Gebruiksaanwijzing /service van het product MZ-E90 van de fabrikant Sony
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– 1 – MICROFILM MZ-E60 SERVICE MANUAL POR T ABLE MINIDISC PLA YER SPECIFICA TIONS US Model Canadian Model AEP Model E Model System Audio playing system MiniDisc digital audio system Laser diode properties Material: GaAlAs W avelength: λ = 790 nm Emission duration: continuous Laser output: less than 44.
– 2 – SAFETY-RELA TED COMPONENT W ARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMA TIC DIA GRAMS AND IN THE P ARTS LIST ARE CRITICAL T O SAFE OPERA TION. REPLACE THESE COMPONENTS WITH SONY P AR TS WHOSE P ART NUMBERS APPEAR AS SHO WN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY .
– 3 – 1. SER VICING NO TE ......................................................... 4 2. GENERAL ......................................................................... 5 Playing an MD right away! ................................................
– 4 – 1) When repairing this device with the power on, if you remove the main board or open the upper panel assy , this device stops working. In this case, you can work without the device stopping by fastening the hook of the OPEN/CLOSE switch (MAIN board S809) with tape.
– 5 – SECTION 2 GENERAL This section is extracted from instruction manual..
– 6 –.
– 7 – Note : This set can be disassemble according to the following sequence. SECTION 3 DISASSEMBL Y 3-1. P ANEL ASSY , UPPER 3-2. HOLDER ASSY Note : Follow the disassembly procedure in the numerical order given. Set Panel Assy, Upper Holder Assy Mechanism Deck Service Assy, OP Main Board 4 screws(1.
– 8 – 3-3. MECHANISM DECK 3-4. MAIN BO ARD 7 mechanism dec k 1 sheet (BLIND) 6 CN551 5 CN501 claw 2 screw (MD), step 3 4 3 2 screws(1.7x2.5) 1 screws(1.7x2.5) 4 MAIN board knob (HOLD) S808 S806 S807 knobs (MB) Note : When installing, fit the knobs (HOLD, MB) and the switchs (S806, 807, 808).
– 9 – 3-7. SER VICE ASSY , OP 4 M 1.4 3 M 1.4 1 washer 2 gear (SA ) 5 service assy, OP.
– 10 – • Press and hold down PLA Y MODE to hold the current display while the key is being pressed. 4-2-3. How to release the TEST MODE When method 1 was used: T urn off the power and open the solder bridge on T AP801 on the main board. Note: The solder should be removed clean.
– 11 – Note: In the Power mode, the power adjustment value is only displayed. 4. During each test, press and hold down > N key or . key for a while to move the optical pickup on the sled outer or inner perimeter . 5. T o terminate the Manual mode and return to the TEST MODE, press x key .
– 12 – 5-4. O VERALL ADJUSTMENT MODE 5-4-1. Overall adjustment mode structure Note: The overall adjustments should be always performed in the sequence of CD t MD adjustments. 5-4-2. Overall CD and MO adjustment method 1. Set the TEST MODE (see page 10) and press – key to set the Overall Adjustment mode.
– 13 – 6. If NG in the overall MO adjustments, return to Reset NV and perform the adjustment again. LCD display XXX: NG item No. 7. If OK through the overall MO adjustments, press x key to return to the TEST MODE and terminate the Overall Adjust- ment mode.
– 14 – Pin No. Pin Name I/O Description 1 S MON I S-MON monitor signal input from the µ PD63732GC (IC601) 2 UREG MON I Un-regulator power supply voltage monitor input terminal (A/D input) 3N C — Not used. (open) 4 VREF I Input terminal for power supply voltage adjustment reference voltage (+2 V) (A/D input) 5 DVDD MON I Not used.
– 15 – – 16 – Pin No. Pin Name I/O Description 50 CL V W CON I Spindle servo (W) drive signal input from the BD6602KUT (IC551) 51 DR V VCON O Driver output control terminal to the DB6602KUT (IC551) “L”: prohibited, “H”: permission 52 NC — Not used.
6-2. BLOCK DIA GRAMS 6-2-1. MD BLOCK DIA GRAM – 17 – – 18 – + – + – + – + – + – + – + – + – + – ly lx Jx Jy A A B C D MON Jx Jy Jx lx ly lx ab cd F MINIDISC OPTICAL PICK-UP B.
– 19 – – 20 – MZ-E60 MAIN BOARD ( 2/2 ) VREF MCLK AOUTL AOUTR SINT VCC PE CS SK DO DI 1 2 3 4 8 7 B+ (Q907) EEPROM IC802 XRST S MON PD SSB CLK SSB DATA S0 S1 SLED VOLTAGE MONITOR IC552 FOCUS/T.
MZ-E60 – 21 – – 22 – 1-676-495- 11 MAIN BOARD (SIDE A) C952 C911 C610 C305 C303 C201 C101 C302 L903 C609 C524 L601 L502 C909 R919 R922 D802 OPERA TE R920 R921 R925 R923 R924 R816 R827 R837 R82.
MZ-E60 – 23 – – 24 – C510 R505 R929 C912 R504 R503 R514 R506 R926 R902 R913 C906 R914 R912 R917 C903 C904 L901 C901 D902 C951 C908 IC901 IC902 D901 C907 R928 R915 R203 C203 C103 C307 Q301 Q501.
– 25 – – 26 – 6-3-2. SCHEMA TIC DIA GRAM — MAIN BO ARD (1/4) — • Ref er to page 33 f or IC Block Dia grams. MZ-E60 Note: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
– 27 – 6-3-3. SCHEMA TIC DIA GRAM — MAIN BO ARD (2/4) — • Ref er to pag e 34 f or IC Block Diagrams. – 28 – MZ-E60 (OPEN/CLOSE) Note: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
– 29 – – 30 – 6-3-4. SCHEMA TIC DIA GRAM — MAIN BO ARD (3/4) — • Refer to pa g e 34 for IC Bloc k Dia grams. MZ-E60 TOT AL CURRENT PLA Y : 40mA PAUSE : 36mA FF/REW : 60mA Note: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
6-3-5. SCHEMA TIC DIA GRAM — MAIN BO ARD (4/4) — • Refer to pa g e 35 f or IC Block Diagrams. – 31 – – 32 – MZ-E60 Note: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums.
– 33 – – 34 – IC501 SN761056DBT IC301 T A2131FL IC302 AK4352VT -E2 6-6. IC BLOCK DIA GRAMS CLOCK DIVIDER LPF SERIAL INPUT INTERFACE ∆Σ MODULATOR 8X INTERPOLATOR LPF ∆Σ MODULATOR 8X INTER.
– 35 – IC602 MN41X17400CTT -10T1 IC552 TLC372CPW IC903 S-8328E20MC-EY A-T2 ROW ADDRESS BUFFERS COLUMN ADDRESS BUFFERS 4M ARRAY 4M ARRAY 4M ARRAY 4M ARRAY COLUMN DECODER ROW DECODER I/O BUFFER TIMI.
– 36 – IC551 BD6602KUT PRE-DRIVE PRE-DRIVE PRE-DRIVE PRE-DRIVE DECODER PRE-DRIVE BIAS STANDBY TO EACH BLOCK TO BEMF COMPARATOR + – + – + – VCC2 1 RI3 2 FI1 3 RI1 4 VG 5 H1PG1 6 FO1 7 FO1 8 H.
– 37 – SECTION 7 EXPLODED VIEWS NOTE: • The mechanical parts with no reference number in the exploded views are not supplied. • Items marked “ * ” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
– 38 – 7-2. MECHANISM DECK SECTION (MT -MZE60-169) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 51 1-675-668-11 MOTOR FLEXIBLE BOARD 52 4-963-883-42 SCREW (M1.4), PRECISION P AN 53 X-4951-926-1 CHASSIS ASSY 54 4-222-206-01 SPRING, THRUST 55 4-222-216-01 GEAR (SA) 56 3-338-645-31 WASHER (0.
– 39 – SECTION 8 ELECTRICAL P AR TS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX and -X mean standardized parts, so they may have some difference from the original one.
– 40 – < CONNECTOR > * CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20P CN551 1-784-228-21 CONNECTOR, FFC/FPC (ZIF) 8P < DIODE > D351 8-719-017-58 DIODE MA8068 D352 8-719-056-72 DIODE UDZ-TE-17-2.4B D353 8-719-056-72 DIODE UDZ-TE-17-2.4B D354 8-719-056-80 DIODE UDZ-TE-17-5.
– 41 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R818 1-216-809-11 MET AL CHIP 100 5% 1/16W R819 1-216-853-11 MET AL CHIP 470K 5% 1/16W R821 1-216-857-11 MET AL CHIP 1M 5% 1/16W R822 1-216-845-11 MET AL CHIP 100K 5% 1/16W R823 1-216-864-11 MET AL CHIP 0 5% 1/16W R824 1-218-871-11 MET AL CHIP 10K 0.
– 42 – MZ-E60 Son y Corporation P ersonal A udio Division Compan y 9-927-633-11 2000A0478-1 Printed in Japan C 2000. 1 Pub lished b y General Engineering Dept.
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