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72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture CY7C1471V33 CY7C1473V33 CY7C1475V33 Cypress Semiconductor Corpora tion • 198 Champion Court • San J ose , CA 95134-1709 • 408-943-2600 Document #: 38-05288 Rev .
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 2 of 32 Logic Block Diagram – CY7C1471V33 (2 M x 36) Logic Block Diagram – CY7C1473V33 (4 M x 18) C MODE BW A BW B WE CE1 CE2.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 3 of 32 Logic Block Diagram – CY7C1475V33 (1 M x 72) A0, A1, A C MODE CE1 CE2 CE3 OE READ LOGIC DQ s DQ Pa DQ Pb DQ Pc DQ Pd DQ.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 4 of 32 Pin Configurations 100-Pin TQFP Pinout A A A A A1 A0 NC/288M NC/144M V SS V DD A A A A A A DQP B DQ B DQ B V DDQ V SS DQ .
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 5 of 32 Pin Configurations (continued) 100-Pin TQFP Pin out A A A A A1 A0 NC/288M NC/144M V SS V DD A A A A A A A NC NC V DDQ V S.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 6 of 32 Pin Configurations (continued) 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1471V33 (2M x 36) CY7C1473V33 (4M x 18) 234 56.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 7 of 32 Pin Configurations (continued) CY7C1475V33 (1M × 72) A B C D E F G H J K L M N P R T U V W 12 3 4 567 8 9 1 1 10 DQg DQg.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 8 of 32 Pin Definitions Name IO Description A 0 , A 1 , A Input- Synchronous Address Inputs used to select one of the address loca tions . Sampled at the rising edge of the CLK. A [1:0] are fed to the two-bit burst counter .
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 9 of 32 Functional Overview The CY7C1471V33, CY7 C1473V33, and CY7C1475 V33 are synchronous fl ow through burst SRAMs designed sp ecifically to eliminate wait states during write-read transitions.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 10 of 32 The data written during the wr ite operati on is controlled by BW X signals. The CY7C147 1V33, CY7C1473V33 , and CY7C1475V33 provides Byte Write capability that is described in the “T ruth T able for Read/Write” on page 12 .
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 1 1 of 32 T ruth T able The truth table for CY7C1471V33, CY7C1473V33, CY7C 1475V33 follows.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 12 of 32 T ruth T able for Read/Write The read-write truth table for CY7C1471V33 follows.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 13 of 32 IEEE 1 149.1 Serial Boundary Scan (JT AG) The CY7C1471V33, CY7C1 473V33, and CY7C147 5V33 incorporate a serial bo undary scan test access p ort (T AP). This port operates in accordance with IEEE S tandard 1 149.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 14 of 32 TA P R e g i s t e r s Registers are connected betwe en the TDI and TDO ball s and enable data to be scanned into and out of the SRAM test circuitry . Only one registe r can be selected at a time thro ugh the instruction register .
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 15 of 32 signal while in tran sition (metastable state). This does not harm the device, but there i s no guarantee as to the value that is captured. Repeatable results may not be possible.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 16 of 32 T AP AC Switching Characteristics Over the Operatin g Range [10, 1 1 ] Parameter Description Min Max Unit Clock t TCYC T.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 17 of 32 3.3V T AP AC T est Conditions Input pulse levels ....................... .............. ........... V SS to 3.3V Input rise and fall times ......... ........ .............
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 18 of 32 Identification Register Definitions Instruction Field CY7C1471V33 (2Mx36) CY7C1473V33 (4Mx18) CY7C1475V33 (1Mx72) Descri.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 19 of 32 Boundary Scan Exit Order (2M x 36) Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID Bit # 165-Ball ID 1C 1 2 1 R 3 .
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 20 of 32 Boundary Scan Exit Order (1M x 72) Bit # 209-Ball ID Bit # 209-Ball ID Bit # 209-Ball ID Bit # 209-Ball ID 1 A1 29 T1 57.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 21 of 32 Maximum Ratings Exceeding maximum rati ngs may impair the useful life of the device. These user guid elines are not tested. S torage T emperature ........... .............
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 22 of 32 Cap acitance T ested initially and after any design or process change that may affect these parameters. Parameter Description T est Condit ions 100 TQFP Package 165 FBGA Package 209 BGA Package Unit C ADDRESS Address Input Capacitance T A = 25 ° C, f = 1 MHz, V DD = 3.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 23 of 32 Switching Characteristics Over the Operating Range. Unless other wise noted in the following table, timi ng reference level is 1.5V when V DD Q = 3.3V and is 1.25V when V DDQ = 2.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 24 of 32 Switching W aveforms Figure 1 shows read-write timing waveform. [20, 21, 22] Figure 1.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 25 of 32 Figure 2 shows NOP , ST ALL and DESELECT Cycles waveform. [20, 21, 23] Figure 2.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 26 of 32 Figure 3 shows ZZ Mode timing waveform. [24, 25] Figure 3. ZZ Mode Timing Switching W aveforms (continued) t ZZ I SUPPLY.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 27 of 32 Ordering Information Not all of the speed, package and temper ature ranges are avail able. Please c ontact your local sales representative or visit www .cypress.com for actual products of fered.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 28 of 32 Package Diagrams Figure 4. 100-Pin Thin Plastic Quad Fl atpack (14 x 20 x 1.4 mm), 51-8 5050 NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 29 of 32 Figure 5. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85165 Package Diagrams (continued) A 1 PIN 1 CORNER 17.00±0.10 15.00±0.10 7.00 1.00 Ø0.45±0.05(165X) Ø0.25 M C A B Ø0.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 30 of 32 © Cypress Semico nductor Corpor ation, 2002- 2007. The inform ation contai ned herein is sub ject to change wi thout notice.
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 31 of 32 Document History Page Document Title: CY7C1471V33/CY7C1473V 33/CY7C1475V33, 72-Mb it (2M x 36/4M x 18/1 M x 72) Flow-Throug h SRAM with NoBL™ Architecture Document Number: 38-05288 REV .
CY7C1471V33 CY7C1473V33 CY7C1475V33 Document #: 38-05288 Rev . *J Page 32 of 32 *I 4723 35 See ECN VKN Corrected the typo in the p in configuration for 209-Ball FBGA pi nout (Corrected the ba ll name for H9 to V SS from V SSQ ). Added the Maximum Rating for Supply V oltage on V DDQ Relative to GND.
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