YEDS-18) in and playback. 4. Adjust R V101 so that the wav efor m is clear . (Clear RF signal wa veform means that the shape “ ◊ ” can be clearly distinguished at the center of the wav eform.
– 15 – Procedur e : 1. Connect oscilloscpe to test point TP (TEO) on BD board. 2. T ur n Po wer switc h on. 3. Put disc (YEDS-18) in to play the number fi ve track.
– 16 – SECTION 7 DIA GRAMS 7-1. CIRCUIT BO ARDS LOCA TION P ANEL-SW board MAIN board TRANS board SUB-TRANS board BD board LOADING board P ANEL board REG board AMP board CHEMI-CON boar d CONNECT OR.
HCD-SD1 – 17 – – 18 – 7-2. BLOCK DIA GRAMS – BD SECTION – 25 SLED MOTOR DRIVE 26 • 27 16 M SLO M102 SLED MOTOR 4 SPINDLE MOTOR DRIVE 1 • 2 M M101 SPINDLE MOTOR SLED/SPINDLE MOTOR DRIVE.
HCD-SD1 – 19 – – 20 – – MAIN SECTION – STBY+5.6V 90 65 66 67 20 21 22 99 98 69 76 39 38 37 36 4 15 8 28 35 5 6 7 82 83 84 85 86 87 88 100 38 37 36 35 22 4 2 16 43 45 52 53 60 63 49 50 61 6.
HCD-SD1 – 21 – – 22 – THIS NO TE IS COMMON FOR PRINTED WIRING BO ARDS AND SCHEMA TIC DIAGRAMS. (In addition to this, the necessary note is printed in each b lock.) For schematic diagrams. Note: • All capacitors are in µF unless otherwise noted.
HCD-SD1 7-3. SCHEMA TIC DIA GRAM – BD SECTION – • See page 22 for W aveforms. • See page 51 for IC Bloc k Diagrams. – 23 – – 24 – (Page 29) Note on Schematic Diagram: • Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions.
HCD-SD1 – 25 – – 26 – 7-4. PRINTED WIRING BO ARD – BD SECTION – • See page 16 for Cir cuit Boards Location. Ref . No . Location • Semiconductor Location • Semiconductor Location (Page 32) OPTICAL PICK-UP BLOCK KSS-213BA/S-N IC103 C-1 Q101 B-3 Q103 C-3 IC101 B-1 IC102 B-1 IC104 C-3 Q102 B-1 Ref.
HCD-SD1 – 27 – – 28 – 7-5. SCHEMA TIC DIA GRAM – MAIN (1/2) SECTION – • See page 22 for W aveforms. • See page 31 for Printed Wiring Board.
HCD-SD1 – 29 – – 30 – 7-6. SCHEMA TIC DIA GRAM – MAIN (2/2) SECTION – • See page 22 f or W aveforms. • See page 31 for Printed Wiring Board.
HCD-SD1 – 31 – – 32 – • Semiconductor Location 7-7. PRINTED WIRING BO ARD – MAIN SECTION – • See page 16 for Cir cuit Boards Location. D351 A-6 D751 G-5 D752 G-5 D753 G-6 D755 G-6 D791.
HCD-SD1 (Page 49) (Page 45) – 33 – – 34 – 7-8. SCHEMA TIC DIA GRAM – SUB SECTION – • Semiconductor Location 7-9. PRINTED WIRING BO ARD – SUB SECTION – • See page 16 for Cir cuit Boards Location.
HCD-SD1 – 35 – – 36 – 7-10. SCHEMA TIC DIA GRAM – P ANEL SECTION – (Page 30) (Page 30).
HCD-SD1 – 37 – – 38 – 7-11. PRINTED WIRING BOARD – P ANEL SECTION – • See page 16 for Cir cuit Boards Location. (Page 32) (Page 32) E AEP, UK D601 C-3 D602 C-3 D603 C-4 D604 C-5 D605 B-7 D606 B-7 IC601 B-5 IC602 B-2 Q601 C-3 • Semiconductor Location Ref.
HCD-SD1 7-12. SCHEMA TIC DIA GRAM – AMP SECTION – – 39 – – 40 – (Page 47, 48) (Page 43) (Page 28).
HCD-SD1 – 41 – – 42 – 7-13. PRINTED WIRING BO ARD – AMP SECTION – • See page 16 for Cir cuit Boards Location. • Semiconductor Location (Page 31) (Page 45) (Page 50) Ref.
HCD-SD1 7-14. SCHEMA TIC DIA GRAM – CONNECTOR SECTION – – 43 – – 44 – (Page 30) (Page 29) (Page 40) (Page 33).
HCD-SD1 – 45 – – 46 – 7-15. PRINTED WIRING BO ARD – CONNECT OR SECTION – • See page 16 f or Cir cuit Boards Location. • Semiconductor Location 11 (11) CN291 S291 (LOAD OUT) 1 2 3 4 5 M.
HCD-SD1 7-16. SCHEMA TIC DIA GRAM – REG SECTION – – 47 – – 48 – (Page 40) (Page 29) (Page 29) (Page 33).
HCD-SD1 – 49 – – 50 – 7-17. PRINTED WIRING BO ARD – REG SECTION – • See page 16 f or Cir cuit Boards Location. • Semiconductor Location (Page 34) NOT REPLACEABLE: BUILT IN TRANSFORMER .
HCD-SD1 7-18. IC BLOCK DIA GRAMS • BD section IC101 CXA1782BQ – 51 – – 52 – 36 PHD2 PHD1 PHD 33 LD 32 RF M 31 RF O 30 RF I 29 CP 28 CB 27 CC1 26 CC2 25 FOK 24 SENS 23 C.
– 53 – – MAIN Section – IC104 PCM1710U-R IC351 LB1641 IC791 P82B715TD .118 1 2 3 4 5 6 7 8 9 10 11 12 13 14 27 26 25 24 23 22 21 20 19 18 17 16 15 28 INPUT INTERFACE DIGITAL FILTER NOISE SHAPE.
– 54 – 7-19. IC PIN FUNCTIONS • IC701 System Control ( µ PD780018A YGF-015-3BA) (MAIN Boar d) 1 BD POWER O CD power control pin, “H”:CD PO WER ON 2 P ANEL SW I Front cover open/c lose switch, “H”:Open glass door , “L”:Close glass door 3 to 7 – I Not used 8 A C.
– 55 – 61 LO AD IN O T ray loading motor control signal, “L”:Loading 62 LO AD OUT O T ray loading motor control signal, “L”:When OPEN 63 BD.
– 56 – SECTION 8 EXPLODED VIEWS 8-1. FRONT P ANEL SECTION NOTE: • Items marked “*” are not stocked since the y are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded vie ws ar e not supplied.
– 57 – 8-2. CHASSIS SECTION Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 61 A-4419-065-A SUB-TRANS BOARD, COMPLETE * 62 1-671-614-11 CONNECTOR BOARD 63 X-4950-994-1 .
– 58 – 8-3. MECHANISM DECK SECTION (CDM13B-5BD19) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 211 4-944-012-01 T ABLE, DISC 212 A-4604-752-A HOLDER (MG) ASSY * 213 4-917-583-21 BRACKET , YOKE 214 X-4941-462-1 CHASSIS (MD) ASSY 215 4-933-134-01 SCREW (+PTPWH M2.
– 59 – 8-4. BASE UNIT SECTION (B U-5BD19) The components identif ied by mark ! or dotted line with mark ! are critical for safety . Replace only with part number specified .
– 60 – • SEMICONDUCTORS In each case, u: µ , for example: uA...: µ A..., uP A...: µ P A..., uPB...: µ PB..., uPC...: µ PC..., uPD...: µ PD.
– 61 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD CHEMI-CON < CONNECTOR > CNU101 1-770-014-11 CONNECTOR, FFC/FPC 16P CNU102 1-770-013-11 CONNECTOR, FFC/FPC .
– 62 – CONNECT OR Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < RESISTOR > R505 1-216-097-91 RES,CHIP 100K 5% 1/10W R506 1-216-085-00 MET AL CHIP 33K 5% 1/10W R551 1-216-049-91 RES,CHIP 1K 5% 1/10W R552 1-216-097-91 RES,CHIP 100K 5% 1/10W R553 1-247-887-00 CARBON 220K 5% 1/4W R554 1-216-065-91 RES,CHIP 4.
– 63 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN * A-4419-059-A MAIN BOARD, COMPLETE (AEP ,UK) ******************** * A-4419-070-A MAIN BOARD, COMPLETE (SP ,HK.
– 64 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN CN702 1-785-462-11 SOCKET , CONNECTOR (NON-ZIF)11P CN703 1-770-380-11 CONNECTOR, BOARD TO BOARD 8P CN704 1-770-380-11 CONNECTOR, BOARD TO BOARD 8P CN705 1-695-342-31 PIN, CONNECTOR (PC BOARD) 19P < DIODE > D351 8-719-921-40 DIODE MTZJ-4.
– 65 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark P ANEL MAIN R191 1-249-413-11 CARBON 470 5% 1/4W F R192 1-249-413-11 CARBON 470 5% 1/4W F R193 1-249-413-11 CARBON .
– 66 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark P ANEL P ANEL-SW C604 1-163-141-00 CERAMIC CHIP 0.001uF 5% 50V C605 1-162-290-31 CERAMIC 470PF 10% 50V C607 1-163-038-91 CERAMIC CHIP 0.1uF 25V C608 1-164-159-11 CERAMIC 0.
– 67 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark SUB-TRANS D945 8-719-986-04 DIODE HZS9A1L T A D946 8-719-986-04 DIODE HZS9A1L T A D952 8-719-986-26 DIODE HZS12A3L .
– 68 – Sony Corporation Home A&V Products Compan y 9-922-969-11 98L0953-1 Printed in Japan © 1998. 12 Published by Quality Assurance Dept. (Shibaura) HCD-SD1 The components identif ied by mark ! or dotted line with mark ! are critical for safety .
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