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72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL™ Architecture CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Cypress Semiconductor Corpora tion • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document #: 001-15031 Rev .
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 2 of 30 Logic Block Diagram – CY7C1470BV33 (2M x 36) Logic Block Diagram – CY7C1472BV33 (4M x 18) A0, A1, A C MODE BW a .
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 3 of 30 Logic Block Diagram – CY7C1474BV33 (1M x 72) A0, A1, A C MODE CE1 CE2 CE3 OE READ LOGIC DQ s DQ P a DQ P b DQ P c .
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 4 of 30 Pin Configurations A A A A A 1 A 0 V SS V DD A A A A A A V DDQ V SS DQb DQb DQb V SS V DDQ DQb DQb V SS NC V DD DQa .
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 5 of 30 Pin Configurations (continued) 165-Ball FBGA (15 x 17 x 1.4 mm ) Pinout CY7C1470BV33 (2M x 36) CY7C1472BV33 (4M x 18.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 6 of 30 Pin Configurations (continued) CY7C1474BV33 (1M × 72) 209-Ball FBGA (14 x 22 x 1.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 7 of 30 T able 1. Pin Definitions Pin Name IO T ype Pin Description A0 A1 A Input- Synchronous Address Inputs Used to Select One of the Address Locations . Sampled at the rising edge of the CLK.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 8 of 30 Functional Overview The CY7C1470BV33, CY7C1472BV33 , and CY7C1474BV33 are synchronous-pipel ined Burst NoBL SRAMs designed specif- ically to eliminate wait states during read or w rite transitions.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 9 of 30 access (read, write, or deselect) is latched into the Address Register (provided the ap propriate control signals are asserted).
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 10 of 30 T a ble 4. T ruth T able The truth table for CY7C1470BV33, CY7C1472BV33, and CY7C1474 BV33 follows.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 1 1 of 30 T able 5. Partial Write Cycle Description The partial write cycle description for CY7C1470 BV33, CY7C1472BV33, and CY7 C1474BV33 follows.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 12 of 30 IEEE 1 149.1 Serial Boun dary Scan (JT AG) The CY7C1470BV33, CY7C1472BV33 , and CY7C1474BV33 incorporates a serial boundary sca n test access port (T AP). This port operates in accordance with IEEE S tandard 1 149.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 13 of 30 Instruction Register Three-bit instructions can be serially loa ded into the instruction register . Thi s register is loaded when it is placed b etween the TDI and TDO balls as shown i n the “T AP Controller Block Diagram” on page 12 .
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 14 of 30 possible to capture all o ther signals and simply ig nore the value of the CLK captured in the boundary scan register . After the data is captured, it is possible to shift out the data by putting the T AP into the Shif t-DR state.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 15 of 30 T AP AC Switchin g Characteristics Over the Operating Range [9, 10] Parameter Description Mi n Max Unit Clock t TCY.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 16 of 30 3.3V T AP AC T est Conditions Input pulse levels .................... .............. ........... .... V SS to 3.3V Input rise and fall time s.........................
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 17 of 30 T able 6. Iden tification Reg ister Definitions Instruction Field CY7C1470BV33 (2M x 36) CY7C1472BV33 (4M x 18) CY7.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 18 of 30 T a ble 9. Boun dar y Scan Exit Order (2M x 36) Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Bal.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 19 of 30 Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # 209-B all ID Bit # 2 09-Ball ID Bit # 209-Ball ID 1A 1 2.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 20 of 30 Maximum Ratings Exceeding maximum ratin gs may impair the useful life o f the device. These user guidelines are not teste d. S torage T emperature ................ ..
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 21 of 30 I SB3 Automatic CE Power Down Current—CMOS Inputs Max. V DD , Device Deselected, V IN ≤ 0.3V or V IN > V DDQ − 0.3V , f = f MAX = 1/t CYC 4.0-ns cycle, 250 MHz 245 mA 5.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 22 of 30 Switching Characteristics Over the Operating Range. Timi ng reference is 1.5V when V DDQ = 3.3V and is 1.25V when V DDQ = 2.5V . T e st conditions shown in (a) of “AC T est Loads and W aveforms” on page 21 unless otherwise noted.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 23 of 30 Switching W aveforms Figure 5 shows read-write timing waveform. [20, 21, 22] Figure 5.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 24 of 30 Figure 6 shows NOP , ST ALL and DESELECT Cycles waveform. [20, 21, 23] Figure 6. NOP , ST ALL and DESELECT Cycles Figure 7 shows ZZ Mode timing wavefo rm. [24, 25] Figure 7.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 25 of 30 Ordering Information Not all of the speed, package and temper ature ranges are availabl e. Please contact your local sales representative or visit www .cypress.com for actual products offered.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 26 of 30 250 CY7C1470BV33-250AXC 51-850 50 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Pb-free Commercial CY7C1472BV33-250AXC CY7C1470BV33-250BZC 51-85165 165-ball Fi ne- Pitch Ball Grid Array (15 x 17 x 1.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 27 of 30 Package Diagrams Figure 8. 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm), 51-850 50 NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 28 of 30 Figure 9. 165-Ball FBGA (1 5 x 17 x 1.4 m m), 51-85165 Package Diagrams (continued) A 1 PIN 1 CORNER 17.00±0.10 15.00±0.10 7.00 1.00 Ø0.45±0.05(165X) Ø0.25 M C A B Ø0.
CY7C1470BV33 CY7C1472BV33, CY7C1474BV33 Document #: 001-15031 Rev . *C Page 29 of 30 Figure 10. 209-Ball F BGA (14 x 22 x 1.7 6 mm), 51-85167 Package Diagrams (continued) 51-85167-* * [+] Feedback.
Document #: 001-15031 Rev . *C Re vised February 29, 2008 Page 30 of 30 NoBL and No Bu s Latency are trademar ks of Cypress Semicondu ctor Co rporation. ZBT is a trademark of Integrat ed Device T echn ology , Inc. All products and company names me ntioned in this document may be the tr ademarks of their respe ctive hold er s.
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