Gebruiksaanwijzing /service van het product mPGA604 van de fabrikant Intel
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R Document Number: 25423 9-002 mPGA604 Socket Mechanical Design Guide March 2005.
R 2 mPGA604 Socket Mechanical Design Guid e INFORMATION IN TH IS DOCUMEN T IS PROVIDED IN CON NECTION WITH IN TEL ® PRODUCTS. NO LICENSE, EXPRESS OR IM PLIED, BY ESTOPPEL OR OTHERWISE, TO AN Y INTELLECT UAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
R mPGA604 Socket 3 Mechanical Design Guid e Contents 1 Introduc tion ................................................................................................................... .... 7 1.1 Objective .............................................
R 4 mPGA604 Socket Mechanical Design Guid e 5.2 Solvent Resistance .............................................................................................. 28 5.3 Durab ility ......................................................................
R mPGA604 Socket 5 Mechanical Design Guid e Revision History Revision Number Description Date 001 • Initial release of the document. October 2003 002 • Updated for 2005 Intel ® Xeon™ p roducts. March 2005 Note: Not all revisions may be published.
R 6 mPGA604 Socket Mechanical Design Guid e Re-Validation Notice to Socket Vendors Any significant change to the socket will require submission of a detailed explanation of the chang e at least 60 days prior to the planned implementatio n.
R mPGA604 Socket 7 Mechanical Design Guid e 1 Introduction 1.1 Objective This docum ent defines a surface m ount, Zer o Insertion Force (ZIF) socket inte nded for w orkstation and server plat forms based o n Intel m icroprocessors. The socket provi des I/O, power and ground contacts.
Introduction R 8 mPGA604 Socket Mechanical Design Guid e.
R mPGA604 Socket 9 Mechanical Design Guid e 2 Assembled Component and Package Description The mPGA604 socket dim ensions an d characteri stics must be compatible with that of the processor package and related assem bly compone nts.
Assembled Component and Package Description R 10 mPGA604 Socket Mechanical Design Guid e.
R mPGA604 Socket 11 Mechanical Design Guid e 3 Mechanical Requirements 3.1 Attachment A retention system needs to is olate any load in excess of 222.41 N , compressive, from the soc ket during the shock an d vibration cond itions outlined in Section 5 .
Mechanical Requirements R 12 mPGA604 Socket Mechanical Design Guid e 3.5 Markings All markings required in this section must be able to withstand a temperature of 240 ºC for 40 seconds (minim um) typical of a refl ow profil e for so lder material used on the socket, as well as any environmental test procedure outlined in Secti on 5 .
R Mechanical Requirements mPGA604 Socket 13 Mechanical Design Guid e 3.7 Socket/Package Translation During Actuation The socket shall be built so that the post-actuated pac kage pin fi eld displacement will not exceed 1.27 mm. Movement will be alo ng the Y direction.
Mechanical Requirements R 14 mPGA604 Socket Mechanical Design Guid e CFCs and HF Cs shall not be used i n manufact uring the s ocket. It is rec omme nded that any pl astic component exceeding 25g must be recyclable as per the Europea n Blue Angel recycling desi gn guidelines.
R Mechanical Requirements mPGA604 Socket 15 Mechanical Design Guid e maintain Critical Process Parameters controlling th ese CTFs or will provide direct measurements to meet ongoing quality requ irements.
Mechanical Requirements R 16 mPGA604 Socket Mechanical Design Guid e.
R mPGA604 Socket 17 Mechanical Design Guid e 4 Electrical Requirements Socket electrical requirements are m easured from the socked-seating plane of the processo r test vehicle (PTV) to the com ponent side of the socket PCB to which it is attached.
Electrical Requirements R 18 mPGA604 Socket Mechanical Design Guid e Table 4-2. Definitions (Sheet 2 of 2) 4 Maximum Average Contact Resistance. Refer to Table 4-1 , Item 4 The max average resistance target is originally derived from max resistance of each chain minus resistance of shorting bars divided by number of pins in the daisy chain.
R Electrical Requirements mPGA604 Socket 19 Mechanical Design Guid e Figure 4-3 shows the re sistance test fixtures separate ly and superimposed. The upper figure is the package. The next figure is t he baseboard. There ar e 48 daisy chain configura tions on resistance test board.
Electrical Requirements R 20 mPGA604 Socket Mechanical Design Guid e.
R Electrical Requirements mPGA604 Socket 21 Mechanical Design Guid e Table 4-3. Resistance Test Fixture Netlist (She et 1 of 2) DC Endpoints Edgefingers: Hi Edgefingers: Low Daisy Chain # of © per ch.
Electrical Requirements R 22 mPGA604 Socket Mechanical Design Guid e Table 4-3. Resistance Test Fixture Netlist (She et 2 of 2) DC Endpoints Edgefingers: Hi Edgefingers: Low Daisy Chain # of © per ch.
R Electrical Requirements mPGA604 Socket 23 Mechanical Design Guid e 4.3 Inductance The bottom fixture for t he inductan ce measurement is a ground plane on the seco ndary side of the motherboard with all pins grounded. The com ponent side of t he socket PC B does not co ntain a plane.
Electrical Requirements R 24 mPGA604 Socket Mechanical Design Guid e 4.3.1 Design Procedure for Inductance Measurements The measurement equipment required to perform the validatio n is: • Equipment - HP8753D Vect or Networ k Analyzer or equiva lent.
R Electrical Requirements mPGA604 Socket 25 Mechanical Design Guid e 4.3.2 Correlation of Measurement and Model Data Inductance To correlate the measurement and m odel data for loop i nductance, one u.
Electrical Requirements R 26 mPGA604 Socket Mechanical Design Guid e Table 4-4. Net list for FSETV4 Rev 1 Edge Fingers Edge Fingers +I: A61 Jumpers: -I: A145 A85-A89 A45-A17 A135-A141 A59-A57 A129-A13.
R mPGA604 Socket 27 Mechanical Design Guid e 5 Environmental Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following environmental reference points. The reliability targets in this section are based on the expected field use environment for a desktop product.
Environmental Requirements R 28 mPGA604 Socket Mechanical Design Guid e 5.1 Mixed Flowing Gas Test will be defined in a future revision of this document. 5.2 Solvent Resistance Requireme nt: No dam age to ink m arkings i f applicable . EIA 36 4-11A 5.
R mPGA604 Socket 29 Mechanical Design Guid e 6 Validation Testing Requirements This section of the docum ent outlines the tests that m ust be successf ully completed in order for the supplier’s socket to p ass the design guidelines valid ations. It provides the test plan and procedure required for validation .
Validation Testing Requirements R 30 mPGA604 Socket Mechanical Design Guid e Typical examples of sign ificant changes include, but are not limited to , the following: Plastic material changes including base ma terial or color; cont act c hanges including base m aterial, plating material or t hickness; an d design m odificati ons.
R mPGA604 Socket 31 Mechanical Design Guid e 7 Safety Requirements Design, including materials, shall be consistent with the manufacture of units that meet the following safety standards: • UL 1950 most current ed itions. • CSA 950 most current edition.
Safety Requirements R 32 mPGA604 Socket Mechanical Design Guid e.
R mPGA604 Socket 33 Mechanical Design Guid e 8 Documentation Requirements The socket supp lier shall provide Intel with the following docu mentation: • Multi-Line Coupled SPICE models for socket. • Product design guidelines in corporating the requirements of these design guidelines.
Documentation Requirem ents R 34 mPGA604 Socket Mechanical Design Guid e.
R mPGA604 Socket 35 Mechanical Design Guid e 9 Mechanical Drawings These drawings refer t o the mPGA604 socket. Note: Intel re serves the right to make cha nges and m odificati ons to the de sign as necessary. Note: Figures m ay not be to scale. Figure 9-1.
Mechanical Drawing s R 36 mPGA604 Socket Mechanical Design Guid e Figure 9-2. mPGA604 Socket Dra wing (Sheet 2 of 4).
R Mechanical Drawing s mPGA604 Socket 37 Mechanical Design Guid e Figure 9-3. mPGA604 Socket Dra wing (Sheet 3 of 4).
Mechanical Drawing s R 38 mPGA604 Socket Mechanical Design Guid e Figure 9-4. mPGA604 Socket Dra wing (Sheet 4 of 4).
R Mechanical Drawing s mPGA604 Socket 39 Mechanical Design Guid e Figure 9-5. 603-Pin Interposer Assembly Drawing (Sheet 1 of 6).
Mechanical Drawing s R 40 mPGA604 Socket Mechanical Design Guid e Figure 9-6. 603-Pin Interposer Assembly Drawing (Sheet 2 of 6).
R Mechanical Drawing s mPGA604 Socket 41 Mechanical Design Guid e Figure 9-7. 603-Pin Interposer Assembly Drawing (Sheet 3 of 6).
Mechanical Drawing s R 42 mPGA604 Socket Mechanical Design Guid e Figure 9-8. 603-Pin Interposer Assembly Drawing OLGA Keepout (She et 4 of 6).
R Mechanical Drawing s mPGA604 Socket 43 Mechanical Design Guid e Figure 9-9. 603-Pin Interposer Assembly Drawing FCBGA2 Keepout (Sheet 5 of 6).
Mechanical Drawing s R 44 mPGA604 Socket Mechanical Design Guid e Figure 9-10. 603-Pin Interposer Assembly Drawing (Sheet 6 of 6) §.
R Mechanical Drawing s mPGA604 Socket 45 Mechanical Design Guid e.
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