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Machine T ypes: 1043, 1044, 4010, and 4011 ThinkSer v er RD230 Hardw are Maintenance Manual.
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ThinkS erv e r R D2 30 T yp e s 1 043 , 1 044, 40 1 0 , an d 40 1 1 Hard w a re Mai ntena n c e M a n ua l.
Note Before using this information and the pr oduct it supports, read the general information in Appendix C, “Notices,” on page 127 and the Warranty and Support Information document on the ThinkServer Documentation DVD. First Edition (June 2010) © Copyright Lenovo 2010.
Contents Chapter 1. About this manual ..... 1 Important Safety Information ......... 1 Safety statements ............. 2 Important information about replacing RoHS compliant FRUs ............. 7 Chapter 2. General information ..... 9 Features ........
Appendix A. RAID battery card assembly ............. 1 2 1 Specifications ............. 1 2 1 Battery life and data retention time ..... 1 2 1 Appendix B. Getting help and technical assistance ........ 1 2 3 Before you call ............. 1 2 3 Using the documentation .
Chapter 1. About this manual This Hardware Maintenance Manual contains information to help you solve pr oblems that might occur in your server . It describes the diagnostic tools that come with the server , err or codes and suggested actions, and instructions for r eplacing failing components.
Safety statements Important: Each caution and danger statement in this document is labeled with a number . This number is used to cr oss refer ence an English-language caution or danger statement with translated versions of the caution or danger statement in the Safety Information document.
Statement 1: DANGER Electrical current from power , telephone, and communication cables is hazardous. T o avoid a shock hazard: v Do not connect or disconnect any cables or perform installation, maintenance, or reconfiguration of this product during an electrical storm.
Statement 2: CAUTION: When replacing the lithium battery , use only Part Number 33F8354 or an equivalent type battery recommended by the manufacturer . If your system has a module containing a lithium battery , replace it only with the same module type made by the same manufacturer .
Statement 3: CAUTION: When laser products (such as CD-ROMs, DVD drives, fiber optic devices, or transmitters) are installed, note the following: v Do not remove the covers. Removing the covers of the laser product could result in exposure to hazardous laser radiation.
Statement 4: ≥ 18 kg (39.7 lb) ≥ 32 kg (70.5 lb) ≥ 55 kg (121.2 lb) CAUTION: Use safe practices when lifting. Statement 5: CAUTION: The power control button on the device and the power switch on the power supply do not turn off the electrical current supplied to the device.
Statement 8: CAUTION: Never remove the cover on a power supply or any part that has the following label attached. Hazardous voltage, current, and energy levels are present inside any component that has this label attached. There are no serviceable parts inside these components.
Lenovo plans to transition to RoHS compliance well before the implementation date and expects its suppliers to be ready to support Lenovo’s r equirements and schedule in the EU.
Chapter 2. General information This chapter provides general information that applies to all machine types supported by this publication. Features The RD230 server offers the following featur es and technologies: v Microprocessor(s) The server supports up to two Intel ® Xeon ® dual-core, quad-cor e, or hex-core micropr ocessors.
commands to control the server power , view system information, and identify the server . Y ou can also save one or more commands as a text file and run the file as a script.
T able 1. Features and specifications (continued) RAID controllers: v Onboard SA T A Softwar e RAID v ThinkServer 8708ELP SAS RAID adapter Electrical input Input voltage: Low range: Minimum: 100 V ac Maximum: 127 V ac Input frequency range: 50 to 60 Hz High range: Minimum: 200 V ac Maximum: 240 V ac Input frequency range: 50 to 60 Hz Notes: 1.
v Automatic memory downsizing on error detection v Automatic restart on non-maskable interr upt (NMI) v A vailability of microcode level v Built-in, menu-driven setup, system configuration, and RAID c.
Chapter 3. Diagnostics This chapter describes the diagnostic tools that are available to help you solve problems that might occur in the server . If you cannot diagnose and correct a pr oblem by using the information in this chapter , see Appendix B, “Getting help and technical assistance,” on page 123 for more information.
v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, RD230 T ypes 1043, 1044, .
v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, RD230 T ypes 1043, 1044, .
Keyboard, mouse, or pointing-device problems v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved.
Memory problems v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, RD230 T y.
Microprocessor problems v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, R.
Monitor problems Some monitors have their own self-tests. If you suspect a problem with your monitor , see the documentation that comes with the monitor for instructions for testing and adjusting the monitor . v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved.
v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, RD230 T ypes 1043, 1044, .
Power problems v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, RD230 T yp.
v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, RD230 T ypes 1043, 1044, .
Software problems v Follow the suggested actions in the order in which they are listed in the Action column until the problem is solved. v See the parts listing in Chapter 6, “Parts listing, RD230 T.
3. Remove the adapters and disconnect the cables and power cords to all internal and external devices until the server is at the minimum configuration that is requir ed for the server to start (see “Solving undetermined problems” on page 25 for the minimum configuration).
Solving undetermined problems If the diagnostic tests did not diagnose the failure or if the server is inoperative, use the information in this section. If you suspect that a software pr oblem is causing failures (continuous or intermittent), see “Software pr oblems” on page 23.
v System-event log: This log contains all the POST and system management interrupt (SMI) events. Y ou can view the system-event log through the Setup Utility program and thr ough the as the IPMI event log.
Diagnostic LEDs on the front control panel Identifying the diagnostic LEDs on the front contr ol panel is a very important method for diagnosing server problems. See “Fr ont control panel” on page 30 for detailed information. Onboard debug digitron The onboard debug digitr on helps trained service technicians to identify server problems.
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Chapter 4. Locating parts, controls, LEDs, and connectors This chapter provides information to help you locate your server parts, contr ols, light-emitting diodes (LEDs), and connectors. Note: The illustrations in this document might differ slightly fr om your model.
Front control panel This section provides information about the fr ont control panel of the server . Figure 3 helps you identify the connectors, controls, and LEDs on the fr ont control panel of your server .
T able 4. Hard disk drive LEDs for the onboard SA T A and onboard SA T A software RAID configurations Description Hard disk drive LED 1 (Green) Hard disk drive LED 2 (Amber) Hard disk drive is not pr esent. Off Off Hard disk drive is pr esent but is not active.
Locating server components Figure 4 shows the locations of the major components in your server . 1 Left handle of the chassis 6 Heat sink assembly and micropr ocessor(s) underneath 2 Slim optical drive 7 System fans 3 PCI card 8 Right handle of the chassis 4 Memory modules 9 Mounting points for the 3.
1 Memory slot (CPU1 DIMM CHA1) 13 SA T A connector 1 2 Memory slot (CPU1 DIMM CHA0) 14 SA T A connector 2 3 Memory slot (CPU1 DIMM CHB0) 15 SA T A connector 3 4.
1 J47 (system fan 1 connector) 6 J19 (front USB connector) 2 J48 (system fan 2 connector) 7 J35 (for front contr ol cable) 3 J50 (system fan 3 connector) 8 JP1 (cle.
Locating connectors on the backplane Figure 7 shows the connector locations on the backplane. 1 Power connector 2 3 Optical drive power connector 2 Power connector 1 4 Mini SAS signal connector Figure 7. Backplane connector locations Chapter 4.
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Chapter 5. Installing, removing, or replacing hardware This chapter provides instr uctions on how to install, remove, or r eplace hardwar e for your server . FRU replacements ar e to be done only by trained service technicians. This chapter does not contain the removal or r eplacement procedure for all FRUs.
v Before you install optional har dware devices, make sure that the server is working correctly . If the server is not working correctly , refer to Chapter 3, “Diagnostics,” on page 13 for your server for detailed diagnostic information. T o obtain the publication, go to: http://www .
v Do not remove any air duct or air baf fles while the server is running. Operating the server without the air duct or air baffles might cause the micr oprocessor to overheat. v The second micropr ocessor socket always contains either a microprocessor socket cover or a micropr ocessor .
v Use only approved tools and test equipment. Some hand tools have handles that are cover ed with a soft material that does not provide insulation from live electrical currents. v Regularly inspect and maintain your electrical hand tools for safe operational condition.
The server supports hot-swap devices and is designed to operate safely while it is turned on and the cover is removed. Follow these guidelines when you work inside the server with the power on: v A void wearing loose-fitting clothing on your forearms.
Removing the server cover Attention Do not open your server or attempt any repair befor e reading and understanding the Safety Information and the Warranty and Support Information on the ThinkServer Documentation DVD that comes with your product, and “Guidelines” on page 37.
Installing, removing, or replacing optional hardware devices This section provides instr uctions on how to install, remove, or r eplace optional hardwar e devices for your server .
T able 9. DIMM installation rules when two microprocessors (CPU0 and CPU1) are installed (continued) DIMM slot T wo DIMMs Four DIMMs Six DIMMs Eight DIMMs CPU0 DIMM CHC0 X, 5 X, 5 CPU1 DIMM CHA1 X, 8 .
5. T ouch the static-protective package that contains the new memory module to any unpainted metal surface on the outside of the server . Then, remove the new memory module from the package.
T o remove a memory module, do the following: 1. Remove all media from the drives and turn of f all attached devices and the server . Then, disconnect all power cords from electrical outlets and disconnect all cables that are connected to the server .
v Go to http://www .lenovo.com/thinkserver and click the Options tab for a list of supported options. Removing the optical drive Attention Do not open your server or attempt any repair befor e reading.
7. Remove the optical drive retention tab by r emoving the two screws that secure the tab. Save the retention tab to use when you install a new optical drive. 8. If you are instr ucted to return the r emoved optical drive, follow all packaging instructions and use any packaging materials that ar e supplied to you for shipping.
CAUTION: When laser products (such as CD-ROMs, DVD drives, fiber optic devices, or transmitters) are installed, note the following: v Do not remove the covers. Removing the covers of the laser product could result in exposure to hazardous laser radiation.
4. Install the two screws to secur e the retention tab to the rear of the new optical drive. Then, connect the signal cable 1 and the power cable 2 to the rear of the new optical drive.
5. Route the cables through the drive bay hole in the fr ont and then slide the optical drive into the drive bay until it snaps into position. 6. Connect the power cable to the optical drive power connector on the backplane. See “Locating connectors on the backplane” on page 35.
1. Rotate the drive tray handle 2 of the hard disk drive tray assembly 1 to the open position. Then, grasp the handle and pull the drive tray assembly with the hard disk drive out of the bay . 2. Remove the screws that secur e the hard disk drive in the tray .
3. If you are instr ucted to return the r emoved hard disk drive, follow all packaging instructions and use any packaging materials that ar e supplied to you for shipping. 4. T o complete the removal procedur e, go to “Completing the parts replacement” on page 87.
1. Rotate the drive tray handle 2 of the hard disk drive tray assembly 1 to the open position. Then, grasp the handle and pull the drive tray assembly out of the bay . 2. Remove the screws that secur e the plastic filler and then remove the plastic filler .
3. T ouch the static-protective package that contains the new hard disk drive to any unpainted metal surface on the server . Then, remove the hard disk drive from the package and place it on a static-pr otective surface. 4. Make sure that the drive tray handle is in the open position.
continuously , it indicates that the drive is faulty and must be replaced; if the green har d disk drive activity LED is flashing, this indicates that the drive is being accessed. Note: If the server is configured for RAID operation using a RAID contr oller , you might have to reconfigur e the disk arrays after you replace hard disk drives.
5. Press the riser car d (might having a PCI card installed) down into the appropriate PCI car d slot on the system board. Then, close the retention tab to secure the PCI car d (installed on the riser card) and then install the fastening screw to secur e the riser card in place.
This section provides instr uctions on how to remove the riser car d with a PCI card installed. T o remove the riser card, do the following: Note: Use any documentation that comes with the riser card and follow those instructions in addition to the instructions in this section.
5. Remove the fastening screw that secur es the riser card ( 1 ) and lift the riser card straight up by its edges to r emove it ( 2 ). 6. T o complete the removal procedur e, go to “Completing the parts replacement” on page 87.
1. Remove all media from the drives and turn of f all attached devices and the server . Then, disconnect all power cords from electrical outlets and disconnect all cables that are connected to the server . 2. Remove the server cover . See “Removing the server cover” on page 42.
5. Remove the PCI card fr om the PCI card slot on the riser card. 6. T o complete the removal procedur e, go to “Completing the parts replacement” on page 87. If you are instr ucted to return the PCI car d, follow all packaging instructions and use any packaging materials that are supplied to you for shipping.
6. If you are instr ucted to return the Ethernet car d, follow all packaging instructions and use any packaging materials that ar e supplied to you for shipping. 7. T o complete the removal procedur e, go to “Completing the parts replacement” on page 87.
Installing, removing, or replacing hardware devices This section provides instr uctions on how to install, remove, or r eplace hardwar e devices for your server .
This section provides instr uctions on how to install the system board battery . Be sure to consider the following information when you r eplace the battery in the server: v Y ou must replace the battery with a lithium battery of the same type from the same manufacturer .
Removing the RAID controller Attention Do not open your server or attempt any repair befor e reading and understanding the Safety Information and the Warranty and Support Information on the ThinkServer Documentation DVD that comes with your product, and “Guidelines” on page 37.
This section provides instr uctions on how to install the ThinkServer 8708ELP SAS RAID adapter (hereafter r eferred to as the RAID controller within this section).
Attention: v When attaching the battery card assembly to a PCI Expr ess slot, center the Phillips-head screw driver to avoid damaging the scr ew head and do not over-tighten the scr ews as you might damage the battery card assembly .
e. Carefully pr ess the battery card assembly onto the RAID controller so that the two connectors are firmly joined. Then, secur e the battery card assembly to the RAID controller with the thr ee screws and the standoffs that come with the battery card assembly accessory kit.
Removing or installing the heat sink assembly This section provides instr uctions on how to remove or install the heat sink assembly . Removing the heat sink assembly Attention Do not open your server.
3. Remove the eight screws that secur e the heat sink assembly ( 1 - 8 ) and gently lift out the heat sink assembly . 1 - 8 Screws 9 Air flow 10 Indicates the front of the chassis 4.
CAUTION: The heat sink and microprocessor might be very hot. T urn off the server and wait three to five minutes to let the server cool before removing the server cover . T o install the heat sink assembly , do the following: 1. Remove all media from the drives and turn of f all attached devices and the server .
Removing or installing the microprocessor This section provides instr uctions on how to remove or install the micr oprocessor . Removing the microprocessor Attention Do not open your server or attempt.
5. If you are instr ucted to return the micr oprocessor , follow all packaging instructions and use any packaging materials that ar e supplied to you for shipping. 6. T o complete the removal procedur e, go to “Completing the parts replacement” on page 87.
4. Press down and push the small handle outwar d on the microprocessor socket to lift the handle to the open position. 5. Gently press the r etainer of the microprocessor socket to open it. 6. Remove the protective cover fr om the microprocessor socket.
7. Remove the new micropr ocessor from the protective cover that pr otects the gold contacts on the bottom of the new micropr ocessor . 8. Hold the new micropr ocessor by the edges and align the notches 1 on it with the tabs 2 in the micropr ocessor socket.
3. Remove the heat sink assembly . See “Removing the heat sink assembly” on page 69. 4. Disconnect the system fan cables on the system board. See Figur e 6 on page 34. 5. Carefully lift the system fan straight up to r emove it out of the server . Then, place it on a static-protective surface.
4. Carefully put the system fans into the server . Mind the seven ports 1 that secure the system fans. Align the holes in the system fans with the corresponding ports on the server . 5. Connect the system fan cables to the corresponding connectors on the system board in the numerical or der following the illustration below .
Removing the power supply Attention Do not open your server or attempt any repair befor e reading and understanding the Safety Information and the Warranty and Support Information on the ThinkServer Documentation DVD that comes with your product, and “Guidelines” on page 37.
3. Remove the four screws ( 1 and 2 ) that secur e the power supply . Figure 41. Removing the screws that secure the power supply Chapter 5.
4. Disconnect power supply cables 3 , 4 , and 5 from the system boar d. Then, disconnect power supply cables 1 and 2 from the backplane. 5. Disconnect the power supply cables from any other car ds or devices. Note: The power supply cables are integrated parts of the power supply .
DANGER Hazardous moving parts. Keep fingers and other body parts away . Statement 8: CAUTION: Never remove the cover on a power supply or any part that has the following label attached. Hazardous voltage, current, and energy levels are present inside any component that has this label attached.
3. Carefully place the power supply into the server by aligning the scr ew holes in the power supply with the corresponding holes in the chassis. Then, install the four screws 1 and 2 to secur e the power supply in place.
4. Connect the power supply cables to the system board connectors 3 , 4 , and 5 , and to the backplane connectors 1 and 2 . 5. Connect the power supply cables to any other cards or devices. 6. T o complete the installation, go to “Completing the parts replacement” on page 87.
2. Remove the server cover . See “Removing the server cover” on page 42. 3. Remove any adapter cards installed in the PCI car d slots. See “Removing a PCI card” on page 60. 4. Remove the heat sink assembly and a memory module. See “Removing the heat sink assembly” on page 69 and “Removing a memory module” on page 45.
c. Align the notches 1 of the micropr ocessor socket cover with the alignment keys 2 of the micropr ocessor socket. Lower the socket cover straight down into the micropr ocessor socket on the system board. Note: Y our microprocessor socket and cover might look slightly dif ferent from the illustration.
Installing the system board Attention Do not open your server or attempt any repair befor e reading and understanding the Safety Information and the Warranty and Support Information on the ThinkServer Documentation DVD that comes with your product, and “Guidelines” on page 37.
4. Install the heat sink assembly and a memory module. See “Installing the heat sink assembly” on page 70 and “Installing a memory module” on page 44. 5. Install the adapter cards in the PCI slots. See “Installing a PCI car d” on page 59. 6.
respond to r equests to the service processor , such as a remote request to turn on the server . The power-on LED flashes to indicate that the server is connected to an ac power source but is not turned on.
1 2 The server can be turned off in any of the following ways: v Y ou can turn off the server from the operating system, if your operating system supports this feature. After an orderly shutdown of the operating system, the server will turn off automatically .
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Chapter 6. Parts listing, RD230 T ypes 1043, 1044, 4010, and 401 1 The following replaceable components ar e available for the ThinkServer RD230 T ypes 1043, 1044, 4010, and 401 1 servers. T o check for an updated parts listing on the W eb, complete the following steps: 1.
Replaceable server components Replaceable components are of thr ee types: v Self-service customer replaceable unit (CRU): Replacement of self-service CRUs is your responsibility . If Lenovo installs a self-service CRU at your request, you will be charged for the installation.
T able 10. Parts listing, T ypes 1043 (continued) Index Description CRU part number (T ier 1) CRU part number (T ier 2) FRU part number 5 Micropr ocessor , Intel Xeon E5507 - Quad Core 2.
T able 1 1. Parts listing, T ypes 1044 (continued) Index Description CRU part number (T ier 1) CRU part number (T ier 2) FRU part number 3 Memory DIMM, 4GB DDR3 RDIMM 1333MHz (models CTO) 46U3443 3 Memory DIMM, 8GB DDR3-1333 RDIMM (models CTO) 46U3419 4 Heat sink (models CTO All Models) 46U3460 5 Micropr ocessor , Intel Xeon E5503 - Dual Core 2.
T able 1 1. Parts listing, T ypes 1044 (continued) Index Description CRU part number (T ier 1) CRU part number (T ier 2) FRU part number GT20 slim type ODD SA T A cable (models CTO All Models) 46U3461.
T able 12. Parts listing, T ypes 4010 (continued) Index Description CRU part number (T ier 1) CRU part number (T ier 2) FRU part number 5 Micropr ocessor , Intel Xeon E5630 - Quad Core 2.53GHz - 5.86QPI, 12MB Cache, DDR3-1066, 80W (models CTO) 71Y9047 5 Micropr ocessor , Intel Xeon E5620 - Quad Core 2.
T able 13. Parts listing, T ypes 401 1 Index Description CRU part number (T ier 1) CRU part number (T ier 2) FRU part number 1 Optical drive, DVD burner/CD-R W SA T A (models CTO All Models) 46U3353 2.
T able 13. Parts listing, T ypes 401 1 (continued) Index Description CRU part number (T ier 1) CRU part number (T ier 2) FRU part number 9 Hard disk drive, 1TB SA T A - Enterprise 7200 rpm, 3 Gb/s, 32MB cache, 3.5 ″ (models CTO) 46U3103 9 Hard disk drive, 300GB SAS - 15000 rpm, 6Gb/s, 32MB cache, 3.
For units intended to be operated at 230 volts (outside the U.S.): Use a cord set with a grounding-type attachment plug. The cor d set should have the appropriate safety approvals for the country in which the equipment will be installed. Lenovo power cords for a specific country or r egion are usually available only in that country or region.
T able 14. Power cords, T ype 1043 Lenovo Power cord part number Used in these countries and regions 41R3184 US (models CTO) 41R3256 China (models CTO) 41R3270 Brazil (models CTO) 41R3176 LA High V ol.
T able 16. Power cords, T ype 4010 (continued) Lenovo Power cord part number Used in these countries and regions 41R3176 LA High V olt (APU) (models CTO) 41R3260 Korea (models CT O) 41R3224 UK, Irelan.
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Chapter 7. Configuring the server The following configuration programs come with the server: v Setup Utility program The Setup Utility program is part of the server firmwar e. Y ou can use the Setup Utility program to view your server configuration, change the startup device sequence, set the date and time, and set passwords.
Starting the Setup Utility program T o start the Setup Utility program, do the following: 1. Approximately thr ee minutes after the server is connected to a working electrical outlet, the power button becomes active. T urn on the server and the POST runs automatically .
T able 20. Items under the Main menu Item Option Description AMIBIOS V iew the BIOS version and creation date information. Processor V iew microprocessor information. System Memory V iew memory capacity information. System T ime HH:MM:SS Set system time.
T able 22. Submenus under the CPU Configuration (continued) Item Option Description MPS and ACPI MADT ordering Legacy ordering [Modern ordering] Select the MPS and ACPI MADT ordering method. Intel ® V irtualization T ech Disabled [Enabled] Enable or disable the Intel V irtualization T ech.
T able 22. Submenus under the CPU Configuration (continued) Item Option Description ACPI T State Disabled [Enabled] Enable or disable the micropr ocessor throttling in ACPI. Notes: 1. The settings i n[]a r et h e default settings in the Setup Utility program.
T able 25. Submenus under the USB Configuration (continued) Item Option Description Emulation T ype [Auto] Floppy Forced FDD Hard Disk CDROM Select the type of the USB device.
T able 27. Submenus under the IPMI 2.0 Configuration Item Sub-item Option Description V iew BMC System Event Log V iew the system event log. Clear BMC System Event Log Delete the system event log. Set LAN Configuration Set the IP addr ess source, IP address, subnet mask, and gateway address.
T able 30. Items under the PCIPnP menu (continued) Item Option Description Boots Graphic Adapter Priority [Auto] Onboard VGA If this option is set to Auto , the external graphics card will be enabled firstly . If no external graphics card, the integrated graphics controller is automatically enabled.
T able 31. Items under the Boot menu (continued) Item Sub-item Option Description Hard Disk Drives 1st Drive 2nd Drive ... Based on the installed hard disk drives. CD/DVD Drives 1st Drive... Based on the installed optical drives. Note: The settings i n[]a r et h e default settings in the Setup Utility program.
Exiting the Setup Utility program After you finish viewing or changing settings, press Esc to r eturn to the Setup Utility program main menu. Y ou might have to press Esc several times. Then, you can do one of the following: v If you want to save the new settings and exit the Setup Utility program, pr ess F10.
RAID controllers The following table lists the various utilities available to configure RAID controllers befor e an operating system is installed. T able 34.
Using the ThinkServer EasyStartup program The EasyStartup DVD simplifies the process of configuring your RAID contr ollers and installing an operating system. The program works in conjunction with your W indows or Linux operating-system installation disc to automate the process of installing the operating systems and associated device drivers.
After agreeing to the license agr eement, you will be given the following choices: v Continue to the main program interface v Use a shortcut to install an operating system based a response file that y.
v Partitions options: This task enables you to choose whether you want to repartition the selected drive or use an existing partition. v Partition settings: This task enables you to choose the file system type and define the partition size.
2. Follow the instructions on the scr een to configure the SA T A RAID. When working with this program, you must use the keyboar d. The keys used to perform various tasks are displayed at the bottom of each scr een.
100BASE-TX, or 1000BASE-T) and duplex mode (full-duplex or half-duplex) of the network and automatically operates at that rate and mode. Y ou do not have to set any jumpers or configure the controllers. However , you must install a device driver to enable the operating system to address the controllers.
Note: After updating the BIOS, all the BIOS settings become the default settings of the updated BIOS version. Y ou need to check and reconfigur e the BIOS settings for your specific needs.
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Appendix A. RAID battery card assembly Specifications The following table provides specifications of the RAID battery car d assembly . Battery technology LiON Battery operating temperature (ambient) v.
v Capacity of the battery pack and the battery load v Ambient temperature v Age of the battery v Numbers of discharge cycles the battery has been thr ough v DRAM (dynamic random access memory) size 12.
Appendix B. Getting help and technical assistance If you need help, service, or technical assistance or just want more information about Lenovo products, you will find a wide variety of sour ces available from Lenovo to assist you.
Calling for service During the warranty period, you can get help and information by telephone through the Customer Support Center . These services are available during the warranty period: v Problem d.
Service methods and procedur es vary by country , and some services might not be available in all countries. International W arranty Service is delivered through the method of service (such as depot, carry-in, or on-site service) that is provided in the servicing country .
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Appendix C. Notices Lenovo may not offer the pr oducts, services, or features discussed in this document in all countries. Consult your local Lenovo repr esentative for information on the products and services curr ently available in your area.
vary significantly . Some measurements may have been made on development-level systems and there is no guarantee that these measur ements will be the same on generally available systems. Furthermore, some measur ements may have been estimated through extrapolation.
Product recycling and disposal This unit must be recycled or discar ded according to applicable local and national regulations. Lenovo encourages owners of information technology (IT) equipment to responsibly r ecycle their equipment when it is no longer needed.
In accordance with the Eur opean WEEE Directive, electrical and electronic equipment (EEE) is to be collected separately and to be reused, r ecycled, or recover ed at end of life.
Compliance with Republic of T urkey Directive on the Restriction of Hazardous Substances Meets requir ements of the Republic of T urkey Directive on the Restriction of the Use of Certain Hazardous Substances In Electrical and Electr onic Equipment (EEE).
Notice: This mark applies only to countries within the European Union (EU). Batteries or packaging for batteries are labeled in accor dance with European Directive 2006/66/EC concerning batteries and accumulators and waste batteries and accumulators.
Das Produkt ist nicht für den Einsatz an Bildschirmarbeitsplätzen im Sinn e§2d e r Bildschirmarbeitsveror dnung geeignet. Electronic emission notices Federal Communications Commission (FCC) statement Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
This product has been tested and found to comply with the limits for Class A Information T echnology Equipment according to CISPR 22/European Standar d EN 55022. The limits for Class A equipment were derived for commer cial and industrial environments to pr ovide reasonable protection against interfer ence with licensed communication equipment.
Nach der EN 55022: “Dies ist eine Einrichtung der Klasse A. Diese Einrichtung kann im W ohnbereich Funkstörungen verursachen; in diesem Fall kann vom Betreiber verlangt wer den, angemessene Maßnahmen durchzuführen und dafür aufzukommen.
Korea Class A warning statement 136 ThinkServer RD230 T ypes 1043, 1044, 4010, and 401 1: Hardware Maintenance Manual.
Index A assistance, getting 123 availability 1 1 B backplane locating connectors 35 basic guidelines 37 bays 10 C cables rear connectors 87 Class A electronic emission notice 133 components major 41 c.
logs system-event message 26 M major components 41 memory module installation order 43 installation rules 43 installing 44 removing 45 memory modules specifications 10 memory problems 17 messages syst.
W W eb site compatible options 43 Lenovo support 37, 91 publication ordering 123 support 123 working inside the server with the power on 40 Index 139.
140 ThinkServer RD230 T ypes 1043, 1044, 4010, and 401 1: Hardware Maintenance Manual.
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Printed in USA.
Een belangrijk punt na aankoop van elk apparaat Lenovo RD230 (of zelfs voordat je het koopt) is om de handleiding te lezen. Dit moeten wij doen vanwege een paar simpele redenen:
Als u nog geen Lenovo RD230 heb gekocht dan nu is een goed moment om kennis te maken met de basisgegevens van het product. Eerst kijk dan naar de eerste pagina\'s van de handleiding, die je hierboven vindt. Je moet daar de belangrijkste technische gegevens Lenovo RD230 vinden. Op dit manier kan je controleren of het apparaat aan jouw behoeften voldoet. Op de volgende pagina's van de handleiding Lenovo RD230 leer je over alle kenmerken van het product en krijg je informatie over de werking. De informatie die je over Lenovo RD230 krijgt, zal je zeker helpen om een besluit over de aankoop te nemen.
In een situatie waarin je al een beziter van Lenovo RD230 bent, maar toch heb je de instructies niet gelezen, moet je het doen voor de hierboven beschreven redenen. Je zult dan weten of je goed de alle beschikbare functies heb gebruikt, en of je fouten heb gemaakt die het leven van de Lenovo RD230 kunnen verkorten.
Maar de belangrijkste taak van de handleiding is om de gebruiker bij het oplossen van problemen te helpen met Lenovo RD230 . Bijna altijd, zal je daar het vinden Troubleshooting met de meest voorkomende storingen en defecten #MANUAl# samen met de instructies over hun opplosinge. Zelfs als je zelf niet kan om het probleem op te lossen, zal de instructie je de weg wijzen naar verdere andere procedure, bijv. door contact met de klantenservice of het dichtstbijzijnde servicecentrum.
