Gebruiksaanwijzing /service van het product 16500B van de fabrikant HP (Hewlett-Packard)
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Errata Title & Document Type: Manual Part Number: Revision Date: HP References in this Manual This manual may contain references to HP or Hewlett - Packard. Please note that Hewlett - Packard's former test and measurement, semiconductor products an d chemical analysis businesses are now part of Agilent Technologies.
Servic e Gu ide Publicati o n numbe r 165 00-9 701 1 First edi tio n, August 19 94 For Safe ty inform atio n, Warrant ies, and Reg ulato ry informati on, see the pages at the end of the book. Copyri ght Hewlet t-Pack ard Company 1987 – 1 994 All Right s Re served.
HP 1 6500B/1 6 501 A Log ic Ana lysis S ystem The HP 1 6500 B i s the main frame of th e Log ic A naly sis S yste m, and th e HP 16501 A is the ex pansio n frame. The HP 16500B/ 1650 1A is of modular stru ctur e using plu g-in card s wi th a wide range of data acquisiti on and stimu lus capabi litie s.
The H P 16 500B L ogic Ana lysi s S ys tem iii.
In This Book This book is the service guide for the H P 16500 B/1 6501 A Logi c Analysis Syst em and is divided into e ight chapte rs. Chapter 1 contains informat io n about the instrument and i nclud.
Cont ents 1 Genera l Informa tion Accessori es 1–2 Specificatio ns 1– 3 Characterist ics 1– 3 Recommende d Test Equipme nt 1 – 6 2 Preparing for Use To inspect the lo gic anal ysis sys tem 2.
6 Replacing Asse mblies To remove and repl ace t he Optio nal mo dules or fille r panels 6–3 Covers 6 –4 Flexib le disk drive 6–5 Power supply 6–6 Rear fan 6–8 Side fan 6–9 HP 165 00L i nt.
1 Accessori es 1– 2 Specificatio ns 1– 3 Characterist ics 1– 3 Recommende d Test Equipme nt 1 – 6 Gene ral Information.
Gen era l Info r mation This chap ter lists the accesso ries , the specification s and characteris tics , and the reco mmende d te st e quipmen t. Access ories The follo wing acce ssories are suppl ied wi th the H P 165 00B/1 6501A Lo gic Analys is Sy stem.
Specification s The specificat ions are t he pe rformance st andards against which t he pro duct is t ested. There are no specificat ions for the HP 1 6500 B o r the H P 16501A. Character istics These characteristi cs are not specifications, but are included as additional informat ion.
Time Interval Accuracy Between Modu les Equal s t he sum of the channel-t o-channel time interval accuracies of each module used in the measurement , for a deske wed measurement . Time Correlati on Resolution 2 ns ( 5 00 MH z) . Opera ting Environme nt Tem pe ratu re Instru men t 0 ° C t o 50 ° C (+ 32 ° F to 1 22 ° F).
Dimen si ons Refer to the followi ng figure for dimensio nal detail. Dimens i onal Det ai l Genera l Inf orma tion Cha ract eri s tics 1–5.
Recom mended T est Equipment Equipme nt Re qui red Equip ment Critical Spe cifica tions Recommend ed Model / Par t Use * Osc illoscop e 100 M Hz B andwidt h HP 5 4600 A T Voltmet er HP 347 8A T RS-23 .
2 To inspect the lo gic anal ysis sys tem 2–2 To apply po wer 2– 3 To operat e t he use r interface 2–3 To set the line volt age 2–4 To degauss the display 2–5 To clean t he lo gic analysi s.
Pre pari ng For Use This chap ter g ives you in str uctio ns for p rep arin g th e l ogic analy sis s yste m for u se. Powe r Re qu irem ents The lo gic an alys is system main frame requires a p ower so urce of ei ther 115 Vac or 23 0 Vac, –22 % to +10 %, sing le phase, 48 to 66 Hz, 475 W maximum power.
2 Check the sup plied ac cessori es. Accessori es supplied with the log ic analysis syst em are liste d in "Access orie s" in chapter 1. 3 Inspe ct th e product for physica l damage. Check the lo gic analysis sys tem and t he suppl ied acce ssories for o bvious physi cal o r mechanical defe cts.
To set the line voltage When shipped from HP, the line voltag e selector is set and an appropri ate fuse is installed for operating the instrument in the country of destinat ion. To operat e t he instrument from a power so urce o ther than t he o ne set, perfo rm the fo llo wing steps .
To degauss the display • If the mainfra me has be en subjec te d to strong magn etic field s, the C RT might beco me magn etized an d displa y data might bec ome distorted . To corre ct this cond itio n, deg auss the CRT with a c onven tion al, exter nal -telev ision -typ e deg aussin g co il.
To in stall m odules The following steps give general instruct ions for installing modules into the mainframe or the expansio n frame of the system. CA UT ION El ectrosta tic discharge can damage electroni c components . Use grounded wris tstra ps and mats when perf ormi ng any s ervice to modul es.
To in stall the HP 16500L interface mod ule The HP 16500L interface module is required to connect t he HP 16501A Expansio n Frame to the H P 1650 0B m ainframe. WA RNI NG Haz ardous voltages exi st on the power supply , the CRT, and the C RT driver board of the HP 16500 B mainframe.
5 Slide the inter fa ce mod ule into the main frame thro ug h the slo t i n the rear pan el. 6 Install the scr ews co nnectin g the i n terface mo dule to the mai nframe .
To connect the HP 16501A Expansion Frame The HP 1 6 501A Expansio n Frame includes an interface cabl e and re qui res an H P 16500 L interface module to connect to the H P 16500B mainframe. To install the expans ion frame, you need to install the inte rface module into the mainframe, then connect the cable from the module to the expansio n frame.
To co nnect an external monit or The following tab les define the signal available for external monito rs at t he HP 16500L connecto r and pin numb ers. HP 16 5 00L O utput Sign al F or Ext erna l M oni tor s Horizont al def lection ( f h) 25.0 k Hz Vertica l de flec tion (fv) 5 9.
3 To perform the power-up tests 3 –3 To perform the self-tes ts 3–4 Testing Performance.
Testi ng Perfor mance To ensure the logic analys is sy stem is o perating correctly, you can perform software tests (s elf-tests ) on the sy stem. Dire ction s for pe rformin g th e s oftware te sts are give n i n this chap ter.
To per f or m t he powe r - up tes ts The logic analysis syste m automat ically performs power- up tests when you apply power to the instrument . T he revision number of the boot ROM shows in t he upper-right corner of the screen during thes e power-up tests.
To p erform the self-tests The s elf-tests ver ify th e cor rect oper ation of th e lo gic an alys is sy stem. Sel f-tests can be pe rformed all at once or one at a time. While testin g the p erfor mance of the logi c anal ysis sys tem, ru n the self-tes ts all at once.
5 Install a formatted d i sk that is not write protected i nto the flexib le d isk dr ive. Conn ect an RS- 232C loopb ack conne ctor onto the RS- 232C port. 6 Select All System Tests . You can run all tests at one time b y running All System Tests. To s e e more detail s about each test, yo u can run each test individually.
3– 6.
4 To prepare t he ins trume nt 4 – 3 To access t he test patterns 4–4 To adjust geo met ry 4–5 To adjust focus, landing , and co nvergence 4–6 To adjust white balance 4–13 Calibrating and Ad.
Cal ibra ting an d Adj usting This chap ter normall y gives you instru ction s for calibrati ng and adjusting the logic anal ysi s sys tem. Becaus e the HP 16500B/ 16501A req uires no calib ration , only adj ust ment i nstructi ons are in clud ed .
To p repare the instr ument 1 Remove the rear feet and the cove rs from the mainframe. 2 Before startin g the adjustmen t s, mark the position whe re the p oten tiometer s are set. This helps i n ret urning t he adj ustm ents to their o rigi nal po sitions if i t beco mes neces sary t o restart the procedure .
To access t he test patterns Some procedures on the follo wing pages ask you to access test patterns. This pro cedure tel ls you how to access the m and ho w t o exit the t est . 1 In the Sys tem C onfigu ratio n menu, touc h C onfig uration, then select Test in the po p- up me nu .
To ad just geo metry 1 Displ ay the white cr oss-ha tc h test patt ern on the CRT. From the Colo r Displ ay Test menu, select the white, cross- hatch patter n. 2 Preset the fro nt panel brigh tness con trol , the top of the two control s to the left of the displa y, maximu m clo ckw ise.
To ad just f ocus, landin g, and convergence Once you have started, you will have to do all three of the procedures in this group: the focus, the landing , and t he co nverge nce adjustme nts. Initial Preparati on 1 Loosen the deflectio n yoke clamp scre w.
Landin g Ad ju stmen t 1 Tur n the front pan el BRIGHTNES S contro l full y clockw ise. 2 Degauss the CRT by momentari ly pres sing the D E GAUS S switch located on the instru men t re ar pa nel . In some cases, the user’s enviro nment or shipping environment may have caused high levels o f magnetizat ion in the CRT.
8 Mov e the deflectio n yoke for war d u n til the entire ra s ter i s green . Landing adjustment is easier if the y oke is moved all t he way forward and then moved back until t he rast er i s co mplet ely green.
Static Co nverg enc e 1 Temp ora rily disco nn ect the powe r from the in str umen t. 2 Re move th e PC b o ard shiel d cover fro m the rear of the Co lor CRT Modu le by p ryi ng eve nly o n all four sides. 3 Re app ly p ow er. 4 Displ ay the white, cro s s-hatch test patter n on the CRT.
D yna mic Co nver g enc e 1 Displ ay the white, cro s s-hatch test patter n on the CRT. From the Colo r Displ ay Test menu, select the white, cross- hatch test pattern. 2 Adjust Y BOW ( RV80 5) located on the bottom PC boar d to elimina te red, gre en, and blue bow ing at the top and bot tom of the cen ter ver tical li ne.
4 Adjust V TOP ( RV80 1) and V BOTTOM (RV802) to obtai n coincide nce o f th e red, blue, an d green at the intersectio n of the top and b o ttom horizon tal lin es with the cen ter ver tical line. The VTOP a n d VBOTTOM adjustmen t s ar e located o n the bot tom PC b oard .
5 Adju st H.AMP (R V807) l oca ted on the bot tom PC b o ard for equal amo unt s of misco nve rgen ce at the right an d left sides of the screen. 6 Adju st H. TILT (RV8 06) lo cated on the botto m PC board for coi nci dence o f red, gre en, and blue at the right an d left s i des of the screen.
To ad just w hite balance 1 Pro vid e a blank d ispl ay on the CR T. From the Colo r Displ ay Test menu, select a blank ( colo rles s) raster. 2 Preset the fro nt panel brigh tness and co n trast contr ols to thei r mechani cal ce nters. 3 On the bottom PC b oard, set the following adju stment s to their mech anical center s.
4– 14.
5 To use t he flo wcharts 5–2 To check t he power-up self- tests 5–18 To run the self-tests 5–19 To check t he vi deo signal s 5–22 To check the po wer s upply L EDs 5 –23 To test the po wer.
Trou ble shootin g This chap ter help s you troublesh oot the logi c analysi s sys tem to fin d defective assembl ies . T he trou ble shootin g co ns ists of flo wcharts, s elf-test in stru ction s, and tes ts. Th is infor mation is not inte nded fo r compone nt-leve l repair .
Mai n Tro ubl es hoot i ng F lo wchar t 1 Troubles hoo ting To use t he f lo wc hart s 5–3.
Mai n Tro ubl es hoot i ng F lo wchar t 2 Note: The HP 16 500L is in the Sys t em Configura tion menu if "Mas ter F rame" is i n a blue field a nd "Ethe rnet " is in the Communicatio ns field .
Col or Mo dul e Tr oubl es hoo ting Fl owcha rt 3 Troubles hoo ting To use t he f lo wc hart s 5–5.
Col or Mo dul e Tr oubl es hoo ting Fl owcha rt 3A ( cont i nue d) Troubles ho otin g To use the fl owchar ts 5– 6.
Pow er- Up Tr oubl es hoo ting F low cha rt 4 Troubles hoo ting To use t he f lo wc hart s 5–7.
Syst em St art Tr oub lesho ot ing Fl ow ch art 5 Troubles ho otin g To use the fl owchar ts 5– 8.
Mai nframe T est s T rou blesh oot ing Fl owc har t 6 Troubles hoo ting To use t he f lo wc hart s 5–9.
Pow er Sup ply Tr oubl es hoo ting F low cha rt 7 Troubles ho otin g To use the fl owchar ts 5– 10.
HI L T r ou b le s ho ot in g Fl ow ch art 8 Troubles hoo ting To use t he f lo wc hart s 5– 11.
Flex ib le D is k Dr iv e Tr oubl es hoo ting F low cha rt 9 Troubles ho otin g To use the fl owchar ts 5– 12.
H ard Dis k Dr ive Tr oub le s ho oti ng F lo wch art 10 Troubles hoo ting To use t he f lo wc hart s 5– 13.
RS- 23 2C Trou bl esh oot ing Fl ow c har t 1 1 Troubles ho otin g To use the fl owchar ts 5– 14.
Int ermo dule Tr oubl es hoo ting Fl ow cha rt 12 Troubles hoo ting To use t he f lo wc hart s 5– 15.
Expans io n Fr ame Tr oubl eshoo ting F low chart 13 Troubles ho otin g To use the fl owchar ts 5– 16.
Ext er nal M oni tor Tr ouble sho ot in g Fl owc h art 14 Note: Co mpare the spec ifica tion s o f the monitor again st th e spec ifica tion s o f the video sig nal as a wa y to det ermin e compat ibility ( abilit y to synch). Video signa l sp ecif icat ions are lis ted in " To connec t an ex ter nal monitor " in chap ter 2.
To ch eck t he power-up s elf -tests The logic analysis syste m automat ically performs power- up self-te sts when you apply power to the ins trume nt. The revi sion numb er o f the o perati ng sy stem sho ws i n the upper-ri ght corner of the screen during these power-up t ests.
To run the self-tests Self-tes ts identify the correct operatio n of major, functional subsy stems of the instrume nt. You can run all sel f-te sts wit hout access ing t he i nterior o f t he ins trume nt. If a s elf-test fail s, the tro ub lesho oting flowchart s instruct yo u to chang e a part o f the inst rument .
5 Select ROM Test. The ROM Test screen i s displayed . You can run all tests at one time b y running All System Tests. To s e e more detail s about ea ch test, you can run each test individual ly. This exam ple shows how to run an individual test . 6 Select Run, then select Singl e.
7 To e x it t he ROM Test, select Done. N o te t h at the status chan ges to Pass e d o r Failed. 8 Install a formatted disk that is not write-p rotec ted into the flexible disk d riv e. Conn ect an RS- 232C loopb ack conne ctor o nto the R S-232C port.
To ch eck the vide o sign als Refer to chapte r 6, "Replacing A ssem blies, " fo r inst ructi ons on how t o re move or replace covers and as semb li es. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board.
To ch eck the p ower supply LEDs Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board.
To ch eck the p ower supp ly voltages Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board.
To t est th e flex ible disk drive voltages Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board.
5 Check for the fol lowin g volta ges and signa ls u sing an oscillo scop e. Disk D ri ve Volt age s Pi n Si gnal Descript ion Pi n Si gnal Descript ion Pi n Signal Descr ip tion 1 NC 13 Ground 24 Wri.
To t est the hard disk d rive voltages Refer to chapte r 6, "Repl acing A ssem blies, " fo r inst ructi ons to remo ve or replace co vers and asse mb lies. WA RNI NG Haz ard vol tage s exist on the powe r s upply, t he CRT, and the CRT driver board.
Disk D ri ve Volt age s Pi n Signal Descr ip tion Pi n Signal Des c r ip tion Pin Signal Descr ip tion 1 Reset 15 Data 29 +5 V 2 Gro und 16 Dat a 30 Ground 3 Data 1 7 Data 31 I n terrupt Requ est 4 Da.
To t est th e exp ansion frame in terface This procedure is used during troublesho ot ing to i so late a failed i nterface component, the interface cab le , the ex pansi on fram e int erface card, or the HP 1650 0L.
Test th e Ex pansio n Interface Card 1 Gro und the osc illo scop e probe to the metal portio n of the frame nea r the rea r panel of the expa nsio n frame and check for TTL acti vity on the foll owing p ins.
3 Remove the pr o be ground from the frame , a n d reat tach the pro be ground to the metal portio n of the e xpansio n frame n ear th e front panel. 4 Pro be th e fo llo win g pi ns. • U1 pins 2 thro ugh 9 • U2 pins 2 thro ugh 9 • U3 pins 5 thro ugh 9 If all of the signal lin es show TTL activ ity, then go to the next step .
Test th e Main frame CPU B o ard 1 Remove power from t h e HP 16500 B syst em and unplug the p ower cords f r om b oth the mai nframe and the exp an si on frame. 2 Reinstall the botto m cove r on th e expan sion fra me. Set the main frame on its sid e with the strap handle faci ng up, then r emov e the b ot tom cov er.
6 To remove and repl ace t he Optio nal m odules o r fill er panels 6- 3 Covers 6–4 Flexib le disk drive 6 –5 Power supply 6–6 Rear fan 6–8 Side fan 6 –9 HP 16500L inte rface module 6–10 H.
Rep lacing Assemblie s This chap ter contain s the instru ction s for removi ng and replacin g the asse mblie s of the log ic analys is system. A lso in this chap ter are instr uctio ns for r etur ning assembl ies. WA RNI NG Haz ardous voltages exi st on the power supply , the CRT, and the C RT driver board.
To remo ve and replace o ption al modules or filler pan els 1 To reconfigu re yo ur system later i n t his pro ced ure, note the confi guration of your syst em. Some modules for the Logic Analysis System req uire calibratio n if you move them to a different s lot.
To remo ve and replace the co vers There are four outside covers on the H P 16500 B and on the HP 1650 1A, a t op cover, a bot tom cover, and t wo side covers . When removing the covers, note where the shiel ding b raid is l ocated. If the shie lding brai d separates from the covers , reinstal l i t when replacing the covers.
To remo ve and replace the f lexible disk drive HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover 2 Remove the two disk drive mo u nti ng screws. 3 Slide th e flexi ble d isk drive assembly tow ard the rear panel until the assembly is out of the ins tru men t.
To remo ve and replace the p ower supp ly WA RNI NG Haz ardous voltages exi st on the power supply . To avoid el ect rica l shock, disconnect the power from the i nstrume nt before perf ormi ng the fol lowing procedures .
Re placing A ssemb lies To remov e a nd re pla ce t he po wer s uppl y 6–7.
To remo ve and replace t he rear fan HP 16500B and HP 16501A 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover 2 Remove th e rear fan shroud moun ting scr ews. 3 Remove the comp lete rear fan assemb ly from the rear p ane l of t he in strumen t.
To remo ve and replace the side fan HP 16500B and HP 16501A 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover and side cover 2 Remove the four side fan mo unting scre ws. 3 Re ach th rough the top of the i nstrume nt and disco nnect the fan p ow er ca ble , then remo ve the fan .
To remo ve and replace the HP 16500L int erface mo dule HP 16500B and HP 1650 0L 1 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover 2 If y o ur system inclu des an e.
7 If y o ur system includes an e xpansio n frame, c o nnect the interface cable from the expan sion frame to the HP 165 00L i nterfac e module l oca ted in the HP 16500 B main frame. In order t o e nsure co rrect conne ctio n o f the int erface cab le, t he 6 8-pin "D " co nnect ors on t he cable are asymmet ric in shape.
To remo ve and replace the h ard disk drive HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top and bott om covers • HP 16500L inte rface module 2 Re ach ing i n from the top of the ins trumen t, re move the four scr ews conn ectin g the ha rd disk dr ive to the brac ket.
To remo ve and replace t he micropr ocessor boar d ( CPU) HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top cover and left, rear foot • All opt ional mo dules and fil ler pane ls 2 Disco nnect the cables from the micro processor boa rd.
To remo ve and replace a SIMM mem ory HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Microproces sor (CPU ) board 2 Hol d the release tab s away fro m the SIMM (sing le inline memor y mod ule ), then pull the mo dule ou t.
To remo ve and replace the ex pansion interface board HP 165 01A 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Botto m co ver • All opt ional mo dules and fil ler pane ls.
To remo ve and replace the m other board HP 165 00B 1 Using p rev ious p roced ure s, remo ve the followin g assembl ies: • Top and bott om covers • Power supply • Microproces sor boa rd • All opt ional mo dules and fil ler pane ls 2 Set the frame so that the b o ttom of the frame is facing up.
Re placing A ssemb lies To remov e an d rep lac e th e mot her board 6– 17.
To remo ve and replace the f ront-panel board HP 165 00B 1 Remove the t op trim fro m th e front frame. 2 Disco nnect the two c abl es from the fron t-pa nel boa rd. One cable is connect ed to the color display assemb ly and one cable i s co nnected to the mother board.
To remo ve and replace the co lor display assembly HP 165 00B The color display assemb ly replaceme nt procedure consi sts of three sections: Removing the assem bly from the mainframe. Transferring parts to t he replacement ass embly. Installing the asse mb ly in the mainfram e.
Transferring parts to th e repl acement assembly The purpose of this procedure is to transfe r the mechanical parts from the o ld assembly to the replacement asse mb ly. 1 Re move th e rear mo unting b rac ket from the r ear sup port bra cke t. Remo ve the rear sup port brac ket from the c olor display assembly.
Install ing the replacem en t colo r display assem bly 1 Ca reful ly slid e the color d ispl ay assembl y most o f the way into the mainfra me. To preven t damag e to t he cab les, make sure that they c lear th e mainfr ame. 2 Conn ect the co lor disp lay to p ow er sup ply c abl e to the powe r supp ly.
To return assemblies Before shi pping t he l ogic analys is syst em o r ass emblie s t o Hewlett -Packard, cont act your nearest Hewl ett -Packard sales offi ce for addit ional det ails. 1 Wr ite the foll owing i nfor mation on a tag and attac h it to t h e part to b e returne d .
7 Replaceabl e Parts Ordering 7–2 Replaceabl e Parts Lis t 7–3 HP 1650 0B E xpl oded View and Replaceab le Part s 7–4 HP 16501A Explode d View and Replaceable Parts 7–9 Replac e a ble Pa rts.
Rep lac ea ble Pa rts This chap ter contain s infor mati on for iden tifyin g and orde rin g replace able par ts for you r l ogic analy sis s yste m. Replaceable Parts Ordering Parts listed To order a.
Replaceable Parts Lis t Descri ption The replaceab le part s list is organi zed b y reference de signat ion. The exploded vi ew does not show all of the parts in the replaceable parts list.
HP 16500B Exp loded View and Replaceable Parts Explo ded v iew o f t he HP 1 6500 B Ext ernal Par t s Replaceab le Part s HP 16 5 00B Ex plo ded Vi ew and Repl acea ble Part s 7– 4.
HP 16 5 0 0B Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Exchang e Ass embl ies A2 16500- 69 512 Front -pane l circuit b oar d (exch ange ) A3 16500- 6950 9 Microp rocess or b oar.
Explo ded Vi ew of t he HP 165 00 B Replaceab le Part s HP 16 5 00B Ex plo ded Vi ew and Repl acea ble Part s 7– 6.
HP 16 5 0 0B Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Int ern al P art s A1 16500-66 501 1 Mother boar d ass embly A3 16500-66 509 1 Microp rocessor boar d ass embly A4 0950-21.
HP 16 5 0 0B Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description W6 1 6 500-61 606 1 Cab le - power sup ply to color mo dule W8 1 6 500- 6161 1 1 Cable - hard driv e (4 0 co nd) W9 1 6 50.
HP 16501A Exp loded View and Replaceable Parts Explo ded v iew o f the HP 165 01A Replaceab le Part s HP 1 650 1A E xpl oded View an d Repl ace able Part s 7–9.
HP 16 5 0 1A Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Exchang e Ass embl ies A4 16500-69 50 0 Power supply as se mbly ( exc hange) Ext er nal Par ts F1 21 10 -0 01 0 F1 21 10 -.
HP 16 5 0 1A Re p lac eabl e Par ts Ref . Des. HP Part Number QTY Description Int ern al P art s H1 0515-0372 19 Screw M3 X 0.5 8M M-LG H2 0 5 15-043 3 1 2 Screw M 4 X 0.8 15MM-L G H3 0 5 15-043 5 6 Screw M 4 X 0.7 14MM -LG H4 0 5 15-066 4 2 Screw M 3 X 0.
7– 12.
8 Block-Level The ory 8–3 The HP 1650 0B Log ic Anal ysis Syst em 8–3 The Microproce ssor Board 8–6 The Powe r-Up R outi ne 8–9 The Powe r-Up Screen 8–9 Power- Up Se lf-Test s 8–10 Power- .
The ory of Op era tion This chap ter te lls the the ory of op eratio n for the log ic an alys is system an d des crib es the se lf -tests . T he informat i on in this chapter is to help you u nders tand h ow the logic analys is system operate s a n d what th e s elf-tes ts ar e testin g.
Bloc k-Le v e l Theory The b lock-le vel th eor y is d ivid ed into two parts : theory for th e l ogic analy s is s yste m and theory for the micr oproces sor bo ard.
System Ov erview Theory HP 165 00B The HP 16500B is the mainframe for the Logi c Analysis Syst em. Micro processor B o ard The micropro cesso r b oard contains all the interface circuit ry for managing data flow betwee n the mainframe components and the opt ional boards .
HP 165 01A The HP 16501A is the e x pansion frame for the Logi c Analysis System. The expansion fram e component s i nclude t he fo llowing: • Expansio n Interface Bo a rd • Interface Cab le • Mother Bo a rd • Power Supply To connect the expansion frame to the mainframe, you must install an HP 1 6 500L inte rface module into the mainframe.
The Microproces sor Board The M i cropr oces so r Board The ory of Op erat io n The Mi crop roce ssor Bo ard 8– 6.
Micro processor B o ard T heo ry The microprocesso r board cont ains the system memo ry, all of the interfaces for the mainframe peri pherals, the int ermodule b us moni tor, and t he o pti on bo ard module i nterface .
HIL Interface The Hewlett -Packard Human Interface Link ( HP-HIL ) is the interface b etwe en t he microproce ssor and t he H P 16500B front panel. In t he write mode , the int erface cont roll er serializ es the 8-bit data and t ransmits the data to t he devices on the link.
The P owe r-Up Routine When powe r is appli ed to the HP 1 6500 B Logic Analy sis Syste m main frame, a se ries of tasks called the power-u p routi ne is per formed to initial ize and to verify operatio n of th e mainfr a me. T he mai nframe mon itor rep orts th e p rogr ess an d status of th e power-up ro utin e.
Power-Up S elf-Tests All of the power-up self tests are performe d to verify the operati on of the H P 16500B mainframe. If any o f the se lf-t ests fail , then t he po wer-up ro uti ne is halted and t he F ATAL ERRORS EN CO UNTERED , BOO T HALTED m essag e appears .
Initi alizi ng and Cali bratin g Mo dules The install ed mo dules are i niti alized and stored cal ibratio n fact ors are uplo aded fro m eithe r the disk drive or module NV-RAM into sys tem RAM. The configurat ion menu of the module using the calibrat ion facto rs will show if the calibrati on factors have bee n successfully l o aded.
The S ystem Configuration M enu When t he po wer-up routi ne is com plet e and t he HP 165 00B is operat ional, t he Sy stem Configurati on menu is displayed. The names of the installe d modules appear in fields on the left si de o f the displ ay. The fiel ds co rrespo nd to t he sl ot int o whi ch the mo dule i s install ed.
Self-Te sts De scri ption The s elf-tests iden tify th e cor rect oper ation of th e major sub-s yste ms in th e HP 16500B Logic An alys is System mainframe.
RAM T est The RAM T est perform s an abbreviat ed read/writ e test at various memory locatio ns. The t est returns a pass o r fail mess age. F or RAM Test failures, first you can suspect a faulty SIMM module, then you can suspect a faulty microproce ssor board.
Correlator T est The correlat or t est verifies that the int ermo dule b us tim e co rrelat or o n t he mi croprocesso r board i s funct ioning pro perly. If t he co rrelat or is funct io ning, then inte rmodul e measurement s can be t i me-correlat ed to withi n 2 ns.
RAM T est This test checks t he mainframe RAM on the microprocessor board. The t est performs a non-dest ructive patt ern wri te/read at eve ry locati on. The ini tial RAM co ntents are res tor ed after the test. For RAM Test failures, first y o u can suspect a faulty SIMM module, then you can suspect a fault y mi cropro cesso r board.
Poss ible pro blems causing a fail ed message in e ithe r the flex ible disk drive or hard disk drive include the fol lowi ng: • A damaged o r dis connect ed di sk drive cab le. • Wrong disk formatt ing or no disk formatt ing. • The disk write- protect tab set to the write -prot ect position.
HP-IB The Hewl ett-Packard Interface Bus (HP-IB) i s Hewlett-Packard ’s i mplemen tation of IEE E Stand ard 488 -1978, "Standard Dig ital In terface for Prog ramm ing Instrumen tation ." HP-IB i s a carefully defined i n terface that simpli fies the inte gratio n of vari ous in str umen ts an d compu ters in to s yste ms.
RS-2 32C The lo gic an alys is sy stem i nter faces wi th R S-23 2C communication lines throug h a stan dar d 25 pin D connecto r. The logic analys is sys tem is compatibl e with R S-232 C protocol .
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