Gebruiksaanwijzing /service van het product MZ-B10 van de fabrikant Sony
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SERVICE MANUAL POR T ABLE MINIDISC RECORDER US Model AEP Model T our ist Model SPECIFICA TIONS MZ-B10 US and f oreign patents licensed from Dolby Laboratories. – Continued on ne xt page – Model Name Using Similar Mechanism NEW Mechanism T ype MT -MZN710-177 Optical Pick-up Name LCX-5R V er 1.
2 MZ-B10 CA UTION Use of controls or adjustments or performance of procedures other than those specif ied herein may result in hazardous ra- diation exposure. Notes on chip component replacement •N ev er r euse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be dam- aged by heat.
3 MZ-B10 T ABLE OF CONTENTS 1. SER VICING NO TES ...................................................... 4 2. GENERAL .......................................................................... 5 3. DISASSEMBL Y 3-1. Disassembly Flow ...................
4 MZ-B10 NO TES ON HANDLING THE OPTICAL PICK-UP BLOCK OR B ASE UNIT T he laser diode in the optical pick-up block may suf fer electro- static break-do wn because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body .
5 MZ-B10 SECTION 2 GENERAL Looking at the contr ols Front of the recorder A Display wi ndo w B MENU/ENTE R button Yo u c a n u s e v a r i o u s sett ings using menu items . C SPEED CONTROL +, – butt on Use this b utton to increa se or dec rease the pl ayback s peed.
6 MZ-B10 CASE (LOWER) ASSY CASE (UPPER) ASSY LCD MODULE REC BUTT ON ASSY GEAR (SA), OP SERVICE ASSY (LCX-5R) • In order to remov e set chassis assy and case (spk) assy please remov e MAIN board ,speaker assy , electret condencer microphone and mechanism deck.
7 MZ-B10 Note: Follo w the disassembly procedure in the numerical order given. 3-2. Case (Lower) Assy 3-3. Speaker Assy 4 two tapping screws (B 2.0) 2 two tapping screws (B 2.0) blue white blac k red 1 Remov e the four solderings 3 spk (A) assy 5 spk (B) assy Note: On installation, lower case is made to crawl on a speaker cable.
8 MZ-B10 3-5. Electret Condenser Microphone (MIC901) 3-4. MAIN Board 7 two screws (M 1.4) 9 MAIN board blue white blac k red 1 Remov e the four solderings 2 Remov e the two solderings 4 Remov e the so.
9 MZ-B10 3-6. Set Chassis Assy , Case (Spk) Assy 2 two screws (M 1.4) 3 screw (M 1.4) 4 spring (pop-L) 6 compression spring (ground) 7 spring (limiter) 1 screw (M 1.4) 8 set chassis assy 5 case (spk) ass y 3-7. Case (Upper) Assy 9 torsion spring (pop up) 3 Slide the open slider in the direction of the arrow, and open the case (upper) assy.
10 MZ-B10 3-9. Rec Button Assy 3-8. LCD Module 5 LCD module 1 five screws 2 two screws 6 screw 7 REC button assy 8 two screws 9 knob (open) 4 two claws 3 claw 1 plunger solenoid 9 lever (shaft) 7 tens.
11 MZ-B10 3-10. Mechanism Deck (MT -MZN710-177) 1 Remov e the two soldering s 4 flexible board (optical pick-up) (CN501) 2 flexible board (motor) (CN701) 5 mechanism deck (MT-MZN710-177) 3 two step sc.
12 MZ-B10 3-11. Gear (SA), OP Service Assy (LCX-5R) 4 rack spring 3 screw (M1.4) 1 washer (0.8-2.5) 2 gear (SA) 5 screw (M1.4) 6 thrust detent spring 8 Pull off lead screw. 7 over write head section OP service assy (LCX-5R) 9 Opening the over write head toward the direction A , remove the OP service assy (LCX-5R) toward the direction B .
13 MZ-B10 3-12. Holder Assy 4 holder ass y 3 boss 3 boss 1 convex portion 2 Open the holder assy. 3-13. DC Motor (Sled) (M602) 2 washer (0.8-2.5) 5 DC motor (sled) (M602) 4 two screws (M1.4) 3 gear (SA) 1 Remove six solders of the motor flexible board.
14 MZ-B10 3-14. DC Motor (Over Write Head Up/Down) (M603), DC SSM18B Motor (Spindle) (M601) 9 DC SSM18B motor (spindle) (M601) 8 three tapping screws 2 tapping screw 3 motor cover 6 gear (HA) 4 gear (HB) 5 gear (HC) DC motor (over write head up/down) (M603) 3.
15 MZ-B10 Operation in Setting the T est Mode • When the test mode becomes active, first the display check mode is selected. • Other mode can be selected from the display check mode. •W hen the test mode is set, the LCD repeats the following dis- play .
16 MZ-B10 Configuration of T est Mode Manual Mode Mode to adjust or check the operation of the set by function. Normally , the adjustment in this mode is not ex ecuted. Ho wev er, the Manual mode is used to clear the memor y , power supply adjustment, and laser po wer check before performing automatic adjustments in the Ov erall Adjustment mode.
17 MZ-B10 5. The display changes a shown belo w each time the [DIS- PLAY] key on the remote commander is pressed. Howe ver in the power mode (item number 700’ s), only the item is displayed. 6. Quit the manual mode, and press the x ke y to return to the test mode (display check mode).
18 MZ-B10 • Description of Indication History Histor y code number Description 1 The first error N The last error N1 One error before the last. N2 T wo errors before the last. R_ T otal recor ding time Reset the Err or Display Code After servicing, reset the error display code.
19 MZ-B10 • Cause of Sound Skip Error Cause of error Description of error EIB Sound error correction error Play Stat Decoder status error Adrs Address access error BEmp Buf fer is empty BOvr Buf fer is full, and sounds were dumped Record Bful Buf fer capacity becomes less, and forcible writing occurred Rtry Retry times ov er 4.
20 MZ-B10 2. Press the X key . 3. Press the X ke y once more. 4. Press the x ke y to quit the manual mode, and return to the test mode (display check mode). T emparature Correction • Adjustment Method of T emperature Correction 1. Select the manual mode of the test mode, and set the item num- ber 015 (see page 16).
21 MZ-B10 • Adjustment Method of VC1_LO W (PB) (item number: 741) 1. Connect a digital v oltmeter to the TP1 92 8 (VCO 1) on the MAIN board, and adjust [ SPEED CONTROL +] key (voltage up) or [ SPEED CONTROL - - ] ke y (voltage do wn) so that the voltage becomes 2.
22 MZ-B10 • Adjustment Method of VC1_HIGH (REC) (item number: 742) 1. Connect a digital voltmeter to the TP1928 (VCO1) on the MAIN board, and adjust [ SPEED CONTROL +] ke y (v oltage up) or [SPEED CONTROL - - ] key (v oltage down) so that the v oltage becomes 2.
23 MZ-B10 VREC L ** 751 Set LCD display ** : Adjusted value digital voltmete r TP1620 (VREC) TP1616 (GND) MAIN board • Adjustment Method of REG3_LO W1 (item number: 747) 1.
24 MZ-B10 • Adjustment Method of VREC_MIDDLE (X4 speed) (item number: 752) 1. Connect a digital voltmeter to the TP1620 (VREC) on the MAIN board, and adjust [SPEED CONTROL+] ke y (voltage up) or [SPEED CONTROL - - ] key (v oltage down) so that the v oltage becomes 1.
25 MZ-B10 Adjustment/checking and Connection Location: IC801 IC802 IC501 IC601 IC701 IC901 IC301 IC302 MAIN BOARD (SIDE B) TP1322 TP1323 S804 (GND) 20 20 1 (VREC) (REGO1) (VCO1) (REGO3) (VCOUT) 48 49 .
26 MZ-B10 Po wer Supply Adjustment A uto Item Feed Note: T his mode is av ailable to perform the temperature correction and power supply adjustment without entering the manual mode. • Setting method of power supply adjustment auto item feed mode. 1.
27 MZ-B10 Laser P ower Chec k Note: If result of measurement of the laser po wer does not satisfy the specification, either replace the OP (optical pick-up unit) or check whether the laser circuit block is working correctly .
28 MZ-B10 • Overall Adjustment Mode (Title Display) Note: Adjust the CD first, when performing adjustment. : (Disc mark) At end of power supply adjustment: Outside lit ** : Left side = MO overall adjustment information F* : MO overall adjustment completed 1* : Manual adjustment exists (overall adj.
29 MZ-B10 • CD and MO Overall Adjustment Items 1. CD over all adjustment items Item No. Descr iption 761 VC,VR po wer supply H/L selection 300 HPIT setting . ser vo OFF 561 SLED inward mo vement 562 SLED outward mov ement High reflection electrical offset adjustment 312 Laser ON .
30 MZ-B10 Remuse Clear Perform the Resume clear when all adjustments completed. • Resume Clear Setting Method 1. Select the manual mode of the test mode, and set item number 043 (see page 16). 2. Press the X ke y . 3. Press the x ke y to return to the test mode (display check mode).
31 MZ-B10 8. Press the [SPEED CONTROL +] ke y to set the address value to the next address for adjustment. •K e ys availab le when the cursor is on the address v alue [DISPLAY] ke y on the remote co.
32 MZ-B10 •P atch data list (V .1.300) No . 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 15.
33 MZ-B10 No . 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 2.
34 MZ-B10 No . 345 346 347 348 349 350 351 352 353 354 355 356 357 358 359 360 361 362 363 364 365 366 367 368 369 370 371 372 373 374 375 376 377 378 379 380 381 382 383 384 385 386 387 388 Address v.
MZ-B10 35 35 SECTION 6 DIA GRAMS 6-1. Block Diagram OPTICAL PICK-UP BLOCK LDA FOCUS COIL TRACKING COIL MOTOR/COIL DRIVE IC701 FO2 30 RO2 32 13 11 TRK+ TRK- FCS+ FCS- 28 FI2 RF AMP IC501 11 AVCC2 VREF .
MZ-B10 36 36 Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except f or electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
MZ-B10 37 37 6-3. Printed Wiring Board – MAIN Boar d (Side A) – :Uses unleaded solder . • Semiconductor Location Ref. No . Location D601 H-9 D602 B-12 D606 B-7 D607 B-7 D610 I-9 D611 B-10 IC303 .
MZ-B10 38 38 6-4. Printed Wiring Board – MAIN Boar d (Side B) – :Uses unleaded solder . IC801 IC802 IC501 IC601 IC701 IC901 IC301 IC302 MAIN BOARD (SIDE B) * CSP(Chip Size Package) OVER WRITE HEAD.
MZ-B10 39 39 6-5. Schematic Diagram – MAIN Boar d (1/4) – • See page 36 for W av eforms. • See page 43,44 and 45 f or IC Block Diagr ams. C526 C527 C534 C533 C538 C537 R511 C535 C513 C524 C511.
MZ-B10 40 40 6-6. Schematic Diagram – MAIN Board (2/4) – • See page 36 f or Wa vef or ms. S801 C823 S803 C827 C819 C811 C803 C802 C810 C813 C804 C805 C820 R821 C834 C836 R859 C838 C821 TP1826 TP.
MZ-B10 41 41 6-7. Schematic Diagram – MAIN Boar d (3/4) – • See page 36 for W av eforms. • See page 43 for IC Bloc k Diagrams. R840 C310 C128 C228 Q306 C309 C307 C329 C339 C334 C362 C328 C217 .
MZ-B10 42 42 6-8. Schematic Diagram – MAIN Boar d (4/4) – • See page 36 for Wa vef or ms. • See page 46 f or IC Block Diagrams. L903 L904 C924 C 9 17 L901 L902 C927 C916 C919 S807 S806 FB806 Q.
43 MZ-B10 • IC Block Dia grams IC302 T A2131FL(EL) V REF MT SW BST SW BEEP 19 20 21 22 23 24 18 17 16 15 14 13 PW SW 12 11 10 8 7 BST1 9 BST2 6 5 4 3 2 1 BST AGC PW B PW A ADD TC MT VCC1 INB INA BEE.
44 MZ-B10 IC601 XPC18A22AEPR2 VG VG3 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 54 55 56 1 53 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 24 23 25 26 27 28 VB B.
45 MZ-B10 IC701 SC111258EPR2 14 13 56 55 CPWI2 CPVI2 CPUI2 COM2 RI2 FI2 UI1 PWM1 CPUO1 CPWO1 VG VC 36 37 38 39 40 41 52 51 50 49 48 47 46 45 44 43 42 23 24 25 12 11 10 9 8 7 6 5 4 3 2 1 GND1 OE OE OE .
46 MZ-B10 IC901 SC901580EPR2 1 FFCLR1 2 XWAKE4 3 XWAKE3 4 XWAKE2 5 XWAKE1 6 VRMC 12 VO1 13 L1 14 L1 15 PGND1 16 17 VC1G RF1 VMODE REF2 18 INM1 19 DTC1 20 CRST1 21 XRST1 22 C1L 23 VG 24 LG 25 PGND3 VB .
47 MZ-B10 6-9. IC Pin Function Description • IC801 CXD2680-207GA (SYSTEM CONTROLLER, DIGIT AL SIGNAL PROCESSOR) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 .
48 MZ-B10 Pin No. 51 52 53 54 55 56 57 58 59 60 61 62, 63 64 to 66 67 68 69 70 71 72 73 74 75 76 77 78 to 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 I/O I.
49 MZ-B10 Pin No. 111 112 113 114, 115 116 117 118 119, 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139, 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154, 15.
50 MZ-B10 Pin No. 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195, 196 197 198 199 200 201 202 to 204 205, 206 207 208 209 210 2.
51 MZ-B10 Pin No. 249 250 251 252 253 254 255 256 257 258 259 260 261 262 263 264 265 266 267 268 269 270 271 272 273 274 275 276 277 278 279 280 281 282 283 284 285 286 287 288 289 290 291 292 293 29.
52 MZ-B10 Pin No. 299 300 301, 302 303, 304 305 to 312 I/O — — — — — Pin Name FVDD0 FVSS0 D VDD5, 6 DRAMVDD3, 4 NC Description Power supply terminal (for the b uilt-in flash memory) Ground t.
53 MZ-B10 7-1. Lower Case Section SECTION 7 EXPLODED VIEWS • Items marked “*” are not stocked since the y are seldom required for routine service. Some delay should be anticipated when ordering these items. • Accessories are giv en in the last of the elec- trical parts list.
54 MZ-B10 7-2. Upper Chassis Section Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 51 52 53 54 56 56 56 58 59 60 61 62 63 64 65 66 56 67 69 68 57 51 X-3383-479-1 CASE (UPPE.
55 MZ-B10 7-3. Chassis Section Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 101 102 103 106 107 108 109 110 110 111 112 113 114 115 116 117 118 MIC901 SP901 SP902 not supp.
56 MZ-B10 7-4. Mechanism Dec k Section-1 (MT -MZN710-177//M) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark mechanism deck section-2 (MT -MZN710-177//M) a a 301 not supplie d 31 1 310 308 309 307 305 304 303 302 306 301 X-3381-219-3 HOLDER ASSY 302 3-224-779-02 SPRING, THRUST DETENT 303 3-225-996-01 SCREW (M1.
57 MZ-B10 7-5. Mechanism Deck Section-2 (MT -MZN710-177//M) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark M601 not supplied M603 351 351 364 363 362 361 360 359 352 353 354.
58 MZ-B10 SECTION 8 ELECTRICAL P ARTS LIST Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark NO TE: • Due to standardization, replacements in the parts list may be different from the parts speci- f ied in the diagrams or the components used on the set.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 59 MZ-B10 C602 1-164-943-11 CERAMIC CHIP 0.01uF 10.00% 16V C603 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V C604 1-125-777-11 CERAMIC CHIP 0.1uF 10.00% 10V C606 1-128-964-91 T ANT AL.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 60 MZ-B10 D603 6-500-483-01 DIODE MA22D2800LS0 D605 6-500-483-01 DIODE MA22D2800LS0 D606 8-719-081-35 DIODE MA2YD1700LS0 D607 .
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 61 MZ-B10 R205 1-208-715-11 MET AL CHIP 22K 0.5% 1/16W R206 1-208-927-11 MET AL CHIP 47K 0.5% 1/16W R207 1-208-715-11 MET AL CHIP 22K 0.5% 1/16W R208 1-208-707-11 MET AL CHIP 10K 0.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 62 MZ-B10 R862 1-218-990-11 SHORT CHIP 0 R863 1-218-945-11 RES-CHIP 220 5% 1/16W R864 1-218-985-11 RES-CHIP 470K 5% 1/16W R865.
MZ-B10 63 MEMO.
MZ-B10 REVISION HIST OR Y Clicking the ver sion allows you to jump to the re vised page. Also, clicking the v ersion at the upper right on the re vised page allows you to jump to the ne xt revised page. Ve r. Date Description of Revision 1.0 2003.03 Ne w 1.
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