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1 Toshiba Personal Computer QOSMIO G20 Maintenance Manual TOSHIBA CORPORATION File Number 960-511 [CONFIDENTIAL ].
Copyright © 2005 by Toshiba Corporation. All rights reserved. Under the cop yright laws, this manual cannot be reproduced in any form without the prior written permissi on of Toshiba. No patent liability is assumed with respect to the use of the in formation contai ned herein.
Preface This maintenance manual describes how to pe rform hardware service maintenance for the Toshiba Personal Computer QOSMIO G20. NOTE: Each model of QOSMIO G20 has a diff erent configuration. For each model’s configuration, refer to the parts list dedicated to it.
The manual is divided into the following parts: Chapter 1 Hardware Overview describes the QOSMIO G20 system unit and each FRU. Chapter 2 Troubleshooting Procedures e xplains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.
Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronym s are enclosed in parentheses following their definition.
Table of Contents Chapter 1 Hardware Overview 1.1 Features ................................................................................................................... ... 1-1 1.2 System Block Diagram ...........................................
2.17 Bridge media Slot Troubleshooting ......................................................................... 2-67 2.18 PCI ExpressCard Slot Troubleshooting ................................................................... 2-68 Chapter 3 Tests and Diagnostics 3.
3.29 Wireless LAN Test Program (Askey-m ade) ............................................................ 3-78 3.30 LAN/Modem/Bluetooth/ IEEE1394 Test Program .................................................. 3-82 3.31 Sound Test program ............
4.27 PC card slot .............................................................................................................. 4-63 4.28 Bluetooth module ...............................................................................................
x [ C ONFID ENTIAL ] QOSMIO G 20 Maint enance Ma nual (9 60-511).
Chapter 1 Hardware Overview [CONFIDENTIAL ].
1 Hardware Overview 1-ii [CON FI DENTIAL ] QOSMIO G 20 Mainte nance Ma nual (960 -511).
Chapter 1 Contents 1.1 Features ................................................................................................................... ... 1-1 1.2 System Block Diagram ......................................................................
1-iv [C ONFI DENTIAL ] QOSMIO G 20 Maint enance Ma nual (960 -511) Figures Figure 1-1 Front of the computer and the system units configuration ............................ 1-4 Figure 1-2 System block diagram ...........................................
1 Hardware Overview 1.1 Features 1 Features 1.1 Features The QOSMIO G20 series are high performa nce all-in-one PCs running a Pentium -M processor. The features are listed below. ❑ Microprocessor Microprocessor that is used will be d ifferent of the m odel.
1.1 Features 1 Hardware Overview ❑ Display LCD Built-in 17.0-inch, WXGA+ (1,440 x 900 dots) amorphous silicon TFT color display. Interface To external monitor via - RGB connector - S-video OUT conne.
1 Hardware Overview 1.1 Features ❑ Remote controller A remote controller for easy operation from som e distance. ❑ USB FDD USB FDD supports 720KB and 1.
1.1 Features 1 Hardware Overview Figure 1-1 shows the front of the comput er and the system units configuration. Figure 1-1 Front of the computer an d the system units configuration 1-4 [CONFID ENTIAL.
1 Hardware Overview 1.2 System Block Diagram 1.2 System Block Diagram Figure 1-2 shows the system block diagram. Figure 1-2 System block diagram QOSMIO G 20 Mainte nance Ma nual (960 -511) [C ONFIDENT.
1.2 System Block Diagram 1 Hardware Overview The PC contains the following components. ❑ CPU Intel ® Mobile Pentium ® -M Pentium-M 1.60GHz (Processor Number ; 730) 1.73GHz (Processor Number ; 740) 1.86GHz (Processor Number ; 750) 2.00GHz (Processor Number ; 760) 2.
1 Hardware Overview 1.2 System Block Diagram ❑ Chipset This gate array has the following elements and functions. ¾ North Bridge (Intel 915PM <Express Chipset>) - Support Dothan Processor Syst.
1.2 System Block Diagram 1 Hardware Overview ❑ Super I/O (SMSC-made LPC47N217) Two serial ports (NS16C550 compatible) - One port is used as Debug port ❑ VGA controller nVIDIA NV43m - Built-in VRAM 64MB/128MB - PCI Express Interface - LCD Interface LVDS 2ch - Supports TV Encoder, S-Video ❑ Mini PCI Wireless LAN card 2.
1 Hardware Overview 1.2 System Block Diagram ❑ MODEM (Askey-made 1456VQL4 x 1) Supported by MDC. Uses secondary AC97 line. Data and FAX transmission is available. Supports ITU-TV.90. The transfer speed of data receiving is 56kbps, of data sending is 33.
1.3 2.5-inch Hard Disk Drive 1 Hardware Overview 1.3 2.5-inch Hard Disk Drive A compact, high-capacity Serial-ATA HDD with a height of 9.5mm . Contains a 2.5-inch magnetic disk and magnetic heads. Figure 1-3 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications.
1 Hardware Overview 1.3 2.5-inch Hard Disk Drive Table 1-2 2.5-inch HDD Specifications Specification Parameter FUJITSU G8BC0001R610 FUJITSU G8BC0001R610 Storage size (formatted) 60GB 80GB Speed (RPM) 5,400 Minimum 1.5 ms Average 12 ms (read) Positioning time Maximum 22 ms To/From Media 53.
1.4 Optical Drive 1 Hardware Overview 1.4 Optical Drive 1.4.1 DVD Super Multi Dri ve (supporting Double-Layer) The DVD Super Multi drive (supporting Doubl e Layer) accommodates 12 cm (4.72-inch) CD/DVD-ROM, CD-R/RW, DVD±R/±RW and DVD-RA M. It is a high-performance drive that reads DVD-ROM at maximum 8-speed a nd CD-ROM at maximum 24-speed.
1 Hardware Overview 1.4 Optical Drive Table 1-4 DVD Super Multi drive (Double-Layer) specifications Drive Specification Parameter MATSUSHITA-KOTOBUKI (G8CC0 002CZ10) Read(KB/s) DVD-ROM MAX 8X CAV CD-R.
1.5 Keyboard 1 Hardware Overview 1.5 Keyboard A keyboard which consists of 85(US)/86(UK) keys is mounted on the system unit. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-7 is a view of the keyboard.
1 Hardware Overview 1.6 TFT Color Display 1.6 TFT Color Display The TFT color display is 17.1 inch and consis ts of LCD module and FL inverter board. 1.6.1 LCD Module The LCD module used for the TFT color display us es a backlight as the light source and can display a maximum of 320,000 colors with 1,440 x 900 resolution.
1.6 TFT Color Display 1 Hardware Overview 1.6.2 FL Inverter Board The FL inverter board supplies a high freque ncy current to illuminate the LCD module FL.
1 Hardware Overview 1.7 Power Supply 1.7 Power Supply The power supply supplies 28 different voltages to the system board. The power supply microcontroller has the following functions. 1. Judges if the DC power supply (AC adap ter) is connected to the computer.
1.7 Power Supply 1 Hardware Overview Table 1-7 Power suppl y output rating (1/2) Power supply （ Yes/No ） Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No Battery Object PPV 1.308 - 0.748 No No No CPU PTV 1.05 No No No CPU, MCH, ICH6-M PGV 1.
1 Hardware Overview 1.7 Power Supply Table 1-11 Power suppl y output rating (2/2) Power supply （ Yes/No ） Name Voltage [V] Power OFF (Suspend mode) Power OFF (Boot mode) No Battery Object MCV 5 Yes Yes No PSC R3V 2.
1.8 Batteries 1 Hardware Overview 1.8 Batteries The PC has the following two batteries. ❑ Main battery ❑ Real time clock (RTC) battery Table 1-12 lists the specifica tions for these two batteries. Table 1-8 Battery specifications Battery Name Battery Element Output Voltage Capacity G71C0004H510 Main battery G71C0004H610 Lithium ion 10.
1 Hardware Overview 1.8 Batteries 1.8.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The power supply microprocessor controls power supply and dete cts a full charge when the AC adaptor and battery are connected to the computer.
1.8 Batteries 1 Hardware Overview 1.8.3 RTC Battery The RTC battery provides the power supply to maintain the date, time, and other system information in memory. Table 1-15 lists the Time required for charges of RTC battery and data preservation time.
1 Hardware Overview 1.9 AC Adapter 1.9 AC Adapter The AC adapter is used to charge the battery. Table 1-16 lists the AC adapter specifications. Table 1-12 AC adapter specifications Parameter Specification G71C0002R610 Power 120W (Peak 150W) Input voltage AC 100 to 240V Input frequency 50Hz/60Hz Input voltage 1.
1.9 AC Adapter 1 Hardware Overview 1-24 [CONFIDENT IAL] QOSMIO G20 Mai ntenance Manual ( 960-511).
Chapter 2 Troubleshooting Procedures [CONFIDENTIAL ].
2 2-ii [C ONFIDENTIAL ] QOSMIO G 20 Mainte nance Ma nual (960- 511).
Chapter 2 Contents 2.1 Troubleshooting ......................................................................................................... 2-1 2.2 Troubleshooting Flowchart ........................................................................
2.9 Display Troubleshooting .......................................................................................... 2-50 Procedure 1 External Monitor Check ....................................................... 2-50 Procedure 2 Diagnostic Test Program Execution Check .
2.18 PCI ExpressCard Slot Troubleshooting ................................................................... 2-68 Procedure 1 Gigabit Ether ExpressCard .................................................. 2-68 Procedure 2 USB2.0 5in1 ExpressCard ......
2-vi [CON FIDENTIA L] QOSMIO G 20 Maint enance Ma nual (9 60-511).
2 Troubleshooting Procedures 2.1 Troubleshooting 2 2.1 Troubleshooting Chapter 2 describes how to determine which Fi eld Replaceable Unit (FRU) in the computer is causing the computer to malfunction. (The “FRU ” m eans the replaceable unit in the field.
2.1 Troubleshooting 2 Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is descri bed in the figure as line. (2) Pin connection is describe d in the figure as arrow.
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart 2.2 Troubleshooting Flowchart Use the flowchart in Figure 2-1 as a guide fo r determining which troubleshooting procedures to execute. Before going through the flow chart steps, verify the following: Ask him or her to enter the passwor d if a password is registered.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) 2-4 [C ONFI DENTIAL ] QOSMIO G 20 Mainte nance Ma nual (960- 511).
2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart Figure 2-1 Troubleshooting flowchart (2/2) QOSMIO G 20 Maint enance Ma nual (960 -511) [ CONFIDENTIAL ] 2-5.
2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures If the diagnostics program cannot detect an e rror, the problem may be intermittent. The Test program should be executed several tim es to is olate the problem.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 2.3 Power Supply Troubleshooting The power supply controller cont rols many functions and compone nts. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights blue DC power is being supplie d from the AC adapter. Blinks orange Power supply malfunctio n *1 Doesn’t light Any condition other than those above.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 2 Error Code Check If the power supply microprocessor detects a ma lfunction, the DC IN icon blinks orange.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Check 1 Convert the DC IN icon blink pattern into the hexadecimal error code and com pare it to the tables below.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting 1st Battery Error code Meaning 20h Over voltage has been sensed. (Error co de 20h is not supported.) 21h Main battery charg e current is over 12.0A. 22h Main battery discharg e current is over 0.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures A-C3V output Error code Meaning 60h A-C3V voltage is over 3.96V when the computer is powered on/off. 61h A-C3V voltage is 2.81V or less when the comp uter is powered on. 62h A-C3V voltage is 2.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting E3V output Error code Meaning A0h E3V voltage is over 3.96V when the computer is powered on/off. A1h E3V voltage is 2.81V or less when the computer is powered o n. A2h E3V voltage is 2.
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures 1R9-B1V output Error code Meaning E0h 1R9-B1V voltage is over 2.40V when the computer is powered on/off. E1h 1R9-B1V voltage is 1.53V or less when the computer is po wered on. E2h 1R9-B1V voltage is 1.
2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting Procedure 3 Connection Check The wiring diagram related to th e power supply is shown below: A C adapter Batter y pack Power co de 10-pin .
2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures Procedure 5 Replacement Check The power is supplied to the system board by the AC adapter. If either the AC adapter or the system board was damaged, perform the following Checks. To disassemble the computer, follow the steps described in Chapter 4, Replacement Procedures .
2 Troubleshooting Procedures 2.4 System Board Troubleshooting 2.4 System Board Troubleshooting This section describes how to determine if th e system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 1 Message Check When the power is turned on, the system perfor ms the Initial Reliability T est (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Check 3 The IRT checks the system board. When the IRT detects an erro r, the system stops or an error message appears. If one of the following error messages (1) th rough (17), (23) or (24) is displayed, go to Procedure 4.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Procedure 2 Debugging Port Check Check the D port status by a debug port test. Th e tool for debug port test is shown below. Figure 2-2 A set of to ol for debug port test The test procedures are follows: 1.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (1/8) D port status Inspection items Details Permission of A20 and Cl ear of software reset .
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (2/8) D port status Inspection items Details Saving key scan code Setting TASK_1ms_TSC Controlling fan Enabling system spea ker Releasing mute Initializing sound items (for BEEP) Making the volume max.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (3/8) D port status Inspection items Details Checking DRAM type and size (at cold boot) When unsupported memo ry connected, beeps and halts. (When DRAM size = o, it halts.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (4/8) D port status Inspection items Details Forwards the area of C0000h to EFFFFh to PCI (prohibition of DRAM) Sets resume error request Copying ROM/RAM of system BIOS (When error occurred, it halts.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (5/8) D port status Inspection items Details Saving memory configuration to buffer Reading o.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (6/8) D port status Inspection items Details (F109h) Configuration Saving of VGA configurati.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-4 Debug port (Boot mode) error status (7/8) D port status Inspection items Details F117h CHK_DMA_PAGE Check of DMA Page Register (.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-4 Debug port (Boot mode) error status (8/8) D port status Inspection items Details Clearance of the IRT flag of Runtime side Updat.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (1/3) D port status Inspection items Details Suspend mode When powering-off request from OS is required, waiting for the completion of div iding process because waiting in SUSPEND of Runtime returns the process to OS.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-5 Debug port (Suspend mode) error status (2/3) LED Status Test item Contents (F133h) Storing of PIT Starts sequence for storing display system.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-5 Debug port (Suspend mode) error status (3/3) LED Status Test item Contents F13Ch Measure for U SB over current Calculation of ch.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status (1/4) LED Status Test item Contents Resume F100h Refer to IRT F101h Refer to IRT F102h Refer to IRT Refer to IRT Clears flag for SMI control.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (2/4) LED Status Test item Contents (F122h) Start recovery of VGA Initializing of sound Ac.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures Table 2-6 Debug port (Resume mode) error status s (3/4) LED status Test item Contents F12Ah W aiting for completion of KBC initializing (n.
2 Troubleshooting Procedures 2.4 System Board Troubleshooting Table 2-6 Debug port (Resume mode) error status (4/4) LED status Test item Contents Checks if the power-off switch is pressed or not durin.
2.4 System Board Troubleshooting 2 Troubleshooting Procedures 2-36 [C ONFI DENTIAL ] QOSMIO G 20 Maint enance Ma nual (960 -511) Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board.
2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting 2 2.5 USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubl eshooting procedures below as instructed.
2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, tu rn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more inform ation about th e diagnostics test procedures.
2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting Procedure 3 Connector Check and Replacement Check USB FDD is connected to USB port on system board and US board. US board is also connected to system board by cable. The connect ion of cable and board may be defective.
2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures Check 2 USB FDD m ay be fau lty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 Connect USB FDD to each port embedded on system board and on SJ board. Then, check if it works prope rly.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting 2.6 2.5” HDD Troubleshooting To check if 2.5” HDD is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 2 Message Check When the power is turned on, the system perfor ms the Initial Reliability T est (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 3 Format Check The computer’s HDD is formatted using the MS-DOS FORMAT program or the physical format program of the test program. To fo rmat the HDD, start with Check 1 below and perform the other steps as required.
2.6 2.5” HDD Troubleshooting 2 Troubleshooting Procedures Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnosti cs Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
2 Troubleshooting Procedures 2.6 2.5” HDD Troubleshooting Procedure 5 Connector Check and Replacement Check HDD(s) is/are connected to the connector(s) on the system board. Th e connection of HDD(s) and board may be defective. Otherwise, they may be faulty.
2.7 Keyboard Troubleshooting 2 Troubleshooting Procedures 2.7 Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.7 Keyboard Troubleshooting Procedure 2 Connector and Replacement Check The connection of cable and board may be de fective.
2.8 Touch pad Troubleshooting 2 Troubleshooting Procedures 2.8 Touch pad Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.8 Touch pad Troubleshooting Procedure 2 Connector and Replacement Check The connection of cable and board may be de fective.
2.9 Display Troubleshooting 2 Troubleshooting Procedures 2.9 Display Troubleshooting To check if the computer’s display is ma lfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.9 Display Troubleshooting Procedure 3 Connector and Cable Check LCD Module is connected to system board by an LCD/FL cable. FL inverter board is also connected to system board by an LCD/FL cable. In addition, fluorescent lamp is connected to FL inverter board by HV cable.
2.9 Display Troubleshooting 2 Troubleshooting Procedures Procedure 4 Replacement Check Fluorescent lamp, FL inverter, LCD module, HV cable and LCD/FL cable are connected to display circuits.
2 Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioni ng or not, follow the troubleshooting procedures below as instructed.
2.10 Optical Disk Drive Troubleshooting 2 Troubleshooting Procedures Check 4 ODD flexible cable may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occu rs, perform Check 5. Check 5 System board may be faulty.
2 Troubleshooting Procedures 2.11 Modem Troubleshooting 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, fo llow the troubleshooting procedures below as instructed.
2.11 Modem Troubleshooting 2 Troubleshooting Procedures Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4. If the problem still occur s, perform Check 4.
2 Troubleshooting Procedures 2.12 LAN Troubleshooting 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunc tioning or not, follow the troubleshooting procedures below as instructed.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer's W ireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting Procedure 2 Antennas' Connection Check The wireless LAN function-wiri ng diagram is shown below: Wireless L AN antenna ( black ) Wir.
2.13 Wireless LAN Troubleshooting 2 Troubleshooting Procedures Procedure 3 Replacement Check Wireless LAN card, wireless LAN antenna or syst em board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 W ireless LAN antenna may be faulty.
2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting 2.14 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubl eshooting procedures below as instructed.
2.14 Bluetooth Troubleshooting 2 Troubleshooting Procedures Procedure 2 Antennas' Connection Check The Bluetooth function-wiring diagram is shown below: Bluetooth antenna <bluetooth module> <Sy stem board> CN4400 bluetooth antenna cable Bluetooth f lex ible cabl e Any of the connections may be defective.
2 Troubleshooting Procedures 2.14 Bluetooth Troubleshooting Procedure 3 Replacement Check Bluetooth module, Bluetooth antenna or system board m ay be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disa ssemble the computer and then perform the following checks: Check 1 Bluetooth antenna m ay be fault y.
2.15 Sound Troubleshooting 2 Troubleshooting Procedures 2.15 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.15 Sound Troubleshooting Procedure 3 Replacement Check If external microphone does not wo rk properly, perform check 1. If headphone does not work properly, perform check 2. If internal microphone does not work properly, perform check 3.
2.16 TV tuner Troubleshooting 2 Troubleshooting Procedures 2.16 TV tuner Troubleshooting To check if TV tuner is malfunctioning or not, follow the troubleshooting procedures below as instructed.
2 Troubleshooting Procedures 2.17 Bridge media Slot Troubleshooting 2.17 Bridge media Slot Troubleshooting This section describes how to determine if the computer's Bridge m edia functions are functioning properly. Perform the steps below star ting with Procedure 1 and continuing with the other procedures as required.
2.18 PCI ExpressCard Slot Troublesh ooting 2 Troubleshooting Procedures 2-68 QOSMIO G20 Maintena nce Manual (960- 511) 2.18 PCI ExpressCard Slot Troubleshooting This section describes how to check PCI Expr essCard slot by inspecting a card with PCI Express interface and a card with USB 2.
Chapter 3 Tests and Diagnostics [CONFIDENTIAL].
3 Tests and Diagnostics 3 3-ii [CONFIDENTIAL ] QOSMIO G20 Maint enance Man ual (960- 511).
3 Tests and Diagnostics Chapter 3 Contents 3.1 The Diagnostic Test ................................................................................................... 3-1 3.1.1 Diagnostics menu .........................................................
3 Tests and Diagnostics 3.21 ONLY ONE TEST ................................................................................................... 3-48 3.21.1 Program Description .......................................................................... 3-48 3.
3 Tests and Diagnostics 3.32 SETUP ................................................................................................................... 3- 102 3.32.1 Function Description .................................................................
3 Tests and Diagnostics 3-vi [CONFIDENTIAL ] QOSMIO G20 Mai ntenance Man ual (960- 511) Tables Table 3-1 Subtest names .................................................................................................... 3-20 Table 3-2 Error codes and error status names .
3 Tests and Diagnostics 3.1 The Diagnostic Test 3 3.1 The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Program s are stored on some Diagnostic Disks.
3.1 The Diagnostic Test 3 Tests and Diagnostics The DIAGNOSTIC TEST MENU contains the following functional tests: SYSTEM TEST MEMORY TEST KEYBOARD TEST DISPLAY TEST FLOPPY DISK TES.
3 Tests and Diagnostics 3.1 The Diagnostic Test 3.1.2 H/W (Hardware) initial information setting tool The H/W initial inform ation setting tool consists of the following programs.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics 3.2 Executing the Diagnostic Test To start the DIAGNOSTIC PROGRAM, follow these steps: 1. Insert the Diagnostics disk in the floppy disk drive. 2. Release the lock of the power switch and turn on the computer with pressing the F12 .
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test NOTE : To exit the DIAGNOSTIC TEST MENU, press the Esc key. If a test program is in progress, press Ctrl + Break to exit the test program. If a test program is in progress, press Ctrl + C to stop the test program.
3.2 Executing the Diagnostic Test 3 Tests and Diagnostics Select the option you want to execute and press Enter . When you select 1- SYSTEM TEST , the following message will appear: SYSTEM TEST NAME XXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3 Tests and Diagnostics 3.2 Executing the Diagnostic Test Use the up and down arrow keys to move the cursor to “ ERROR STOP ”. Use the right and left arrow keys to move the cursor to the desired option and press Enter .
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3 Check of the RAID configuration Following screen is displayed for checking th e RAID configuration and specifying a failed drive. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION.
3 Tests and Diagnostics 3.3 Check of the RAID configuration Logical Drive Information: Displays logical drive number, RAID level, RAID status, contents and setting. Physical Drive Information: Displays port number, logical drive number belonged, status and disk inform ation.
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3.2 Check of the screen display Contents of the screen displayed are shown below. 3.3.2.1 RAID-1 When the “RAID-1” is displayed in the shown below, it is judged that the RAID is configured by two drives.
3 Tests and Diagnostics 3.3 Check of the RAID configuration < RAID: not OPTIMAL > The RAID is not configured by two drives in the following display, because there are two LDs (LD0 and LD1). TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION.
3.3 Check of the RAID configuration 3 Tests and Diagnostics 3.3.3 Specification of the failed HDD Check the RAID configuration condition from the shown below and specify a failed drive. TOSHIBA RAID / RAID Information Display Rev xx.xx.xxxx Copyright(c) 2005 TOSHIBA CORPORATION.
3 Tests and Diagnostics 3.3 Check of the RAID configuration 3.3.3.2 RAID : not OPTIMAL ABSENT or OFFLINE is displayed When the “ABSENT” or “OFFLINE” is displayed as shown below, the drive is removed by the RAID console and installed again. When the drive is unlocked, “ABSENT” is displayed.
3.3 Check of the RAID configuration 3 Tests and Diagnostics NO DRIVE for one drive is displayed When “NO DORIVE” is displayed and the HDD is connected to the port, follow the procedures below to check the HDD failure. (1) Install a new HDD. When “NO DORIVE” is still displayed, It is judged that the MB or cable fails.
3 Tests and Diagnostics 3.3 Check of the RAID configuration FAIL for one drive is displayed One drive in the “RAID-1”is failed and degraded. This may look like failure by wrong operation. Specify the reason by using Independent Utility. TOSHIBA RAID / RAID Information Display Rev xx.
3.4 Setting of the hardware configuration 3 Tests and Diagnostics 3.4 Setting of the hardware configuration To execute this program, select 2-Repair initial config test in the startup menu, press Enter and follow the directions on the screen. The H/W initial information setting tool consists of four subtests.
3 Tests and Diagnostics 3.4 Setting of the hardware configuration Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) Setting of DVD region code (Yes/No) After completion of the above settings, H/W configuration & DMI information are appeared in order.
3.4 Setting of the hardware configuration 3 Tests and Diagnostics Subtest 08 System configuration display This subtest displays the information of the system configuration. Confirm the contents and press Enter . For more details on the system configuration inform ation, refer to 3.
3 Tests and Diagnostics 3.5 Heatrun Test 3.5 Heatrun Test To execute this program, select 3-Repair heatrun in the startup menu, press Enter . After selecting this test, the same subtests as 3.23 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST.
3.6 Subtest Names 3 Tests and Diagnostics 3.6 Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) No.
3 Tests and Diagnostics 3.6 Subtest Names Table 3-1 Subtest names (2/2) No. Test Name Subtest No. Subtest Name 6 PRINTER [Not supported] 01 02 03 Ripple pattern Function Wrap around 7 ASYNC [Not suppo.
3.7 System Test 3 Tests and Diagnostics 3.7 System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.7 System Test This subtest checks the status for the quick charge. Subtest 05 DMI read This subtest displays the information in the Flash-ROM in the following format.
3.8 Memory Test 3 Tests and Diagnostics 3.8 Memory Test To execute the Memory Test, select 2 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.9 Keyboard Test 3.9 Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.10 Display Test 3 Tests and Diagnostics 3.10 Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3 Tests and Diagnostics 3.10 Display Test Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter .
3.10 Display Test 3 Tests and Diagnostics Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns. HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHH.
3 Tests and Diagnostics 3.11 Floppy Disk Test 3.11 Floppy Disk Test CAUTION : Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased.
3.11 Floppy Disk Test 3 Tests and Diagnostics Select the number of the subtest you want to execute and press Enter . The following message will appear during the floppy disk test.
3 Tests and Diagnostics 3.12 Printer Test 3.12 Printer Test CAUTION : Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. The following messages will appear af ter selecting the Printer Test from the DIAGNOSTIC TEST MENU.
3.12 Printer Test 3 Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following f unctions: Normal print Double-width print Compressed print Emphasiz.
3 Tests and Diagnostics 3.13 Async Test 3.13 Async Test CAUTION : Async Test is not supported for this model. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.14 Hard Disk Test 3 Tests and Diagnostics 3.14 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter , and follow the directions on the screen. CAUTION : The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08,or 09 is executed.
3 Tests and Diagnostics 3.14 Hard Disk Test 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest.
3.14 Hard Disk Test 3 Tests and Diagnostics 3-36 [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511) Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder.
3 Tests and Diagnostics 3.15 Real Timer Test 3 3.15 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter .
3.15 Real Timer Test 3 Tests and Diagnostics Subtest 03 Real time carry CAUTION : When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increment.
3 Tests and Diagnostics 3.16 NDP Test 3.16 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen.
3.17 Expansion Test 3 Tests and Diagnostics 3.17 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound CAUTION : PCMCIA wraparound test is not supported for this model.
3 Tests and Diagnostics 3.17 Expansion Test Subtest 02 RGB monitor ID NOTE: To execute this subtest, RGB monitor ID wraparound connector is required. The wiring diagram of the connector is described in Appendix F. Connect a wraparound connector to CRT monitor for the test of ID acquisition.
3.18 CD-ROM/DVD-ROM Test 3 Tests and Diagnostics 3.18 CD-ROM/DVD-ROM Test To execute the CD-ROM/DVD-ROM test, select 13 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE : For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1.
3 Tests and Diagnostics 3.19 Error Code and Error Status Names 3.19 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test.
3.19 Error Code and Error Status Names 3 Tests and Diagnostics Table 3-2 Error codes and error status names (2/3) Device name Error code Error status name FDD 01 02 03 04 08 09 10 20 40 80 60 06 EE FD.
3 Tests and Diagnostics 3.19 Error Code and Error Status Names Table 3-2 Error codes and error status names (3/3) Device name Error code Error status name (HDD) CC E0 0A EE DA 12 HDD - WRITE FAULT HDD.
3.20 Hard Disk Test Detail Status 3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight- digit number.
3 Tests and Diagnostics 3.20 Hard Disk Test Detail Status Tables 3-4 Error register contents Bit Name Description 7 BBK (Bad block mark) “0” … Not used “1” … A bad block mark is detected. 6 UNC (Uncorrectable) “0” … There is no uncorrectable data error.
3.21 ONLY ONE TEST 3 Tests and Diagnostics 3.21 ONLY ONE TEST 3.21.1 Program Description This program tests the unique functions of this model. 3.21.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter . The following menu appears in the display.
3 Tests and Diagnostics 3.21 ONLY ONE TEST Subtest 01 Pressed key display When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed.
3.21 ONLY ONE TEST 3 Tests and Diagnostics Subtest 02 Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch.
3 Tests and Diagnostics 3.21 ONLY ONE TEST Subtest 03 Touch sensor button This subtest checks if the touch sensor buttons (11 buttons) work properly. The following message appears in the display. 0 1 2 3 4 5 6 7 8 9 10 * * * * * * * * * * * Press button [0] Touch the first touch sensor button from the left.
3.21 ONLY ONE TEST 3 Tests and Diagnostics Subtest 04 Kill Switch This subtest checks if the Wireless comm unication switch works properly. If the test is started with the switch ON, following message appears in the display. Kill switch is set to a start position (OFF) Slide the switch to OFF position.
3 Tests and Diagnostics 3.21 ONLY ONE TEST OK message appears in the display if the test ends without a defective. NG message appears in the display if a defective is found during the test. Confirm the connection of cable, then execute the test again.
3.21 ONLY ONE TEST 3 Tests and Diagnostics Confirm each LED lights properly. (1) Press [Caps Lock ] key ! ...Caps (on/off) (2) Press [Fn + F10 ] key ! ...Arrow (on/off) (3) Press [Fn + F11 ] key ! ...Num (on/off) (4) Slide [BT/W-LAN switch L&R]! (on/off) Press Enter and following message appears in the display.
3 Tests and Diagnostics 3.21 ONLY ONE TEST Subtest 09 Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine.
3.21 ONLY ONE TEST 3 Tests and Diagnostics When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE : Be sure to execute the test with the display panel opened.
3 Tests and Diagnostics 3.21 ONLY ONE TEST When a defective is found during the each check above, the following message appears in the display. The test is halted at the point when the defective is found. ** Setting ERROR! ** Press [Enter] key Press Enter and return to the Only One Test menu.
3.22 Head Cleaning 3 Tests and Diagnostics 3.22 Head Cleaning 3.22.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.22.
3 Tests and Diagnostics 3.23 Log Utilities 3.23 Log Utilities 3.23.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer.
3.23 Log Utilities 3 Tests and Diagnostics 3.23.2 Operations 1. Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk.
3 Tests and Diagnostics 3.24 Running Test 3.24 Running Test 3.24.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02, 06) 3. Display test (subtest 01) 4.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.1 Function Description This function formats the FDD, copies the floppy disk and displays the dump list for both the FDD and HDD. 1. FORMAT NOTE : This program is only for testing a floppy disk drive.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 3.25.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 – HDD-ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a m essage similar to the one below: Insert source disk into drive A: Press any key when ready.
3 Tests and Diagnostics 3.25 Floppy Disk Drive Utilities 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If 2:HDD is selected, the display will go to step (h).
3.25 Floppy Disk Drive Utilities 3 Tests and Diagnostics 3-66 [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511) (k) The following message will appear. To finish the dum p, select 3 . Press number key (1:up,2:down,3:end) ? (l) The following message will appear.
3 Tests and Diagnostics 3.26 System Configuration 3 3.26 System Configuration 3.26.1 Function Description The System Configuration program contains th e following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3.
3.26 System Configuration 3 Tests and Diagnostics 3.26.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) 3.27 Wireless LAN Test Program (Intel-made b/g) This section describes how to perform the wireless LAN transm itting-receiving test (Intel- made Calexico 802.11b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
3.27 Wireless LAN Test Program (Intel -made b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered. Connection of wireless LAN card • • • • • • Using a wrong wireless LAN card (Using unspecified card) Defective wireless LAN card Checking the connection, execute the subtest again.
3 Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made b/g) Subtest03 Antenna check & communication test of 11b mode Caution: To execute subtest 03-05, use another computer (with Calexico wireless LAN card) that can communicate by the wireless LAN as a responder machine to perform those tests.
3.27 Wireless LAN Test Program (Intel -made b/g) 3 Tests and Diagnostics Subtest04 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. After finishing the test, OK message will appear in the display.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) 3.28 Wireless LAN Test Program (Intel-made a/b/g) This section describes how to perform the wireless LAN transm itting-receiving test (Intel- made Calexico 802.11a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
3.28 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics If a defective is found during the test, NG message will appear in the display.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) When a defective is detected in the test, following typical cause is considered. Connection of wireless LAN card • • • Defective wireless LAN card Disappearance of MAC address data Checking the connection, execute the subtest again.
3.28 Wireless LAN Test Program (Intel-made a/b/g) 3 Tests and Diagnostics When a defective is detected in the test, following typical cause is considered.
3 Tests and Diagnostics 3.28 Wireless LAN Test Program (Intel-made a/b/g) Subtest05 Communication test of 11g mode This subtest checks the communication of wireless LAN antenna of Calexico 802.11g mode. For more details on procedure and contens of this subtest, refer to Subtest04 Communication test of 11a m ode.
3.29 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics 3.29 Wireless LAN Test Program (Askey-made) This section describes how to perform the wireless LAN transm itting-receiving test (Askey- made Atheros b/g, a/b/g).
3 Tests and Diagnostics 3.29 Wireless LAN Test Program (Askey-made) *********************************************************** * Atheros MB4x(MB44ag/43g) Maintenance T&D Menu * * * * 1 : SKU chec.
3.29 Wireless LAN Test Program (Askey-made) 3 Tests and Diagnostics Subtest02 MAC Address Check This subtest displays the MAC address. Selecting this subtest, following message will appear in the display.
3 Tests and Diagnostics 3.29 Wireless LAN Test Program (Askey-made) When a defective is detected in the test, following typical cause is considered. Connection of wireless LAN card • • • • Con.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Mode m/Bluetooth/IEEE1394 test in FDD and turn on the power.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Subtest02 (GbE) CAUTION : Gigabit Ethernet test is not supported for this model. This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter .
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3.30.2 Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics 3.30.3 Bluetooth test CAUTION : Bluetooth test is not supported for this model. To execute this test, input 3 and press Enter . Note : Use another computer that can comm unicate by the Bluetooth as a reference machine to perform this test.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program Subtest01 BD_ADDR check This subtest checks the BD_ADDR functions. When the Bluetooth test menu is displayed, press 1 to select the test and press Enter .
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, it displays Error CODE. The following message is displayed. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(BD_ADDR) VerX.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-6 Error code for Bluetooth test (BD_ADDR) (1/2) Error code Meaning 0x01 Unknown HCI Command.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-6 Error code for Bluetooth test (BD_ADDR) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout. 0x23 LMP Error Transaction Collision.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program When the Bluetooth test menu is displayed, press T to select the test and press Enter in the test machine. The following m essage will appear: ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics If the target machine has any problem, the following m essage “ INCOMPLETE ” is displayed with the Error Code. ----------------------------------------------------------------------------- Bluetooth Subsystem T&D for PCSE(CS-Air) VerX.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program If the machine detects a malfunction, it indicates the error code as shown below. The error code begins with the least significant digit. Error code Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (1/2) Error code Meaning 0x01 Unknown HCI Command.
3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program 3 Tests and Diagnostics Table 3-7 Error code for Bluetooth test (BD_ADDR of the DUT) (2/2) Error code Meaning 0x20 Unsupported LMP Parameter Value. 0x21 Role Change Not Allowed. 0x22 LMP Response Timeout.
3 Tests and Diagnostics 3.30 LAN/Modem/Bluetooth/IEEE1394 Test Program QOSMIO G20 Maintenance Manual ( 960-511) [CONFIDENTIAL] 3-95 3.30.4 IEEE1394 test To execute this test, input 4 and press Enter . NOTE: Use another computer that can communicate by IEEE1394 (i.
3.31 Sound Test program 3 Tests and Diagnostics 3 Tests and Dia tics 3.31 Sound Test program gnos This section describes how to perform the Sound test. To execute the sound test, refer to the following description. Insert the test program disk for Sound test in the floppy disk drive and turn on the power.
3 Tests and Diagnostics 3.31 Sound Test program To return to the Sound test menu, Press 9 and Enter . Then following message will appear in the display.
3.31 Sound Test program 3 Tests and Diagnostics Subtest02 Sine Wave This subtest is executed by loading the COM file (ADSIN.COM). The program expands sine wave data table from 16KB to 64KB, and creates the play data. Then it transfers the data between the DMA and the CODEC to play the sine wave.
3 Tests and Diagnostics 3.31 Sound Test program 3.31.3 CD Sound (Standard) test To execute the CD Sound (Standard) test, press 3 and Enter . Insert the test media (TOSHIBA TEST CD-ROM or ABEX TEST CD-ROM) or music CD on the market (if the test media can not be prepared).
3.31 Sound Test program 3 Tests and Diagnostics Subtest02 English Narration Selected this subtest, narration in English starts. For more details on the procedure, refer to the subtest01. Subtest03 Test Tone A Caution: Before starting subtest03, be sure to set the sound at proper volume.
3 Tests and Diagnostics 3.31 Sound Test program (2) Audio CD Insert an audio CD and the following menu appears in the display. CD/DVD TEST IN PROGRESS XXXXXXXX xxxxxxx DIAGNOSTIC TEST VX.
3.32 SETUP 3 Tests and Diagnostics 3.32 SETUP 3.32.1 Function Description This program displays the current system setup inform ation as listed below: 1. Memory 2. System Date/Time 3. Battery (a) Battery Save Mode (b) PCI Express Link ASPM 4. Password 5.
3 Tests and Diagnostics 3.32 SETUP 10. Display (a) Power On Display (b) LCD Display Stretch (c) TV Type 11. Peripheral (a) Internal Pointing Device 12.
3.32 SETUP 3 Tests and Diagnostics 3.32.2 Accessing the SETUP Program Selecting 0 from the DIAGNOSTICS MENU and pressing Enter displays the followings: 3-104 [CONFIDENTIAL] QOSMIO G20 Maintenance Manu.
3 Tests and Diagnostics 3.32 SETUP QOSMIO G20 Maintenance Manual (960-511) [CONFIDEN TIAL] 3-105.
3.32 SETUP 3 Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press Å and Æ to move between the two columns. Press ↑ and ↓ to m ove between items in a column. Press Fn + ↑ ( PgUp) and Fn + ↓ ( PgDn) to move between the two pages.
3 Tests and Diagnostics 3.32 SETUP SETUP Options The SETUP screen is divided into 14 functionally related groups. This section describes each group and its options. 1. Memory This group of options displays the computer’s mem ory. This field displays the total amount of mem ory installed and is automatically calculated by the computer.
3.32 SETUP 3 Tests and Diagnostics NOTE: Display of the LCD Brightness will be changed in the condition below: (*1) Operating the battery (*2) Using the AC adapter User Setting Use this option to set the battery save parameters on the sub-window, BATTERY SAVE OPTIONS .
3 Tests and Diagnostics 3.32 SETUP Battery optimized If the CPU becomes too hot, the processing speed is lowered. If the temperature is still too high, the fan turns on. When the CPU temperature falls to a normal range, the fan is turned off and the processing speed is increased.
3.32 SETUP 3 Tests and Diagnostics 5. Boot Priority (a) Boot Priority Use this option to set the priority for booting of the computer and the priority for the HDD for booting.
3 Tests and Diagnostics 3.32 SETUP 6. Others Whether or not you need to configure the computer with these options depends primarily on the kind of software or peripherals you use. (a) CPU Cache Use this option to enable or disable the CPU cache. Enabled Enables the CPU cache.
3.32 SETUP 3 Tests and Diagnostics (e) Auto Power On This option displays setting for Auto Power On. Disabled Indicates auto power on is not set. Enabled Indicates auto power on is set. When “Enabled” is selected, the following sub-window appears.
3 Tests and Diagnostics 3.32 SETUP (g) Sound Logo This option enables or disables sound logo function. Enabled Enables the sound logo function. (Default) Disabled Disables the sound logo function (h) Front Operation Panel This option enables or disables front operation panel.
3.32 SETUP 3 Tests and Diagnostics 7. Configuration This option lets you set the device configuration. All Devices BIOS sets all devices. Setup by OS Initializes devices, which is needed to load an operating system. Operating system initializes other devices.
3 Tests and Diagnostics 3.32 SETUP NOTE : When starting the computer in Standby or Hibernation, the last configuration is remembered. If data does not appear on the display you are using after starting in Standby or Hibernation, pressing Fn+F5 .
3.32 SETUP 3 Tests and Diagnostics 12. LEGACY EMULATION (a) USB KB/Mouse Legacy Emulation This option sets the Legacy support condition of the USB keyboard and the USB mouse. Enabled Enables LEGACY support. (Default) USB keyboard/USB mouse are available without the driver.
3 Tests and Diagnostics 3.32 SETUP (b) Create State This option sets the RAID configuration level. NOTE: Be careful that all data of the hard disk is deleted when setting of the RAID configuration is changed in the BIOS setup.
3.32 SETUP 3 Tests and Diagnostics 3-118 [CONFIDENTIAL] QOSMIO G20 Maintenance Manual (960-511).
Chapter 4 Replacement Procedures [CONFIDENTIAL ].
4 Replacement Procedures 4 4-ii [ CON FID ENTIAL ] QOSMIO G20 Maint enance Manual (960-511).
4 Replacement Procedures Chapter 4 Contents 4.1 Overview ................................................................................................................... .4 - 1 Safety Precautions ....................................................
4 Replacement Procedures 4.17 Battery board / RTC battery ..................................................................................... 4-46 4.17.1 Battery board .................................................................................
4 Replacement Procedures Figures Figure 4-1 Removing the battery pack................................................................................. 4-8 Figure 4-2 Removing an E xpressCard or PC card .................................................
4 Replacement Procedures 4-vi [ CON FID ENTIAL ] QOSMIO G2 0 Maintenance Ma nual (960- 511) Figure 4-30 Removing the TV tuner module ....................................................................... 4-50 Figure 4-31 Removing the CPU fan ........
4 Replacement Procedures 4.1 Overview 4 4.1 Overview This chapter describes the procedure for rem oving and replacing the fi eld replaceable units (FRUs) in the PC. It may not be necessary to remove all the F RUs in order to replace one. The chart below provides a guide as to whic h other FRUs must be removed before a particular FRU can be removed.
4.1 Overview 4 Replacement Procedures Safety Precautions Please read the following safety instructions before disassembling the computer and always follow the instructions w hile working on the computer. DANGER: 1. In the case of the battery, always use authentic parts or equivalent parts approved by Toshiba.
4 Replacement Procedures 4.1 Overview Before You Begin Take note of the following points before star ting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.
4.1 Overview 4 Replacement Procedures Disassembly Procedure Three main types of cable connector are used. Pressure plate connector • • • Spring connector Normal pin connector When disconnecting a pressure plate connector, lift up the tag on one side of the plastic pressure plate on the connector and pull the cab le out from the connect or.
4 Replacement Procedures 4.1 Overview Assembly Procedure After the computer has been disassembled and th e part that caused the fault has been repaired or replaced, the computer must be reassem bled. Take note of the following general points when assembling the computer.
4.1 Overview 4 Replacement Procedures Screw Tightening Torque Use the following torque when tightening screws. CAUTION : Overtightening may damage screws or parts. Undertightening may allow screws to loosen (and possibly fall ou t) causing a short circuit or other damage.
4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the co mputer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body.
4.2 Battery pack 4 Replacement Procedures 4.2 Battery pack Removing the battery pack The following describes the procedure for re m oving the battery pack (See Figure 4-1). CAUTION: Take care not to short circuit the terminals when removing the batter y pack.
4 Replacement Procedures 4.2 Battery pack Installing the battery pack The following describes the procedure for inst alling the battery pack (See Figure 4-1). CAUTION: There is a danger that the lithium ion battery pack may explode if not fitted, operated, handled, or disposed correctly .
4.3 ExpressCard & PC card / Bridge media 4 Replacement Procedures 4.3 ExpressCard & PC card / Bridge media 4.3.1 ExpressCard & PC card Removing an ExpressCard & PC card The following describes the procedure for removing an ExpressCard & PC card (See Figure 4-2).
4 Replacement Procedures 4.3 ExpressCard & PC card / Bridge media [PC Card (Lower slot)] Eject button PC card Figure 4-2 Removing an ExpressCard or PC card Installing an ExpressCard & PC card The following describes the procedure for inse rting an ExpressCard & PC card (See Figure 4-2).
4.3 ExpressCard & PC card / Bridge media 4 Replacement Procedures 4.3.2 Bridge media (SD Card/Memory St ick/xDPicture Card/MultiMedia card) Removing a Bridge media The following describes the procedure for rem oving a Bridge Medi a (See Figure 4-3).
4 Replacement Procedures 4.4 HDD 4.4 HDD Removing a HDD The following describes the procedure fo r removing a HDD (See Figure 4-4 to 4-6). CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause data loss or damage to the device.
4.4 HDD 4 Replacement Procedures 5. (If an HDD-2 is installed) Turn the screw (with e-ring) securing an HDD-2 slot cover and remove an HDD-2 slot cover . 6. Remove the following screw securing the HDD-2 assembly . M2.5x6.0B FLAT BIND screw x １ 7.
4 Replacement Procedures 4.4 HDD 8. Remove the following screws securing the HDD holder and remove the HDD holder from HDD. M3.0x4.0Z FLAT BIND screw x4 M3.
4.4 HDD 4 Replacement Procedures Installing a HDD The following describes the procedure for installing a HDD (See Figure 4-4 to 4-6). 1. Install an HDD to the HDD holder and secure it with the following screws . M3.0x4.0Z FLAT BIND screw x4 NOTE: Although they are 3mm head screws, screw torque must be set in 0.
4 Replacement Procedures 4.5 MDC 4.5 MDC Removing a MDC The following describes the procedure for removing a MDC (See Figure 4-7). 1. Turning up the insulator , remove the following screw s securing a MDC. M2.0x4.0C BIND screw x2 2. Pull a MDC straight up and disconnect the MDC from the connector CN3000 on the SD board.
4.5 MDC 4 Replacement Procedures Installing a MDC The following describes the procedure for installing a MDC (See Figure 4-7). 1. Connect the RJ11 harness to the connector of the MDC. 2. Install a MDC and connect it to the connector C N3000 on the SD board.
4 Replacement Procedures 4.6 Memory module 4.6 Memory module CAUTION: The power of the computer must be turned off when you remove a memory module. Removing a memory module with the power on risks damaging the module or the computer itself. Do not touch memory module terminals.
4.6 Memory module 4 Replacement Procedures Installing a memory module To install a memory module, confirm that the com puter is in boot mode. Then perform the following procedure (See Figure 4-8). 1. Insert a memory module into the connector of the com puter slantwise (term inal side first) and press it to connect firmly.
4 Replacement Procedures 4.7 Keyboard 4.7 Keyboard Removing the keyboard The following describes the procedure for rem o ving the keyboard (See Figure 4-9 and 4-10). CAUTION: As the keytop may fall out, when handli ng the keyboard alw ays hold it by the frame and do not touch the keytop.
4.7 Keyboard 4 Replacement Procedures 5. Lift the upper side of the keyboard and turn it face down on the palm rest. 6. Remove the following screws securing the keyboard s upport plate and remove the keyboard support plate . M2.5x8.0B FLAT BIND screw x2 7.
4 Replacement Procedures 4.7 Keyboard Installing the keyboard The following describes the procedure for inst alling the keyboard (See Figure 4-9 to 4-10). 1. Turn the keyboard upside down and place it on the palm rest as its face down. Connect the keyboard cable to the connector CN3200 on the system board.
4.8 Bottom cover assembly 4 Replacement Procedures 4.8 Bottom cover assembly Removing the bottom cover assembly The following describes the procedure for rem o ving the bottom cover assembly (See Figure 4-11 to 4-14). 1. Remove the following screw securing LCD harness cover and rem ove the LCD harness cover .
4 Replacement Procedures 4.8 Bottom cover assembly 9. Turn over the computer upside down. 10. Disconnect the speaker cable (L) from the connector CN6002 under the insulator of HDD-2 slot. 11. Disconnect the AV-IN harness from the connector CN5660 in the m emory module slot.
4.8 Bottom cover assembly 4 Replacement Procedures “8” “16” “8” “16” “4” or “LH” “16” “8” “16” “8” “16” “8” “6” “8” “6” “8” “8” “8” “6” “16” Figure 4-13 Removing the screws from bottom cover assembly 13.
4 Replacement Procedures 4.8 Bottom cover assembly Installing the bottom cover assembly The following describes the procedure for inst alling the bottom cover assembly (See Figure 4-11 to 4-14). 1. Passing through the RJ45 harness into the slot, install the bottom cov er assembly .
4.8 Bottom cover assembly 4 Replacement Procedures 4-28 [C ONFI DENTIAL ] QOSMIO G20 Mai ntenance Manual ( 960-511) 12. Connect the LCD harness to the connector CN5000 on the system board. 13. Install the LCD harness cover and s ecure it with the following screw .
4 Replacement Procedures 4.9 LAN jack 4 4.9 LAN jack Removing the LAN jack The following describes the procedure for removing the LAN jack (See Figure 4-15).
4.10 Speaker (L) & Modem jack 4 Replacement Procedures 4.10 Speaker (L) & Modem jack Removing the speaker (L) & Modem jack The following describes the procedure for rem oving the speaker (L) & modem jack (See Figure 4-16).
4 Replacement Procedures 4.10 Speaker (L) & Modem jack Installing the speaker (L) & Modem jack The following describes the procedure for inst alling speaker (L) & modem jack (See Figure 4-16). 1. Install the modem jack to the bottom cover assembly.
4.11 AV-IN board 4 Replacement Procedures 4.11 AV-IN board Removing the AV-IN board The following describes the procedure for re m oving the AV-IN board (See Figure 4-17). 1. Remove the following screw securing the AV-IN board. M2.5x4.0B FLAT BIND screw x1 2.
4 Replacement Procedures 4.12 Battery latch assembly 4.12 Battery latch assembly Removing the battery latch assembly The following describes the procedure for removing the battery latch assembly (See Figure 4-18 and 4-19). 1. Remove the following screws securing the battery latch assembly.
4.12 Battery latch assembly 4 Replacement Procedures 3. Remove the battery lock from the battery assembly. 4. Releasing the tab , disassembling the battery latc h slider from battery latch base .
4 Replacement Procedures 4.13 Optical disk drive 4.13 Optical disk drive CAUTION: Do not perform 4.13.2 “Ejecting the op tical disk” except for the emergency ejection of optical disk inside ODD.
4.13 Optical disk drive 4 Replacement Procedures 4. Remove the following screw securing the ODD side bracket and remove the ODD side bracket . M2.0x3.0C S-THIN FLAT BIND screw x1 5. Remove the following screws securing the ODD rear bracket and ODD relay board.
4 Replacement Procedures 4.13 Optical disk drive 4.13.2 Ejecting th e optical disk CAUTION: The following procedure is emergency c ope only when the optical disk inside ODD can not be ejected because of some failure.
4.13 Optical disk drive 4 Replacement Procedures Assembling the ODD assembly The following describes the procedu re for assembling the O DD assembly from the optical disk drive (See Figure 4-22). 1. Install the ODD cover to the ODD base assembly by sliding the hook into the slo t of ODD base assembly.
4 Replacement Procedures 4.14 SJ board / Internal Microphon e 4.14 SJ board / Internal Microphone 4.14.1 SJ board Removing the SJ board The following describes the procedure for removing the SJ board (See Figure 4-23). 1. Disconnect the sound jack flat cable from the connector CN9520 on the SD board.
4.14 SJ board / Internal Microphone 4 Replacement Procedures Installing the SJ board The following describes the procedure for in stalling the SJ board (See Figure 4-23). 1. Connect the sound jack flat cable to the connector CN9530 and the USB harness to the connector CN4622 on the SJ board.
4 Replacement Procedures 4.14 SJ board / Internal Microphone 4.14.2 Internal Microphone Removing the Internal microphone The following describes the procedure for removing the internal microphone (See Figure 4- 24). 1. Remove the following screw securing the internal microphone and rem ove the internal microphone assembly.
4.15 Sound board 4 Replacement Procedures 4.15 Sound board Removing the sound board The following describes the procedure for removing the sound board (See Figure 4-25). 1. Disconnect the Sound harness from the connector CN9510 on the SD board. 2. Disconnect the Power SW harness from the connector CN9521 on the SD board.
4 Replacement Procedures 4.15 Sound board Installing the sound board The following describes the procedure for inst alling the sound board (See Figure 4-25). 1. Install the sound board and secure it with the following screw s . M2.5x3.0S FLAT BIND screw x3 2.
4.16 Power SW board 4 Replacement Procedures 4.16 Power SW board Removing the Power SW board The following describes the procedure for re m oving the Power SW board (See Figure 4-26). 1. Remove the following screw securing the power SW board and pull up the Pow er SW board from the cover assembly.
4 Replacement Procedures 4.16 Power SW board Installing the Power SW board The following describes the procedure for inst alling the Power SW board (See Figure 4-26). 1. Connect the Power SW harness to the connector CN9622 on the Power SW board. 2. Install the Power SW board to the cover assemb ly and secure it with the following screw.
4.17 Battery board / RTC battery 4 Replacement Procedures 4.17 Battery board / RTC battery 4.17.1 Battery board Removing the Battery board The following describes the procedure for rem o ving the Battery board (See Figure 4-27). 1. Disconnect the RTC battery cable from the connector CN9990 on the battery board.
4 Replacement Procedures 4.17 Battery board / RTC battery Installing the battery board The following describes the procedure for inst alling the battery board (See Figure 4-27). 1. Connect the battery power harness to the connector CN9690 and the b attery signal harness to the connector CN9691 on the battery board.
4.17 Battery board / RTC battery 4 Replacement Procedures 4.17.2 RTC battery Removing the RTC battery The following describes the procedure for removing the RTC battery (See Figure 4-28). 1. Turning up the insulator , pull out the RTC battery from the insulator.
4 Replacement Procedures 4.18 Wireless LAN card 4.18 Wireless LAN card Removing the wireless LAN card The following describes the procedure for re m oving the wireless LAN card (See Figure 4-29). 1. Disconnect the wireless LAN antenna cables (MAIN & AUX) from the connector on the wireless LAN card.
4.19 TV tuner module 4 Replacement Procedures 4.19 TV tuner module Removing the TV tuner module The following describes the procedure for remo ving the TV tuner module (See Figure 4-30). 1. Disconnect the TV antenna harness from the connector PJ601 on the TV tuner module.
4 Replacement Procedures 4.19 TV tuner module Installing the TV tuner module The following describes the procedure for inst alling the TV tuner module (See Figure 4-30). 1. Insert the TV tuner module into the connector CN2220 of the mini PCI slot slantwise and press it to connect firmly.
4.20 CPU fan 4 Replacement Procedures 4.20 CPU fan Removing the CPU fan The following describes the procedure fo r rem oving the CPU fan (See Figure 4-31). 1. Disconnect the CPU fan cable from the connector CN8770 on the system board. 2. Remove the following screws securing the CPU fan and remove the CPU fan .
4 Replacement Procedures 4.21 CPU fin & CPU 4.21 CPU fin & CPU Removing the CPU fin & CPU The following describes the procedure for rem oving the CPU fin & CPU (See Figure 4-32 and 4-33). 1. Remove the following screws securing the CPU holder.
4.21 CPU fin & CPU 4 Replacement Procedures 3. Unlock the CPU by rotating the cam on the CPU socket 180 degrees to the counterclockwise with a flat-blade screwdriver.
4 Replacement Procedures 4.21 CPU fin & CPU NOTE: Apply the silicon grease enough to cover the chip surface using the special applicator. Figure 4-34 Applying silicon grease 5. Install the CPU fin and CPU holder and secure them with the following screw s .
4.22 VGA fan & VGA fin 4 Replacement Procedures 4.22 VGA fan & VGA fin Removing the VGA fan & VGA fin The following describes the procedure for removing the VGA fan & VGA fin (See Figure 4- 35). 1. Peeling off the glass tape, disconnect the VGA fan cable from the connector CN8780 on the system board.
4 Replacement Procedures 4.22 VGA fan & VGA fin Installing the VGA fan & VGA fin The following describes the procedure for in stalling the VGA fan & VGA fin (See Figure 4- 35). 1. Install the VGA fin . NOTE: For details on applying the silicon grea se, refer to “Insta lling the CPU”.
4.23 GMCH heat sink 4 Replacement Procedures 4.23 GMCH heat sink Removing the GMCH heat sink The following describes the procedure for rem o ving the GMCH heat sink (See Figure 4-36). 1. Remove the following screws securing the GMCH heat sink. M2.
4 Replacement Procedures 4.24 Speaker (R) 4.24 Speaker (R) Removing the speaker (R) The following describes the procedure for re m oving the speaker (R) (See Figure 4-37). 1. Pull out the DC-IN jack from the guide of cover assembly. 2. Draw the speaker (R) from the slot of cover assembly.
4.25 TV antenna board 4 Replacement Procedures 4.25 TV antenna board Removing the TV antenna board The following describes the procedure for rem o ving the TV antenna board (See Figure 4-38). 1. Remove the following screw securing the TV antenna board.
4 Replacement Procedures 4.26 System board 4.26 System board CAUTION: 1. When handling the system board, alwa ys hold by the edges. Do not touch the printed circuit face. 2. If replacing with a new system board, execute the subtest01 Initial configuration in section 3.
4.26 System board 4 Replacement Procedu res Installing the system board The following describes the procedure for inst alling the system board (See Figure 4-39). 1. Connect the USB harness to the connector CN4611 . 2. Connect the ODD flat cable to the connector CN1810 .
4 Replacement Procedures 4.27 PC card slot 4.27 PC card slot Removing the PC card slot The following describes the procedure for rem o ving the PC card slot (See Figure 4-40). 1. Remove the following screws securing the PC card slot. M2.0x3.0B S-THIN FLAT BIND screw x2 M2.
4.27 PC card slot 4 Replacement Procedures 4-64 [CON FID ENTIAL ] QO SMIO G20 Mai ntenance Manu al (960-5 11) Installing the PC card slot The following describes the procedure for instal ling the PC card slot (See Figure 4-40). 1. Insert the terminal of the PC card slot into the connector CN2110 on the system board.
4 Replacement Procedures 4.28 Bluetooth module 4 4.28 Bluetooth module Removing the bluetooth module The following describes the procedure for removing the bluetooth m odule (See Figure 4-41). 1. Turning up the insulator , disconnect the bluetooth antenna cable from the connector on the bluetooth module.
4.28 Bluetooth module 4 Replacement Procedures Installing the bluetooth module The following describes the procedure for inst alling the bluetooth module (See Figure 4-41). 1. Install the bluetooth module and secu re it with the following screw . M2.
4 Replacement Procedures 4.29 Volume sensor board 4.29 Volume sensor board Removing the volume sensor board The following describes the procedure for rem o ving the volume sensor board (See Figure 4- 42). 1. Remove the following screws securing the volume sensor holder and remove the volume sensor holder .
4.30 Touch sensor board 4 Replacement Procedures 4.30 Touch sensor board Removing the touch sensor board The following describes the procedure for rem oving touch sensor (See Figure 4-43). 1. Disconnect the touch sensor flat cable from the connector on the touch sensor board.
4 Replacement Procedures 4.30 Touch sensor board Installing the touch sensor board The following describes the procedure for installing touch sensor (See Figure 4-43). 1. Peel off the double-sided tape from th e touch sensor board and stick the touch sensor board to the cover assembly.
4.31 Touch pad 4 Replacement Procedures 4.31 Touch pad Removing the touch pad The following describes the procedure for removing the touch pad (See Figure 4-44). 1. Peel off the glass tape and disconnect the touch pad flat cable from the connector on the touch pad.
4 Replacement Procedures 4.31 Touch pad Installing the touch pad The following describes the procedure for in stalling the touch pad (See F igure 4-44). 1. Peel off the separator covering on the sensor portion of a new touch pad. NOTE : Do not reuse the touch pad so that it c an not be used after peeling off from the computer.
4.32 Latch assembly 4 Replacement Procedures 4.32 Latch assembly Removing the latch assembly The following describes the procedure for re m oving the latch assembly (See Figure 4-45). 1. Remove the following screws securing the latch assembly. M2.
4 Replacement Procedures 4.32 Latch assembly Installing the latch assembly The following describes the procedure for inst alling the latch assembly (See Figure 4-45). 1. Assembling the spring and latch slid er , fit the hooks of latch slider into th e latch assembly.
4.33 LCD unit / FL inverter 4 Replacement Procedu res 4.33 LCD unit / FL inverter CAUTION: When replacing a LCD, it is required that SVP parameter is set.
4 Replacement Procedures 4.33 LCD unit / FL inverter 3. Remove the following screw securing the FL inverter. M2.0x4.0C BIND screw x1 4. Peel off the insulator adhered to the FL inverter. 5. Disconnect the LCD harnesses from the connectors CN1 and CN2 on the FL inverter.
4.33 LCD unit / FL inverter 4 Replacement Procedures 8. Remove the following screws securing the LCD unit. M2.0x4.0C BIND screw x4 9. With the bottom edge of the LCD unit on the display cover, lift onl y the top edge of the LCD unit. After peeling off the copper tape , disconnect the LCD harness from the connector on the back of the LCD.
4 Replacement Procedures 4.33 LCD unit / FL inverter 11. Remove the following screws securing the LCD support and rem ove the LCD supports from the LCD unit.
4.33 LCD unit / FL inverter 4 Replacement Procedures Installing the LCD unit/FL Inverter The following describes the procedure for inst alling the LCD unit and FL inverter (See Figure 4-46 to 4-49). 1. Install the LCD support to the LCD and secure them with the following screws .
4 Replacement Procedures 4.34 LCD harness 4.34 LCD harness Removing the LCD harness The following describes the procedure for re m oving LCD harness (See Figure 4-50 to 4-52). 1. Remove the following screw securing the LCD harness holder (cover assembly side) and remove the LCD harness holder from the cover assem bly.
4.34 LCD harness 4 Replacement Procedures 3. Remove the hinge front cap (L) from the display assembly. 4. Remove the following screw securing the LCD harness holder (display rear cover side) and remove the LCD harness holder from the display rear cover.
4 Replacement Procedures 4.34 LCD harness Installing the LCD harness The following describes the procedure for instal ling the LCD harness (See Figure 4-50 and 4- 52). 1. Arrange the LCD harness by putting the harness through th e slot of display assem bly.
4.35 Wireless antennas 4 Replacement Procedures 4.35 Wireless antennas Removing the wireless antennas The following describes the procedure for re m oving the wireless antennas (See Figure 4-53 and 4-54). 1. Remove the following screw securing the hinge cap (R) and remove the hinge rear cap (R) from the display assembly.
4 Replacement Procedures 4.35 Wireless antennas 2. Remove the hinge front cap (R) from the display assembly. 3. Peel off the acetate tapes fixing the wireless antenna cables. 4. Peeling off the wireless LAN antennas and bluetooth antenna from the display rear cover, remove the wireless antennas from the display assem bly.
4.35 Wireless antennas 4 Replacement Procedures Installing the wireless antennas The following describes the procedure for installing the wireless antennas (See Figure 4-53 and 4-54). 1. Stick the wireless LAN antennas and bluetooth antenna on the display rear cover.
4 Replacement Procedures 4.36 Display latch hook 4.36 Display latch hook Removing the display latch hook The following describes the procedure for rem o ving the display latch hook (See Figure 4-55). 1. Remove the following screws securing the display latch hook.
4.37 Display rear cover 4 Replacement Procedures 4.37 Display rear cover Removing the display rear cover The following describes the procedure for rem ovi ng the display rear cover (See Figure 4-56). 1. Remove the following screws securing the display rear cov er.
4 Replacement Procedures 4.38 Hinge 4.38 Hinge Removing the hinge The following describes the procedure for removing the hinge (See Figure 4-57). 1. Remove the following screws securing the hinge (L) and remove the hinge (L) . M2.5x6.0C PSP TIGHT screw x2 2.
4.38 Hinge 4 Replacement Procedures 4-88 [ CON FID ENTIAL ] QOSM IO G20 Mainte nance Manual (9 60-511) Installing the hinge The following describes the procedure for installing the hinge (See Figure 4-57). 1. Install the hinge (R) to the cover assembly and secure it with the following screws .
Appendices [CONFIDENTIAL ].
App-ii [ C ON FIDENTIAL ] QOSMIO G20 Mai ntenance Manual (9 60-511).
Appendix Contents Appendix A Handling the LCD Module ......................................................................... A-1 Appendix B Board Layout ............................................................................................... B-1 B.
C.13 IS2101 MEDIA BRIDGE I/ F connector (42-pin) ................................... C-13 C.14 CN2200 Wireless LAN card I/F connector (124-pin) ............................... C-14 C.15 CN2220 WW Tuner I/F connector (124-pin) .........................
C.41 CN9614 System board I/ F connector (10-pin)........................................... C-32 C.42 J9612 Composite-in connector (5-pin) .................................................. C-32 C.43 CN9613 S-video IN I/F connector (4-pin) ...........
Appendix F Wiring Diagrams .......................................................................................... F-1 F.1 RGB Monitor ID Wrapar ound Connector ..................................................... F-1 F.2 LAN loopbak Connector ....
Figures Figure B-1 System board layout (front) .......................................................................... B-1 Figure B-2 System board layout (back) .......................................................................... B-3 Figure B-3 BT board layout .
Tables Table B-1 System board ICs and connectors (front)...................................................... B-2 Table B-2 System board IC s and connectors (back) ...................................................... B-4 Table B-3 BT board connectors .
Table C-21 D-video I/F connector (14-pin) ................................................................... C-20 Table C-22 Speaker (Right) connector (2-pin) .............................................................. C-21 Table C-23 Volume I/F connector (3-pin) .
Sound jack board (FNN2J*) Table C-46 System board I/F connector (8-pin) ............................................................ C-34 Table C-47 USB I/F connect or Port 4 (4-pin)................................................................ C-34 Table C-48 USB I/F connect or Port 6 (4-pin).
QOSMIO G 20 Maint enance Ma nual (960 -511) [C ONFIDENTIAL ] App-xi Table J-7 Item s set in View Drive Info. ........................................................................ J-23 Table J-8 Function of option and key ...........................
Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged duri ng assembly or disassembly.
Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with co tton or a soft cloth. If it is still dirty, try breathing on the surface to create a light cond ensate and wipe it again. If the surface is very dirty, we recomme nd a CRT cleaning agent.
Appendix A Handling the LCD Module 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the m odule, so guard against damage from electrostatic discharge.
Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage.
Appendix A Handling the LCD Module 10. If you transport the module, do not use pack ing material that c ontains epoxy resin (amine) or silicon glue (alcohol or oxide).
Appendix A Handling the LCD Module A-6 [CONF IDENTIAL ] QOSMIO G20 Mai ntenance Manu al (960-5 11).
Appendix B Appendix B Board Layout B.1 Sy stem Board Front View (a) (l) (k) (j) (i) (h) (g) (f) (e) (b) (c) (d) (n) (m) Figure B-1 System board layout (front) QOSMIO G 20 Mainte nance Ma nual (960 -51.
B.1 System Board Front View Appendix B Board Layout Table B-1 System board ICs and connectors (front) Mark Number Name (a) IS2101 Bridge M edia slot (b) CN3400 Debugging port (c) CN440 0 Bluetooth FFC.
Appendix B Board Layout B.2 System Board Back View B.2 Sy stem Board Back View (a) (b) (c) (t) (r) (s) (d) (q) (e) (f) (p) (o) (n) (g) (m) (h) (l) (k) (j) (i) Figure B-2 System board layout (Back) QOS.
B.2 System Board Back View Appendix B Board Layout Table B-2 System board ICs and connectors (back) Mark Number Name (a) CN1860 HDD-2 I/F connector (b) CN1400 Memo ry module (base) I/F connector (c) C.
Appendix B Board Layout B.3 BT board B.3 BT board <Front layout> <Back layout> (a) (c) (d) (b) Figure B-3 BT board layout Table B-3 BT board connectors Mark Number Name (a) CN9690 Battery .
B.4 SD board Appendix B Board Layout B.4 SD board <Front layout> <Back layout> (e) (c) (b) (a) (d) Figure B-4 SD board layout Table B-4 SD board connectors Mark Number Name (a) CN3000 MDC .
Appendix B Board Layout B.4 SD board QOSMIO G 20 Mainte nance Manual (960-5 11) [CONF IDENTIAL] B-7.
B.5 SJ board Appendix B Board Layout B.5 SJ board <Front lay out> (a) <Back layout> (b) (g) (f) (e) (d) (c) Figure B-5 SJ board layout Table B-5 SJ board connectors Mark Number Name (a) CN.
Appendix B Board Layout B.6 AV-IN board B.6 AV-IN board <Front layout> (a) (b) (c) <Back layout> Figure B-6 AV-IN board layout Table B-6 AV-IN board connectors Mark Number Name (a) J9612 M.
B.7 Power SW board Appendix B Board Layout B.7 Power SW board <Front layout> ( b ) ( a ) <Back layout> Figure B-7 Power SW board layout Table B-7 Power SW board connectors Mark Number Name.
Appendix B Board Layout B.8 ODD relay board B.8 ODD relay board <Front layout> ( a ) <Back layout> ( b ) Figure B-8 ODD relay board layout Table B-8 ODD relay board connectors Mark Number .
B.9 TV antenna board Appendix B Board Layout B.9 TV antenna board <Front layout> <Back layout> ( a ) ( b ) Figure B-9 TV antenna board layout Table B-9 TV antenna board connectors Mark Num.
Appendix B Board Layout B.9 TV antenna board QOSMIO G 20 Mainte nance Manual (960-5 11) [CONF IDENTIAL] B-13.
QOSMIO G 20 Mainte nance Ma nual (960 -511) [CONFIDE NTIAL] C-1 Appendix C Appendix C Pin Assignment System Board (FNN2S*) C.1 CN1410 Memor y Connector 0 (200-pin) Table C-1 Memory connector 0 (200-pin) (1/3) PIN No.
C.1 CN1410 Memory Connector 0 (200- pin) Appendix C Pin Assignment C-2 [C ONF IDENTIAL ] QOSMIO G 20 Maint enance Ma nual (960 -511) Table C-1 Memory connector 0 (200-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 63 BDQ28-B1P I/O 64 BDQ25-B1P I/O 65 GND - 66 GND - 67 BDM3-B1P I 68 BDQS3-B1N I/O 69 N.
Appendix C Pin Assignment C.1 CN 1410 Memory Connector 0 (200-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-3 Table C-1 Memory connector 0 (200-pin) (3/3) PIN No.
C.2 CN1400 Memory connector 1 (200- pin) Appendix C Pin Assignment C-4 [C ONF IDENTIAL ] QOSMIO G 20 Maint enance Ma nual (960 -511) C.2 CN1400 Memor y connector 1 (200-pin) Table C-2 Memory connector 1 (200-pin) (1/3) PIN No.
Appendix C Pin Assignment C.2 CN 1400 Memory connector 1 (200-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-5 Table C-2 Memory connector 1 (200-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 63 ADQ25-B1P I/O 64 ADQ28-B1P I/O 65 GND - 66 GND - 67 BDM3-B1P I 68 ADQS3-B1N I/O 69 N.
C.2 CN1400 Memory connector 1 (200- pin) Appendix C Pin Assignment C-6 [C ONF IDENTIAL ] QOSMIO G 20 Maint enance Ma nual (960 -511) Table C-2 Memory connector 1 (200-pin) (3/3) PIN No.
Appendix C Pin Assignment C.3 CN1850 1st HDD I/F connector (22-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-7 C.3 CN1850 1st HDD I/F connector (22-pin) Table C-3 1st HDD I/F connector (22-pin) PIN No.
C.5 CN2100 PC card I/F connector ( 150-pin) Appendix C Pin Assignment C-8 [C ONF IDENTIAL ] QOSMIO G 20 Maint enance Ma nual (960 -511) C.5 CN2100 PC card I/F connector (150-pin) Table C-5 PC card I/F connector (150-pin) (1/3) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.5 CN2100 PC card I/F connector (150-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-9 Table C-5 PC card I/F connector (150-pin) (2/3) PIN No. Signal name I/O PIN No. Signal name I/O 61 N.C - 62 N.C - 63 N.
C.5 CN2100 PC card I/F connector ( 150-pin) Appendix C Pin Assignment C-10 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) Table C-5 PC card I/F connector (150-pin) (3/3) PIN No.
Appendix C Pin Assignment C.6 CN 3200 Keyboard I/F connector (34-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-11 C.6 CN3200 Keyboard I/F connector (34-pin) Table C-6 Keyboard I/F connector (34-pin) PIN No. Signal name I/O PIN No.
C.8 CN8770 CPU FAN connector (3-p in) Appendix C Pin Assignment C-12 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.8 CN8770 CPU FAN connector (3-pin) Table C-8 CPU FAN connector (3-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 FAN VCC - 2 GND - 3 FANG0-P3P I C.
Appendix C Pin Assignment C.12 CN8800 DC IN connector (4-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-13 C.12 CN8800 DC IN connector (4-pin) Table C-12 DC IN connector (4-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 PVL POWER O 2 PVL POWER O 3 GND - 4 GND - C.
C.14 CN2200 Wireless LAN card I/F connector (124-pin) Appendix C Pin Assignment C-14 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.14 CN2200 Wireless LAN card I/F connector (124-pin) Table C-14 Wireless LAN card I/F connector (124-pin) (1/2) PIN No.
Appendix C Pin Assignment C.14 CN2200 Wireless LAN card I/F connector (124-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-15 Table C-14 Wireless LAN card connector (124-pin) (2/2) PIN No.
C.15 CN2220 WW Tuner I/F connector (124 -pin) Appendix C Pin Assignment C-16 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.15 CN2220 WW Tuner I/F connector (124-pin) Table C-15 WW Tuner I/F connector (124-pin) (1/2) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.15 CN222 0 WW Tuner I/F connector (124-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-17 Table C-15 WW Tuner I/F connector (124-pin) (2/2) PIN No.
C.16 CN4100 Network I/F connector (14- pin) Appendix C Pin Assignment C-18 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.16 CN4100 Network I/F connector (14-pin) Table C-16 Network I/F connector (14-pin) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.18 CN 5000 LCD I/F connector (41-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-19 C.18 CN5000 LCD I/F connector (41-pin) Table C-18 LCD I/F connector (41-pin) PIN No.
C.19 CN5080 CRT I/F connector (15-pi n) Appendix C Pin Assignment C-20 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.19 CN5080 CRT I/F connector (15-pin) Table C-19 CRT I/F connector (15-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 NVARED-PXP I 2 NVAGRN-PXP I 3 NVABLU-PXP I 4 N.
Appendix C Pin Assignment C.22 CN600 3 Speaker (Right) connector (2-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-21 C.22 CN6003 Speaker (Ri ght) connector (2-pin) Table C-22 Speaker (Right) connector (2-pin) PIN No. Signal name I/O PIN No.
C.26 CN4400 Bluetooth I/F connector (20-pin) Appendix C Pin Assignment C-22 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.26 CN4400 Bluetooth I/F connector (20-pin) Table C-26 Bluetooth I/ F connector (20-pin) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.29 CN8020 Battery (Power) I/F connector (6-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-23 C.29 CN8020 Battery (Power ) I/F connector (6-pin) Table C-29 Battery (Power) I/F connector (6-pin) PIN No. Signal name I/O PIN No.
C.31 CN1810 ODD relay board (FNN2D*) I/F connector (50-pin) Appendix C Pin Assignment C-24 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.31 CN1810 ODD relay board (FNN2D*) I/F connector (50-pin) Table C-31 ODD relay board (FNN2D*) I /F connector (50-pin) PIN No.
Appendix C Pin Assignment C.32 CN9500 Sound board (FNN2N*) I/F connector (57- pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-25 C.32 CN9500 Sound board (FNN2N*) I/F connector (57-pin) Table C-32 Sound board (FNN2N*) I/F connector (57-pin) PIN No.
C.33 CN5660 AV-IN board (FNN2V*) I/F co nnector (10-pin) Appendix C Pin Assignment C-26 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.33 CN5660 AV-IN board (FNN 2V*) I/F connector (10-pin) Table C-33 AV-IN board (FNN2V*) I/F connector (10-pin) PIN No.
Appendix C Pin Assignment C.34 CN182 0 CD-ROM I/F connector (50-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-27 ODD relay board (FNN2D*) C.34 CN1820 CD-ROM I/F connector (50-pin) Table C-34 CD-ROM I/F connector (50-pin) PIN No. Signal name I/O PIN No.
C.35 CN9680 System board I/F connector (50-pin) Appendix C Pin Assignment C-28 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.35 CN9680 System board I/F connector (50-pin) Table C-35 System board I/F connector (50-pin) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.36 CN 3000 MDC I/F connector (30-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-29 Sound board (FNN2N*) C.36 CN3000 MDC I/F connector (30-pin) Table C-36 MDC I/F connector (30-pin) PIN No. Signal name I/O PIN No.
C.38 CN9510 System board I/F connector (57-pin) Appendix C Pin Assignment C-30 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) C.38 CN9510 System board I/F connector (57-pin) Table C-38 System board I/F connector (57-pin) PIN No. Signal name I/O PIN No.
Appendix C Pin Assignment C.39 CN9520 Sound jack board I/F connector (20-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-31 C.39 CN9520 Sound jack board I/F connector (20-pin) Table C-39 Sound jack board I/F connector (20-pin) PIN No.
C.41 CN9614 System board I/F connector (10-pin) Appendix C Pin Assignment C-32 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) AV-IN board (FNN2V*) C.41 CN9614 System board I/F connector (10-pin) Table C-41 System board I/F connector (10-pin) PIN No.
Appendix C Pin Assignment C.44 J9610 TV antenna connector (4-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-33 Antenna jack board (FNN2A*) C.44 J9610 TV antenna connector (4-pin) Table C-44 TV antenna connector (4-pin) PIN No. Signal name I/O PIN No.
C.46 CN4622 System board I/F connector (8-pin) Appendix C Pin Assignment C-34 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) Sound jack board (FNN2J*) C.46 CN4622 System board I/F connector (8-pin) Table C-46 System board I/F connector (8-pin) PIN No.
Appendix C Pin Assignment C.50 J6001 Ex ternal microphone I/F connector (6-pin) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-35 C.50 J6001 External microph one I/F connector (6-pin) Table C-50 External microphone I/F connector (6-pin) PIN No.
C.53 CN9690 System board (Power) I/F connector (6-pin) Appendix C Pin Assignment C-36 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) Battery board (FNN2B*) C.53 CN9690 System board (P ower) I/F connector (6-pin) Table C-53 System board (Power) I/F connector (6-pin) PIN No.
Appendix C Pin Assignment C.56 CN9990 RTC battery connector (3-pin ) QOSMIO G 20 Mainte nance Ma nual (960 -511) [ CONFIDENTIAL ] C-37 C.56 CN9990 RTC battery connector (3-pin) Table C-56 RTC battery connector (3-pin) PIN No. Signal name I/O PIN No. Signal name I/O 1 (CN9691-7 ) O 2 N.
C.57 CN9622 Sound board (FNN2N*) I/F connect or (4-pin) Appendix C Pin Assignment C-38 [C ONF IDENTIA L] QOSMIO G2 0 Mainten ance Manu al (960- 511) Power switch board (FNN2P*) C.57 CN9622 Sound board (FNN2N*) I/F connector (4-pin) Table C-57 Sound board (FNN2N*) I/F connector (4-pin) PIN No.
Appendix. D Appendix D Display Codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 01 ‘ ~ 29 A9 0E F0 0E 02 1 ! 02 82.
D.1 Display Codes Appendix. D Display codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 29 | 2B AB 5D F0 5D *5 30 Caps Lock 3A BA 58 F.
Appendix. D Display codes D.1 Display Codes Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 58 Ctrl 1D 9D 14 F0 14 *3 60 Alt (L) 38 B8 11 F.
D.1 Display Codes Appendix. D Display codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code set 2 Cap No. Keytop Make Break Make Break Note 122 F11 57 D7 78 F0 78 *3 123 F12 58 D8 07 F0 0.
Appendix. D Display codes D.1 Display Codes Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Cap No. Key top Make Break Make Break 55 / E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0.
D.1 Display Codes Appendix. D Display codes Table D-3 Scan codes in Numlock mode Code set 1 Code set 2 Cap No. Key top Make Brea k Make Break 75 INS E0 2A E0 52 E0 D2 E0 AA E0 12 E0 70 E0 F0 70 E0 F0 .
Appendix. D Display codes D.1 Display Codes Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Cap No. Keytop Make Break Make Break 09 8 (8) 48 C8 75 F0 75 10 9 (9) 49 C9 7D F0 7D 11 0 (*) 37 .
D.1 Display Codes Appendix. D Display codes D-8 [CONFI D ENTIAL ] QOSMIO G2 0 Mainte nance Manu al (960 -511) Table D-7 No.126 key scan code Code set 1 Code set 2 Key top Shift Make Make Pause Co m m on * E1 1D 45 E1 9D C5 E1 14 77 E1 F0 14 F0 77 Ctrl* E0 46 E0 C6 E0 7E E0 F0 7E *: This key generates only make codes.
Appendix E Key Layout Appendix E Key Layout E.1 United States (US) Keyboard Figure E-1 US Keyboard layout E.2 United Kingdom (UK) Keyboard Figure E-2 UK Keyboard layout QOSMIO G 20 Maint enance Ma nua.
E.2 United Kingdom (UK) Keyboard Appendix E Key Layout E-2 [ C ONFI DENTIAL ] QOSMIO G20 Maint enance Manual (9 60-511).
Appendix F Appendix F Wiring Diagrams F.1 RGB Monitor ID Wraparound connector (1) RED (2) GREEN (3) BLUE (4) NC (5) GND (6) GND (7) GND (8) GND (9) 5V (10) GND (1 1) NC (12) SD A (13) HSYNC (14) VSYNC.
F.2 LAN loopback Connector Appendix F Wiring Diagrams F-2 [C ONFI DENTIAL ] QOSMIO G20 Maintenance Manual (960-5 11).
Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS 1. Set the system to boot mode.
Appendix G BIOS Rewrite Procedures G-2 [CONFIDE NTIAL] QO SMIO G20 Maintenance Manual (960-511).
Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are m ade. 1. Replacing of system board 2.
Appendix H EC/KBC Rewrite Procedures H-2 [CONFIDE NTIAL] QOSMIO G 20 Maintenance Manual (960-511) 4. Connect an external FDD and insert the EC/KBC rewriting disk into the external FDD. 5. Turn on the power while holding down the Tab key. (Keep holding down the key until a message appears on the screen.
Appendix I Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration . Table I-1 MTBF Component Time (hours) System 6704.
Appendix I Reliability I-2 [CON FI DENTIAL ] QOSMIO G2 0 Mainten ance Manu al (960- 511).
Appendix J Appendix J Maintenance of TOSHIBA RAID J.1 Outline of Maintenance (Repair) of TOSHIBA RAID Follow the below procedures to repair TOSHIBA RAID No Yes Analysis by Drive Log (*3) Is it needed to specify the cause? Treatment No Perform the HDD Trouble- shooting Procedure in Section 2.
J.2Analysis and handling by Drive Log Appendix J Maintenance of TOSHIBA RAID J.2 Analysis and handling by Drive Log Follow the below procedures to analyze. En d Replace the second HDD with new (good) one. No Port 1 (2) If necessary, analyze the Drive Log and identify the cause of failure.
Appendix J Maintenance of TOSHIBA RAID J.2Analysis and handling by Drive Log J.2.1 How to identify the cause of failure (1) When “Fail” or “NODRIVE” is displayed According to “Operation of Independent utility”, boot the independent utility to display the Drive Log.
J.2Analysis and handling by Drive Log Appendix J Maintenance of TOSHIBA RAID 2. Analyze the detailed date of the message of right before of “xxx Error (IN)”, “xxx Error (OUT)” (for example, “DMA Error (IN)”, “DMA Error (OUT)”) right before the log of “Fail this drive” message and identify the cause.
Appendix J Maintenance of TOSHIBA RAID J.2Analysis and handling by Drive Log Command ： Indicates Command code caused an error. The following list indicates the command Table J-1 List of Command (1/2.
J.2Analysis and handling by Drive Log Appendix J Maintenance of TOSHIBA RAID Table J-1 List of Command (2/2) Protocol Command Devices not implementing the PACKET Command feature set Devices implementi.
Appendix J Maintenance of TOSHIBA RAID J.2Analysis and handling by Drive Log (2) Check if it is caused by an operation miss or is a failure. To check if the cause of failure of Port1 is an operation miss or not, analyze the Drive Log of Port0. 1. In [REDUNDANT] of Port-0, find a log of “Fail this drive” message by [PgUp] and [PgDn] key.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID J.3 Operation of Independent utility J.3.1 Outline of Independent utility This is a utility to display Drive Log of TOSHIBA RAID. (1) Drive Log TOSHIBA RAID can store about 7,000 logs of Drive Log.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility J.3.2 How to operate the Independent Utility (1) Booting PC Connected the USB FDD to the PC to be repaired. Insert the FD storing the program of the Independent Utility in the FDD and boot the PC from the FD.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID (2) Display of Logical/Physical Drive Logical Drive The status of RAID array is displayed in Logical Drive by array. The displayed items are follows. Table J-2 Displayed item in Logical Drive Explanation Status (Status of array) Displays the status of array.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Physical Drive In Physical Drive, the condition of RAID array is displayed by array. The following items are displayed. Table J-3 Items displayed in Physical Drive Explanation Port Displays the port number of Serial ATA connected to the drive.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID (3) Explanation of Main Menu The Independent Utility has following Main Menu. Table J-4 Item of Main Menu displayed Explanation Create Array Builds RAID array. Start Rebuild Rebuilds RAID-1.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility The tree of Independent Menu is as follows. Figure J-4 Tree of menu of Independent Utility QOSMIO G20 Maintenance Manual (960.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID Create Array This section explains how to select option and build array. The [Create Array] option can be selected only when there is a drive not assigned. To build array, follow the procedure below.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility 6. Put the cursor on the “DONE” and press [Enter] key. Pressing “OK” in [Confirmation] store the change. CAUTION: When the array is initialized, the data of drive is lost.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID 3. When [Rebuild Range] menu is displayed, the range to be rebuilt is designated. When [Eff ective] is selected, rebuild limit becom es valid and it rebuilds up to the rebuild limit.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility 8. When completing the rebuild, press “OK” to return to the m ain menu of Independent Setup Utility. Resume Rebuild During being suspended,[Resume Rebuild] is displayed in [Main Menu].
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID 6. When completing the rebuild, press “OK” to return to the m ain menu of Independent Setup Utility. 7. When “Rebuild Limit” is set and [Rebuild Range] is set to [W hole], only [Finish] is can be selected after exceeding the Rebuild Limit.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Check Media This option can check if there is an error in the HDD of array. The Check Media can be done only in RAID-1. To execute Check Media, follow the procedure below. 1. Put the cursor to the [Check Media] in [Main Menu] and press [Enter] key.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID Modify Array This option changes the setting of array. Change Parameter Select [Change Parameter] in [Modify Array] menu. The following item s can be set. Table J-6 Item of array Option Explanation Write Cache Displays the setting of drive write cache.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Change RAID Level To change RAID level, select [Modify Array] menu. When changing RAID-1 (Mirroring) to RAID-0 (Striping), refe r “Changing RAID-1 to RAID-0”. When changing RAID-0 to RAID-1, refe r “Changing RAID-0 to RAID-1”.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID Delete Array Selects [Delete Array] of Setup Utility and delete array. Put the cursor on the array you want to delete and press [Enter] key. When [Confirmation] is displayed, select “OK” to store the setting.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Physical Drive Select [Physical Drive] in Setup Utility to set physical drive. View Drive Info. Select this option in [Physical Drive] to display information of physical drive.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID View Drive Log Select this option in [Physical Drive] menu and select the drive that you want to display the log. At the beginning, the latest log is displayed. The 7,168 logs from the latest is recorded in detail.
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility Execute the following procedures to see the drive log in the independent utility. 1. Put on the cursor on [Physical Drive] in [Main Menu] and press [Enter] key. 2. Put on the cursor on [View Drive Log] and press [Enter] key.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID The following is displayed. Table J-9 Content of Drive Log display No. Option Explanation 1 Port Displays the port number of log displayed. 2 Own/Redundant Displays if the displayed log is a log of own port (Own) or a copy of other port log (Redundant).
Appendix J Maintenance of TOSHIBA RAID J.3Operation of Independent utility [View Drive Log] menu is as follows Table J-10 Content of View Drive Log menu Option Explanation Change Port Changes the display of t he own log and redundant log. At the beginning, the Port-0’s own log and the redundant log are displayed.
J.3Operation of Independent utility Appendix J Maintenance of TOSHIBA RAID J-28 [CONFIDENTIAL] Q OSMIO G20 Maintenance Manual (960-511) Exit When this option is selected, the utility is finished.
Een belangrijk punt na aankoop van elk apparaat Toshiba QOSMIO G20 (of zelfs voordat je het koopt) is om de handleiding te lezen. Dit moeten wij doen vanwege een paar simpele redenen:
Als u nog geen Toshiba QOSMIO G20 heb gekocht dan nu is een goed moment om kennis te maken met de basisgegevens van het product. Eerst kijk dan naar de eerste pagina\'s van de handleiding, die je hierboven vindt. Je moet daar de belangrijkste technische gegevens Toshiba QOSMIO G20 vinden. Op dit manier kan je controleren of het apparaat aan jouw behoeften voldoet. Op de volgende pagina's van de handleiding Toshiba QOSMIO G20 leer je over alle kenmerken van het product en krijg je informatie over de werking. De informatie die je over Toshiba QOSMIO G20 krijgt, zal je zeker helpen om een besluit over de aankoop te nemen.
In een situatie waarin je al een beziter van Toshiba QOSMIO G20 bent, maar toch heb je de instructies niet gelezen, moet je het doen voor de hierboven beschreven redenen. Je zult dan weten of je goed de alle beschikbare functies heb gebruikt, en of je fouten heb gemaakt die het leven van de Toshiba QOSMIO G20 kunnen verkorten.
Maar de belangrijkste taak van de handleiding is om de gebruiker bij het oplossen van problemen te helpen met Toshiba QOSMIO G20 . Bijna altijd, zal je daar het vinden Troubleshooting met de meest voorkomende storingen en defecten #MANUAl# samen met de instructies over hun opplosinge. Zelfs als je zelf niet kan om het probleem op te lossen, zal de instructie je de weg wijzen naar verdere andere procedure, bijv. door contact met de klantenservice of het dichtstbijzijnde servicecentrum.
